Changes in ff33d3f: home

				BOM-DAT/mosfet-dat/mos-n-dat/mos-n-dat.md
			
          @@ -27,6 +27,12 @@ BOOT_EN == LOW, BOOT == LOW, PI_BOOT (nRPIBOOT) == HIGH, USB_SEL == HIGH

           ![](2025-10-26-21-07-09.png)

          +## EOF 

          +

          +FQD3N60CTM - MOSFET N-CH 600V 2.4A DPAK - N-Channel 600 V 2.4A (Tc) 50W (Tc) Surface Mount TO-252AA - 	

          +FQD3N60CTM-WSTR-ND - Tape & Reel (TR)

          +

          +

           ## ref

				Chip-dat/TI-dat/TI-Power-dat/LM317-dat/LM317-dat.md
			
          @@ -4,6 +4,10 @@ partner: [[Inrush-resistor-dat]]

           The LM317 device is an adjustable three-terminal positive-voltage regulator capable of supplying more than 1.5 A over an output-voltage range of 1.25 V to 37 V. I

          +[LM217T-DG](https://www.st.com/content/ccc/resource/technical/document/datasheet/group1/a0/db/e6/9b/6f/9c/45/7b/CD00000455/files/CD00000455.pdf/jcr:content/translations/en.CD00000455.pdf) -  1.2 V to 37 V adjustable voltage regulators

          +

          +

          +LM217, LM317

           ## board

				Circuits-dat/circuits-dat.md
			
          @@ -1,6 +1,9 @@

           # circuits-dat 

          +

          +- [[logic-dat]] - [[logic-gate-dat]] - [[buffer-dat]] - [[logic-level-shifter-dat]]

          +

           - [[74xx-dat]]

           - [[protection-dat]]

          @@ -33,7 +36,6 @@

          -- [[logic-dat]] - [[logic-gate-dat]] - [[buffer-dat]]

           - [[Multivibrator-dat]]

				Circuits-dat/logic-dat/Logic-level-shifter-dat/Logic-level-shifter-dat.md
			
          @@ -71,7 +71,9 @@ Make sure the VCCA ≤VCCB.

           - MAX3372E–MAX3379E/MAX3390E–MAX3393E - ±15kV ESD-Protected, 1μA, 16Mbps, Dual/Quad Low-Voltage Level Translators in UCSP

          +EOF 

          +IP4856CX25 - The device is an SD 3.0-compliant 6-bit bidirectional dual voltage level translator. It is designed to interface between a memory card operating at 1.8 V or 2.9 V signal levels and a host with a fixed nominal supply voltage of 1.7 V to 3.6 V. The device supports SD 3.0, SDR104, SDR50, DDR50, SDR25, SDR12 and SD 2.0 high-speed (50 MHz) and default-speed (25 MHz) modes. The device has an integrated voltage selectable low dropout regulator to supply the card-side I/Os, built-in EMI filters and robust ESD protections (IEC 61000-4-2, level 4).

				Home.md
			
          @@ -43,6 +43,8 @@

           - [[weekly-dat]] - [[2025-july-dat]] - [[2025-May-dat]]

          +- [[info-dat]]

          +

           ## This wiki changes

           - [Latest Changes (Globally)](https://w2.electrodragon.com/gollum/latest_changes)

				PCB-dat/PCB-fix-dat/PCB-fix-dat.md
			
          @@ -1,20 +0,0 @@

          -

          -# PCB-fix-dat

          -

          -## simple fixing 

          -

          -- PCB knife cutter 

          -

          -- [[PSO1060-dat]] == [PCB Trace Cutter Editor Knife](https://www.electrodragon.com/product/pcb-cutterknife/)

          -

          -## mess fixing 

          -

          -- also suitable for single trace editing 

          -- Use a drill to make non-through holes to break PCB traces

          -- fast for large batch fixing 

          -

          -

          -

          -## ref 

          -

          -- [[PCB-dat]]

          \ No newline at end of file

				PCB-dat/PCB-soldering-dat/PCB-soldering-dat.md
			
          @@ -1,65 +0,0 @@

          -# soldering-dat

          -

          -- [[PSO1043-dat]] - [[PSO1038-dat]]

          -

          -- [[PCB-cleaner-dat]]

          -

          -- [[solder-paste-dat]] - [[fab-PCBA-dat]]

          -

          -- [[soldering-tools-dat]]

          -

          -

          -

          -

          -## soldering skills 

          -

          -

          -

          -

          -

          -### soldering chip with pads underneath, such as QFN, BGA, LGA, etc.

          -

          -- [[allwinner-dat]]

          -

          -T113 soldering note: 务必先焊接除T113以外的元器件，烧录51单片机固件，按下面的说明，测量3.3V、1.5V、0.9V全部正常再焊T113，否则若EA3036的FB虚焊将会直接烧坏T113。

          -

          -T113 soldering note (English): Be sure to solder all components except T113 first, program the 51 MCU firmware, and follow the instructions below to measure 3.3V, 1.5V, and 0.9V to ensure they are all normal before soldering T113. Otherwise, if the FB pin of EA3036 is poorly soldered, T113 may be directly damaged.

          -

          -

          -

          -### FPC soldering 

          -

          -- [[FPC-dat]]

          -

          -### alternative temperature-sensitive items soldering

          -

          -

          -> No special solder paste is needed; the key point is not to heat the FPC connector directly—apply heat from the back side of the PCB.

          -> 

          -> **Explanation:**

          -> When soldering temperature-sensitive components like FPC (Flexible Printed Circuit) connectors, you generally do not need to use any special type of solder paste. The most important thing is to avoid applying hot air or direct heat to the FPC connector itself, as it can be easily damaged by high temperatures. 

          -> Instead, use a hot air gun or soldering tool to heat the solder joints from the back side of the PCB. This approach helps protect the delicate connector and ensures a reliable solder joint.

          -

          -

          -

          -## tips 

          -

          -焊接注意事项

          -

          -1. 确保焊接的部位干燥干净无油污无氧化；

          -

          -2. 选择60W或更大功率的电烙铁，保证温度足够高，烙铁头可选尖头或马蹄头等以便传热和焊接（软包电池需要200W起的电烙铁，大单体需要500W起的电烙铁)

          -

          -3. 先加热被焊接部位 (烙铁头紧贴焊接部位几秒钟）再同时快速送锡至焊点，焊接完成；

          -

          -4. 注意：焊接过程烙铁不要离开金属表面，保持加热趁热焊接，锡丝尽量连续不断。

          -

          -## ref 

          -

          -- [[desoldering-dat]]

          -

          -- [[welding-dat]] - [[spot-welding-dat]] - [[PTC-dat]]

          -

          -- [[ICT-testing]]

          -

          -- [[soldering]]

          \ No newline at end of file

				PCB-dat/PCB-soldering-dat/spot-welding-dat/2025-06-13-13-43-52.png
			
          Binary files a/PCB-dat/PCB-soldering-dat/spot-welding-dat/2025-06-13-13-43-52.png and /dev/null differ

				PCB-dat/PCB-soldering-dat/spot-welding-dat/spot-welding-dat.md
			
          @@ -1,13 +0,0 @@

          -

          -# spot-welding-dat

          -

          -![](2025-06-13-13-43-52.png)

          -

          -specifically for [[battery-dat]]

          -

          -

          -## ref 

          -

          -- [[battery-dat]]

          -

          -- [[spot-welding]] - [[soldering]]

          \ No newline at end of file

				PCB-dat/PCB-tools-dat/2025-05-16-14-18-42.png
			
          Binary files a/PCB-dat/PCB-tools-dat/2025-05-16-14-18-42.png and /dev/null differ

				PCB-dat/PCB-tools-dat/PCB-cleaner-dat/PCB-cleaner-dat.md
			
          @@ -1,60 +0,0 @@

          -

          -# PCB-cleaner-dat

          -

          -## PCB-cleaner-dat

          -

          -### Product Usage Instructions

          -

          -Product dimensions and specifications

          -

          -**Ultrasonic Cleaning:** Pour the board cleaner into the ultrasonic cleaner, place the PCB board or workpiece to be cleaned inside, turn on the machine, and clean for 4-6 minutes. Then, ventilate and dry for 5-10 minutes.

          -

          -**Immersion Cleaning:** Pour this product into a container, immerse the PCB board, then use a brush to scrub it clean, and finally air dry.

          -

          -**Spot Cleaning:** Wet a brush or lint-free cloth with this product and directly scrub the oily area. Repeat the scrubbing several times, then air dry.

          -

          -**Brush Cleaning:** Pour out this product, soak a brush or lint-free cloth, and then wipe the item that needs cleaning.

          -

          -

          -## Recommended Eco-Friendly and Cost-Effective PCB Cleaner

          -

          -### ✅ Recommended Product: Isopropyl Alcohol (IPA, concentration ≥ 99%)

          -

          -#### 🔹 Features

          -

          -- **Eco-Friendly:** Evaporates cleanly with no residue; biodegradable

          -- **Low Toxicity:** Safer than strong solvents like acetone or trichloroethylene

          -- **Effective Cleaning:** Removes flux, grease, dust effectively

          -- **Affordable:** Inexpensive and widely available

          -- **Versatile:** Suitable for most PCBs and electronic components

          -

          -#### 🔹 Precautions

          -

          -- Flammable – keep away from open flames

          -- Ensure good ventilation during use

          -- Choose ≥99% anhydrous IPA (electronic grade)

          -

          ----

          -

          -### 🆚 Common PCB Cleaner Comparison Table

          -

          -| Product Name          | Eco-Friendliness | Price     | Cleaning Power | Conductive | Notes                                   |

          -|-----------------------|------------------|-----------|----------------|------------|-----------------------------------------|

          -| Isopropyl Alcohol (IPA) | ★★★★☆          | ★★★★★     | ★★★★☆         | No         | Best value, widely applicable            |

          -| Water-Based Cleaner     | ★★★★★          | ★★★★☆     | ★★★★☆         | No         | Safe for equipment, slightly weaker     |

          -| Acetone                 | ★★☆☆☆          | ★★★★☆     | ★★★★★         | No         | Strong but harsh, can damage plastics   |

          -| Trichloroethylene       | ★☆☆☆☆          | ★★★☆☆     | ★★★★★         | No         | Toxic, environmentally restricted       |

          -

          ----

          -

          -### ✅ Summary Recommendation

          -

          -> If you’re looking for **eco-friendly + affordable + convenient**, the best option is:

          ->

          -> ### 👉 High-Purity Isopropyl Alcohol (99% IPA)

          -> Available in bulk or spray form; can be diluted slightly if needed.

          -

          -

          -## ref 

          -

          -- [[PCB-cleaner]]

          \ No newline at end of file

				PCB-dat/PCB-tools-dat/PCB-tools-dat.md
			
          @@ -1,36 +0,0 @@

          -

          -# tools-PCB-dat

          -

          -## modification tools 

          -

          -- cutting tools == [[PSO1060-dat]], shortly cutt the PCB trace

          -

          -- mini drill bits == [[PTO1036-dat]], drill little holes to disconnect the PCB trace

          -

          -![](2025-05-16-14-18-42.png)

          -

          -

          -## wires 

          -

          -- [[flywire-dat]] - [[jumper-wire-dat]] - [[cable-dat]] - [[awg-wires-dat]]

          -

          -

          -

          -

          -## other tools 

          -

          -- [[hot-gun-glue-dat]] - [[glue-dat]]

          -

          -## cleaner 

          -

          -- [[PCB-cleaner-dat]]

          -

          -

          -## soldering rack 

          -

          -[Soldering Iron Wires Rack w/cleaning slots R2](https://www.electrodragon.com/product/casting-metal-soldering-rack/) - [[PSOS010-dat]]

          -

          -

          -## ref 

          -

          -- [[tools-dat]]

          \ No newline at end of file

				PCB-dat/desoldering-dat/desoldering-dat.md
			
          @@ -1,41 +0,0 @@

          -

          -# desoldering-dat

          -

          -- [[PSO1043-dat]] == desoldering pump 

          -

          -- [[PSO1038-dat]] == desoldering wire (wick)

          -

          -- [[hot-air-station-dat]]

          -

          -- [[Hot-Tweezer-dat]]: These are like regular tweezers but with heated tips. They can simultaneously heat and grip small two-leaded SMD components like resistors, capacitors, and SOT packages for easy removal.

          -

          -

          -

          -

          -| Feature           | Desoldering Wire (Wick)        | Desoldering Pump                        |

          -| ----------------- | ------------------------------ | --------------------------------------- |

          -| **Function**      | Absorbs melted solder          | Sucks up melted solder                  |

          -| **Best For**      | Small, precise work            | Removing large amounts of solder        |

          -| **Ease of Use**   | Requires steady hand & flux    | Requires quick reaction & suction       |

          -| **Effectiveness** | **Good for fine traces & SMD** | **Good for through-hole components**    |

          -| **Messiness**     | Leaves minimal residue         | Can scatter solder if not used properly |

          -| **Durability**    | One-time use per section       | Reusable multiple times                 |

          -| **Cost**          | Cheap, but needs refilling     | More expensive, but reusable            |

          -| **Skill Level**   | Easier for beginners           | Requires practice to master             |

          -| **Item**          | [[PSO1043-dat]]                | [[PSO1038-dat]]                         |

          -

          -

          -

          -

          -## mess desoldering

          -

          -- [[preheat-bed-dat]]

          -

          -

          -

          -

          -

          -## ref 

          -

          -

          -- [[soldering-dat]] - [[tech-dat]]

          \ No newline at end of file

				Tech-dat/ADC-dat/ADC-dat.md
			
          @@ -16,7 +16,8 @@

           - [[ADS7822-dat]] - 12-Bit, 200 kSPS, SPI Interface, Micro Power, Single Supply, Rail-to-Rail I/O ADC with Internal Reference

          -

          +	

          +- AD9224ARSZ - 12 Bit Analog to Digital Converter 1 Input 1 Pipelined 28-SSOP

				Tech-dat/Sensor-dat/human-sensor-dat/feel-sensor-dat/feel-sensor-dat.md
			
          @@ -1,12 +0,0 @@

          -

          -# temp-hum-sensor-dat

          -

          -

          -## temp + hum + pressure 

          -

          -- [[BME280-dat]]

          -

          -

          -## temp + pressure, none-hum 

          -

          -- [[BMP280-dat]]

          \ No newline at end of file

				Tech-dat/Sensor-dat/human-sensor-dat/pulse-rate-dat/2025-05-05-18-26-49.png
			
          Binary files a/Tech-dat/Sensor-dat/human-sensor-dat/pulse-rate-dat/2025-05-05-18-26-49.png and /dev/null differ

				Tech-dat/Sensor-dat/human-sensor-dat/pulse-rate-dat/pulse-rate-dat.md
			
          @@ -1,24 +0,0 @@

          -

          -# pulse-rate-dat.md

          -

          -

          -## Principle Introduction:

          -

          -How does the MAX30100 measure pulse rate? 

          -

          -The device has two LEDs: 

          -

          -one emits red light, and the other emits infrared light. 

          -

          -Both red and infrared light are used to measure the oxygen level in the blood.

          -

          -When the heart pumps blood, the amount of oxygenated blood increases due to the higher blood volume. As the heart relaxes, the volume of oxygenated blood decreases. The pulse rate is determined by knowing the time interval between the increase and decrease of oxygenated blood.

          -

          -It turns out that oxygenated blood absorbs more infrared light and transmits more red light, while deoxygenated blood absorbs more red light and transmits more infrared light. This is the main operating principle of the MAX30100: it reads the absorption levels for both light sources and stores them in a buffer that can be read via I2C. However, it's not as simple as it sounds; significant data filtering and processing are involved.

          -

          -

          -

          -![](2025-05-05-18-26-49.png)

          -

          -

          -

				Tech-dat/Sensor-dat/sensor-bio-dat/feel-sensor-dat/feel-sensor-dat.md
			
          @@ -0,0 +1,12 @@

          +

          +# temp-hum-sensor-dat

          +

          +

          +## temp + hum + pressure 

          +

          +- [[BME280-dat]]

          +

          +

          +## temp + pressure, none-hum 

          +

          +- [[BMP280-dat]]

          \ No newline at end of file

				Tech-dat/Sensor-dat/sensor-bio-dat/pulse-rate-dat/2025-05-05-18-26-49.png
			
          Binary files /dev/null and b/Tech-dat/Sensor-dat/sensor-bio-dat/pulse-rate-dat/2025-05-05-18-26-49.png differ

				Tech-dat/Sensor-dat/sensor-bio-dat/pulse-rate-dat/pulse-rate-dat.md
			
          @@ -0,0 +1,24 @@

          +

          +# pulse-rate-dat.md

          +

          +

          +## Principle Introduction:

          +

          +How does the MAX30100 measure pulse rate? 

          +

          +The device has two LEDs: 

          +

          +one emits red light, and the other emits infrared light. 

          +

          +Both red and infrared light are used to measure the oxygen level in the blood.

          +

          +When the heart pumps blood, the amount of oxygenated blood increases due to the higher blood volume. As the heart relaxes, the volume of oxygenated blood decreases. The pulse rate is determined by knowing the time interval between the increase and decrease of oxygenated blood.

          +

          +It turns out that oxygenated blood absorbs more infrared light and transmits more red light, while deoxygenated blood absorbs more red light and transmits more infrared light. This is the main operating principle of the MAX30100: it reads the absorption levels for both light sources and stores them in a buffer that can be read via I2C. However, it's not as simple as it sounds; significant data filtering and processing are involved.

          +

          +

          +

          +![](2025-05-05-18-26-49.png)

          +

          +

          +

				Tech-dat/Sensor-dat/sensor-bio-dat/sensor-bio-dat.md
			
          @@ -0,0 +1,22 @@

          +

          +# sensor-bio-dat

          +

          +

          +- [[sensor-ecg-dat]] - [[ECG-dat]] - Electrocardiogram (ECG) Sensors and Modules

          +

          +- [[feel-sensor-dat]] - [[pulse-rate-dat]]

          +

          +

          +## un-sort 

          +

          +

          +HM301D - Diagnostic-quality acquisition system for bio-electric sensors and bio-imp

          +

          +

          +

          +## ref 

          +

          +

          +- [[sensor-dat]]

          +

          +

				Tech-dat/opensource-dat/opensource-dat.md
			
          @@ -1,6 +1,11 @@

           # opensource-dat

          +

          +

          +

          +

          +

           ## best projects

          @@ -18,9 +23,16 @@

           ## new projects 

          +https://github.com/T-vK/ESP32-BLE-Mouse

          +

          +https://github.com/lahirunirmalx/PS2Keyboard

          +

          +https://github.com/Te-update/Esp32-Hoverboard-Lawnmower

          +

          +

           - ESP32-Paxcounter == https://github.com/cyberman54/ESP32-Paxcounter

           ## ref 

          -- [[opensource]]

          \ No newline at end of file

          +- [[opensource]]s

          \ No newline at end of file

				Tech-dat/tech-dat.md
			
          @@ -146,7 +146,7 @@

           - [[acturator-dat]] - [[motor-dat]] - [[motion-control-system-dat]] - [[dc-gear-motor-dat]] 

          -- [[mosfet-dat]] - [[pump-dat]] - [[triac-dat]]

          +- [[mosfet-dat]] [[mos-n-dat]] - [[pump-dat]] - [[triac-dat]]

           - [[servo-dat]]

				fab-dat/fab-PCB-dat/PCB-fix-dat/PCB-fix-dat.md
			
          @@ -0,0 +1,20 @@

          +

          +# PCB-fix-dat

          +

          +## simple fixing 

          +

          +- PCB knife cutter 

          +

          +- [[PSO1060-dat]] == [PCB Trace Cutter Editor Knife](https://www.electrodragon.com/product/pcb-cutterknife/)

          +

          +## mess fixing 

          +

          +- also suitable for single trace editing 

          +- Use a drill to make non-through holes to break PCB traces

          +- fast for large batch fixing 

          +

          +

          +

          +## ref 

          +

          +- [[PCB-dat]]

          \ No newline at end of file

				fab-dat/fab-PCB-dat/spot-welding-dat/2025-06-13-13-43-52.png
			
          Binary files /dev/null and b/fab-dat/fab-PCB-dat/spot-welding-dat/2025-06-13-13-43-52.png differ

				fab-dat/fab-PCB-dat/spot-welding-dat/spot-welding-dat.md
			
          @@ -0,0 +1,13 @@

          +

          +# spot-welding-dat

          +

          +![](2025-06-13-13-43-52.png)

          +

          +specifically for [[battery-dat]]

          +

          +

          +## ref 

          +

          +- [[battery-dat]]

          +

          +- [[spot-welding]] - [[soldering]]

          \ No newline at end of file

				fab-dat/fab-PCB-soldering-tools-dat/PCB-tools-dat/2025-05-16-14-18-42.png
			
          Binary files /dev/null and b/fab-dat/fab-PCB-soldering-tools-dat/PCB-tools-dat/2025-05-16-14-18-42.png differ

				fab-dat/fab-PCB-soldering-tools-dat/PCB-tools-dat/PCB-cleaner-dat/PCB-cleaner-dat.md
			
          @@ -0,0 +1,60 @@

          +

          +# PCB-cleaner-dat

          +

          +## PCB-cleaner-dat

          +

          +### Product Usage Instructions

          +

          +Product dimensions and specifications

          +

          +**Ultrasonic Cleaning:** Pour the board cleaner into the ultrasonic cleaner, place the PCB board or workpiece to be cleaned inside, turn on the machine, and clean for 4-6 minutes. Then, ventilate and dry for 5-10 minutes.

          +

          +**Immersion Cleaning:** Pour this product into a container, immerse the PCB board, then use a brush to scrub it clean, and finally air dry.

          +

          +**Spot Cleaning:** Wet a brush or lint-free cloth with this product and directly scrub the oily area. Repeat the scrubbing several times, then air dry.

          +

          +**Brush Cleaning:** Pour out this product, soak a brush or lint-free cloth, and then wipe the item that needs cleaning.

          +

          +

          +## Recommended Eco-Friendly and Cost-Effective PCB Cleaner

          +

          +### ✅ Recommended Product: Isopropyl Alcohol (IPA, concentration ≥ 99%)

          +

          +#### 🔹 Features

          +

          +- **Eco-Friendly:** Evaporates cleanly with no residue; biodegradable

          +- **Low Toxicity:** Safer than strong solvents like acetone or trichloroethylene

          +- **Effective Cleaning:** Removes flux, grease, dust effectively

          +- **Affordable:** Inexpensive and widely available

          +- **Versatile:** Suitable for most PCBs and electronic components

          +

          +#### 🔹 Precautions

          +

          +- Flammable – keep away from open flames

          +- Ensure good ventilation during use

          +- Choose ≥99% anhydrous IPA (electronic grade)

          +

          +---

          +

          +### 🆚 Common PCB Cleaner Comparison Table

          +

          +| Product Name          | Eco-Friendliness | Price     | Cleaning Power | Conductive | Notes                                   |

          +|-----------------------|------------------|-----------|----------------|------------|-----------------------------------------|

          +| Isopropyl Alcohol (IPA) | ★★★★☆          | ★★★★★     | ★★★★☆         | No         | Best value, widely applicable            |

          +| Water-Based Cleaner     | ★★★★★          | ★★★★☆     | ★★★★☆         | No         | Safe for equipment, slightly weaker     |

          +| Acetone                 | ★★☆☆☆          | ★★★★☆     | ★★★★★         | No         | Strong but harsh, can damage plastics   |

          +| Trichloroethylene       | ★☆☆☆☆          | ★★★☆☆     | ★★★★★         | No         | Toxic, environmentally restricted       |

          +

          +---

          +

          +### ✅ Summary Recommendation

          +

          +> If you’re looking for **eco-friendly + affordable + convenient**, the best option is:

          +>

          +> ### 👉 High-Purity Isopropyl Alcohol (99% IPA)

          +> Available in bulk or spray form; can be diluted slightly if needed.

          +

          +

          +## ref 

          +

          +- [[PCB-cleaner]]

          \ No newline at end of file

				fab-dat/fab-PCB-soldering-tools-dat/PCB-tools-dat/PCB-tools-dat.md
			
          @@ -0,0 +1,36 @@

          +

          +# tools-PCB-dat

          +

          +## modification tools 

          +

          +- cutting tools == [[PSO1060-dat]], shortly cutt the PCB trace

          +

          +- mini drill bits == [[PTO1036-dat]], drill little holes to disconnect the PCB trace

          +

          +![](2025-05-16-14-18-42.png)

          +

          +

          +## wires 

          +

          +- [[flywire-dat]] - [[jumper-wire-dat]] - [[cable-dat]] - [[awg-wires-dat]]

          +

          +

          +

          +

          +## other tools 

          +

          +- [[hot-gun-glue-dat]] - [[glue-dat]]

          +

          +## cleaner 

          +

          +- [[PCB-cleaner-dat]]

          +

          +

          +## soldering rack 

          +

          +[Soldering Iron Wires Rack w/cleaning slots R2](https://www.electrodragon.com/product/casting-metal-soldering-rack/) - [[PSOS010-dat]]

          +

          +

          +## ref 

          +

          +- [[tools-dat]]

          \ No newline at end of file

				fab-dat/fab-PCB-soldering-tools-dat/desoldering-dat/desoldering-dat.md
			
          @@ -0,0 +1,41 @@

          +

          +# desoldering-dat

          +

          +- [[PSO1043-dat]] == desoldering pump 

          +

          +- [[PSO1038-dat]] == desoldering wire (wick)

          +

          +- [[hot-air-station-dat]]

          +

          +- [[Hot-Tweezer-dat]]: These are like regular tweezers but with heated tips. They can simultaneously heat and grip small two-leaded SMD components like resistors, capacitors, and SOT packages for easy removal.

          +

          +

          +

          +

          +| Feature           | Desoldering Wire (Wick)        | Desoldering Pump                        |

          +| ----------------- | ------------------------------ | --------------------------------------- |

          +| **Function**      | Absorbs melted solder          | Sucks up melted solder                  |

          +| **Best For**      | Small, precise work            | Removing large amounts of solder        |

          +| **Ease of Use**   | Requires steady hand & flux    | Requires quick reaction & suction       |

          +| **Effectiveness** | **Good for fine traces & SMD** | **Good for through-hole components**    |

          +| **Messiness**     | Leaves minimal residue         | Can scatter solder if not used properly |

          +| **Durability**    | One-time use per section       | Reusable multiple times                 |

          +| **Cost**          | Cheap, but needs refilling     | More expensive, but reusable            |

          +| **Skill Level**   | Easier for beginners           | Requires practice to master             |

          +| **Item**          | [[PSO1043-dat]]                | [[PSO1038-dat]]                         |

          +

          +

          +

          +

          +## mess desoldering

          +

          +- [[preheat-bed-dat]]

          +

          +

          +

          +

          +

          +## ref 

          +

          +

          +- [[soldering-dat]] - [[tech-dat]]

          \ No newline at end of file

				fab-dat/fab-PCB-soldering-tools-dat/fab-PCB-soldering-tools-dat.md
			
          @@ -0,0 +1,65 @@

          +# soldering-dat

          +

          +- [[PSO1043-dat]] - [[PSO1038-dat]]

          +

          +- [[PCB-cleaner-dat]]

          +

          +- [[solder-paste-dat]] - [[fab-PCBA-dat]]

          +

          +- [[soldering-tools-dat]]

          +

          +- [[fab-PCB-soldering-dat]]

          +

          +

          +## soldering skills 

          +

          +

          +

          +

          +

          +### soldering chip with pads underneath, such as QFN, BGA, LGA, etc.

          +

          +- [[allwinner-dat]]

          +

          +T113 soldering note: 务必先焊接除T113以外的元器件，烧录51单片机固件，按下面的说明，测量3.3V、1.5V、0.9V全部正常再焊T113，否则若EA3036的FB虚焊将会直接烧坏T113。

          +

          +T113 soldering note (English): Be sure to solder all components except T113 first, program the 51 MCU firmware, and follow the instructions below to measure 3.3V, 1.5V, and 0.9V to ensure they are all normal before soldering T113. Otherwise, if the FB pin of EA3036 is poorly soldered, T113 may be directly damaged.

          +

          +

          +

          +### FPC soldering 

          +

          +- [[FPC-dat]]

          +

          +### alternative temperature-sensitive items soldering

          +

          +

          +> No special solder paste is needed; the key point is not to heat the FPC connector directly—apply heat from the back side of the PCB.

          +> 

          +> **Explanation:**

          +> When soldering temperature-sensitive components like FPC (Flexible Printed Circuit) connectors, you generally do not need to use any special type of solder paste. The most important thing is to avoid applying hot air or direct heat to the FPC connector itself, as it can be easily damaged by high temperatures. 

          +> Instead, use a hot air gun or soldering tool to heat the solder joints from the back side of the PCB. This approach helps protect the delicate connector and ensures a reliable solder joint.

          +

          +

          +

          +## tips 

          +

          +焊接注意事项

          +

          +1. 确保焊接的部位干燥干净无油污无氧化；

          +

          +2. 选择60W或更大功率的电烙铁，保证温度足够高，烙铁头可选尖头或马蹄头等以便传热和焊接（软包电池需要200W起的电烙铁，大单体需要500W起的电烙铁)

          +

          +3. 先加热被焊接部位 (烙铁头紧贴焊接部位几秒钟）再同时快速送锡至焊点，焊接完成；

          +

          +4. 注意：焊接过程烙铁不要离开金属表面，保持加热趁热焊接，锡丝尽量连续不断。

          +

          +## ref 

          +

          +- [[desoldering-dat]]

          +

          +- [[welding-dat]] - [[spot-welding-dat]] - [[PTC-dat]]

          +

          +- [[ICT-testing]]

          +

          +- [[soldering]]

          \ No newline at end of file

				fab-dat/fab-PCBA-dat/SMT-Reflow-Soldering-dat/SMT-Reflow-Soldering-dat.md
			
          @@ -3,6 +3,81 @@

           - [[pnp-machine-dat]]

          +

          +## Reflow Solder Paste Comparison: 183°C vs 138°C

          +

          +### 🔧 1. Basic Alloy Differences

          +

          +| Property | Sn63/Pb37 | Sn42/Bi58 |

          +|-----------|------------|-----------|

          +| **Type** | Tin–Lead eutectic | Low-temp bismuth-based |

          +| **Melting Point** | **183 °C** | **138 °C** |

          +| **RoHS** | ❌ Not compliant | ✅ RoHS compliant |

          +| **Mechanical Strength** | High | Lower (more brittle) |

          +| **Thermal Fatigue Resistance** | Good | Moderate to poor |

          +| **Cost** | Low | Medium–high |

          +

          +---

          +

          +### 🌡️ 2. Typical Reflow Profile Comparison

          +

          +| Stage | Sn63/Pb37 (183 °C) | Sn42/Bi58 (138 °C) | Key Difference |

          +|--------|--------------------|--------------------|----------------|

          +| **Preheat** | 100–150 °C for 60–120 s | 80–110 °C for 60–120 s | Lower ramp to avoid flux burnout |

          +| **Ramp Rate** | 1–3 °C/s | 0.5–2 °C/s | Gentler ramp for Bi alloy |

          +| **Soak (Flux Activation)** | 150–170 °C for 60–120 s | 110–130 °C for 60–120 s | Lower soak temperature |

          +| **Peak (Reflow)** | 210–225 °C | 160–170 °C | ~50 °C lower peak |

          +| **Time Above Liquidus (TAL)** | 30–90 s | 30–90 s | Similar duration |

          +| **Cooling Rate** | 2–4 °C/s | 2–4 °C/s | Avoid fast cooling to prevent cracks |

          +

          +---

          +

          +### ⚙️ 3. Process Considerations

          +

          +| Factor | Sn63/Pb37 | Sn42/Bi58 |

          +|--------|------------|------------|

          +| **Heat Sensitivity** | Suitable for most PCBs | Safer for heat-sensitive components (e.g. LEDs, flexible PCBs) |

          +| **Joint Reliability** | Ductile, strong | Brittle — not ideal for high vibration or stress |

          +| **Storage Stability** | Good | Can age faster; store below 10 °C |

          +| **Rework Temp** | ~250 °C | ~180 °C | Easier to rework Bi-based solder |

          +

          +---

          +

          +### 🔍 4. When to Choose Each

          +

          +- **Use 183 °C (Sn63/Pb37)** for:

          +  - Traditional boards

          +  - High mechanical or thermal cycling requirements

          +  - Non-RoHS projects

          +

          +- **Use 138 °C (Sn42/Bi58)** for:

          +  - Low-temp, heat-sensitive assemblies (e.g. OLED, sensors, flex PCBs)

          +  - Second-stage soldering (after high-temp parts are mounted)

          +  - RoHS-compliant builds needing minimal thermal stress

          +

          +---

          +

          +### 🧭 5. Example Temperature Profile (for reference)

          +

          +#### 🔹 Sn63/Pb37

          +

          +   Preheat: 25 → 150 °C @ 2 °C/s

          +   Soak: 150–170 °C for 90 s

          +   Peak: 215 °C for 45 s (TAL ~60 s)

          +   Cool: 3 °C/s

          +

          +#### 🔹 Sn42/Bi58

          +

          +   Preheat: 25 → 110 °C @ 1.5 °C/s

          +   Soak: 110–130 °C for 90 s

          +   Peak: 165 °C for 45 s (TAL ~60 s)

          +   Cool: 2 °C/s

          +

          +

          +

          +

          +

          +

           ## Causes of Solder Splashes / Solder Balls After Reflow Soldering

           ### 1. Solder Paste Issues

				fab-dat/fab-PNP-machine-dat/fab-PNP-machine-dat.md
			
          @@ -0,0 +1,5 @@

          +

          +# fab-PNP-machine-dat

          +

          +

          +- [[openpnp-dat]]

          \ No newline at end of file

				fab-dat/fab-mech-dat/fab-sheet-metal-dat/2025-06-16-12-38-08.png
			
          Binary files /dev/null and b/fab-dat/fab-mech-dat/fab-sheet-metal-dat/2025-06-16-12-38-08.png differ

				fab-dat/fab-mech-dat/fab-sheet-metal-dat/fab-sheet-metal-dat.md
			
          @@ -0,0 +1,23 @@

          +

          +# sheet-metal-fab-dat

          +

          +- Supported 3D (required) formats: .step, .stp; Supported 2D formats: dwg, dxf, pdf; Compressed packages (zip, rar) can be uploaded directly.

          +- Supports unified ordering for multiple parts in a compressed package; file names for 2D files, BOM lists, etc., need to be consistent (number of files per upload ≤20, individual file size <100M).

          +- If there are assembly relationships between parts, it is strongly recommended that you upload an assembly STEP file.

          +

          +

          +## Examples Stainless Steel 201

          +

          +- the following bending rack price == 20RM == 3 USD 

          +

          +![](2025-06-16-12-38-08.png)

          +

          +## Example Plastic PP PE Sheet 

          +

          +

          +

          +unit == mm, color == black

          +

          +## ref 

          +

          +- [[CAD-dat]]

          \ No newline at end of file

				fab-dat/fab-workspace-dat/fab-workspace-dat.md
			
          @@ -0,0 +1,10 @@

          +

          +# workspace-dat

          +

          +- [[heatbed-dat]]

          +

          +

          +

          +## ref 

          +

          +- [[workspace]]

          \ No newline at end of file

				fab-dat/sheet-metal-fab-dat/2025-06-16-12-38-08.png
			
          Binary files a/fab-dat/sheet-metal-fab-dat/2025-06-16-12-38-08.png and /dev/null differ

				fab-dat/sheet-metal-fab-dat/sheet-metal-fab-dat.md
			
          @@ -1,23 +0,0 @@

          -

          -# sheet-metal-fab-dat

          -

          -- Supported 3D (required) formats: .step, .stp; Supported 2D formats: dwg, dxf, pdf; Compressed packages (zip, rar) can be uploaded directly.

          -- Supports unified ordering for multiple parts in a compressed package; file names for 2D files, BOM lists, etc., need to be consistent (number of files per upload ≤20, individual file size <100M).

          -- If there are assembly relationships between parts, it is strongly recommended that you upload an assembly STEP file.

          -

          -

          -## Examples Stainless Steel 201

          -

          -- the following bending rack price == 20RM == 3 USD 

          -

          -![](2025-06-16-12-38-08.png)

          -

          -## Example Plastic PP PE Sheet 

          -

          -

          -

          -unit == mm, color == black

          -

          -## ref 

          -

          -- [[CAD-dat]]

          \ No newline at end of file

				info-dat/info-dat.md
			
          @@ -2,8 +2,12 @@

           # info-dat

          +- [[opensource-dat]]

          +

          +

          +

          +

           - [[allwinner-dat]]

           - [[RMP-driver-dat]]

          -- [[opensource-dat]]

          \ No newline at end of file

				power-dat/LDO-dat/LDO-dat.md
			
          @@ -11,6 +11,10 @@

           ## comparable table 

          +

          +

          +

          +

           | chip              | package | VIN |

           | ----------------- | ------- | --- |

           | [[AMS1117-dat]]   | SOT-89  |     |

...	...	@@ -146,7 +146,7 @@
146	146
147	147	- [[acturator-dat]] - [[motor-dat]] - [[motion-control-system-dat]] - [[dc-gear-motor-dat]]
148	148
149		-- [[mosfet-dat]] - [[pump-dat]] - [[triac-dat]]
	149	+- [[mosfet-dat]] [[mos-n-dat]] - [[pump-dat]] - [[triac-dat]]
150	150
151	151	- [[servo-dat]]
152	152

...	...	@@ -27,6 +27,12 @@ BOOT_EN == LOW, BOOT == LOW, PI_BOOT (nRPIBOOT) == HIGH, USB_SEL == HIGH
27	27
28	28	![](2025-10-26-21-07-09.png)
29	29
	30	+## EOF
	31	+
	32	+FQD3N60CTM - MOSFET N-CH 600V 2.4A DPAK - N-Channel 600 V 2.4A (Tc) 50W (Tc) Surface Mount TO-252AA -
	33	+FQD3N60CTM-WSTR-ND - Tape & Reel (TR)
	34	+
	35	+
30	36
31	37	## ref
32	38

...	...	@@ -4,6 +4,10 @@ partner: [[Inrush-resistor-dat]]
4	4
5	5	The LM317 device is an adjustable three-terminal positive-voltage regulator capable of supplying more than 1.5 A over an output-voltage range of 1.25 V to 37 V. I
6	6
	7	+[LM217T-DG](https://www.st.com/content/ccc/resource/technical/document/datasheet/group1/a0/db/e6/9b/6f/9c/45/7b/CD00000455/files/CD00000455.pdf/jcr:content/translations/en.CD00000455.pdf) - 1.2 V to 37 V adjustable voltage regulators
	8	+
	9	+
	10	+LM217, LM317
7	11
8	12
9	13	## board

...	...	@@ -1,6 +1,9 @@
1	1
2	2	# circuits-dat
3	3
	4	+
	5	+- [[logic-dat]] - [[logic-gate-dat]] - [[buffer-dat]] - [[logic-level-shifter-dat]]
	6	+
4	7	- [[74xx-dat]]
5	8
6	9	- [[protection-dat]]
...	...	@@ -33,7 +36,6 @@
33	36
34	37
35	38
36		-- [[logic-dat]] - [[logic-gate-dat]] - [[buffer-dat]]
37	39
38	40	- [[Multivibrator-dat]]
39	41

...	...	@@ -71,7 +71,9 @@ Make sure the VCCA ≤VCCB.
71	71
72	72	- MAX3372E–MAX3379E/MAX3390E–MAX3393E - ±15kV ESD-Protected, 1μA, 16Mbps, Dual/Quad Low-Voltage Level Translators in UCSP
73	73
	74	+EOF
74	75
	76	+IP4856CX25 - The device is an SD 3.0-compliant 6-bit bidirectional dual voltage level translator. It is designed to interface between a memory card operating at 1.8 V or 2.9 V signal levels and a host with a fixed nominal supply voltage of 1.7 V to 3.6 V. The device supports SD 3.0, SDR104, SDR50, DDR50, SDR25, SDR12 and SD 2.0 high-speed (50 MHz) and default-speed (25 MHz) modes. The device has an integrated voltage selectable low dropout regulator to supply the card-side I/Os, built-in EMI filters and robust ESD protections (IEC 61000-4-2, level 4).
75	77
76	78
77	79

...	...	@@ -43,6 +43,8 @@
43	43
44	44	- [[weekly-dat]] - [[2025-july-dat]] - [[2025-May-dat]]
45	45
	46	+- [[info-dat]]
	47	+
46	48	## This wiki changes
47	49
48	50	- [Latest Changes (Globally)](https://w2.electrodragon.com/gollum/latest_changes)

...	...	@@ -1,20 +0,0 @@
1		-
2		-# PCB-fix-dat
3		-
4		-## simple fixing
5		-
6		-- PCB knife cutter
7		-
8		-- [[PSO1060-dat]] == [PCB Trace Cutter Editor Knife](https://www.electrodragon.com/product/pcb-cutterknife/)
9		-
10		-## mess fixing
11		-
12		-- also suitable for single trace editing
13		-- Use a drill to make non-through holes to break PCB traces
14		-- fast for large batch fixing
15		-
16		-
17		-
18		-## ref
19		-
20		-- [[PCB-dat]]
...	...	\ No newline at end of file

...	...	@@ -1,65 +0,0 @@
1		-# soldering-dat
2		-
3		-- [[PSO1043-dat]] - [[PSO1038-dat]]
4		-
5		-- [[PCB-cleaner-dat]]
6		-
7		-- [[solder-paste-dat]] - [[fab-PCBA-dat]]
8		-
9		-- [[soldering-tools-dat]]
10		-
11		-
12		-
13		-
14		-## soldering skills
15		-
16		-
17		-
18		-
19		-
20		-### soldering chip with pads underneath, such as QFN, BGA, LGA, etc.
21		-
22		-- [[allwinner-dat]]
23		-
24		-T113 soldering note: 务必先焊接除T113以外的元器件，烧录51单片机固件，按下面的说明，测量3.3V、1.5V、0.9V全部正常再焊T113，否则若EA3036的FB虚焊将会直接烧坏T113。
25		-
26		-T113 soldering note (English): Be sure to solder all components except T113 first, program the 51 MCU firmware, and follow the instructions below to measure 3.3V, 1.5V, and 0.9V to ensure they are all normal before soldering T113. Otherwise, if the FB pin of EA3036 is poorly soldered, T113 may be directly damaged.
27		-
28		-
29		-
30		-### FPC soldering
31		-
32		-- [[FPC-dat]]
33		-
34		-### alternative temperature-sensitive items soldering
35		-
36		-
37		-> No special solder paste is needed; the key point is not to heat the FPC connector directly—apply heat from the back side of the PCB.
38		->
39		-> Explanation:
40		-> When soldering temperature-sensitive components like FPC (Flexible Printed Circuit) connectors, you generally do not need to use any special type of solder paste. The most important thing is to avoid applying hot air or direct heat to the FPC connector itself, as it can be easily damaged by high temperatures.
41		-> Instead, use a hot air gun or soldering tool to heat the solder joints from the back side of the PCB. This approach helps protect the delicate connector and ensures a reliable solder joint.
42		-
43		-
44		-
45		-## tips
46		-
47		-焊接注意事项
48		-
49		-1. 确保焊接的部位干燥干净无油污无氧化；
50		-
51		-2. 选择60W或更大功率的电烙铁，保证温度足够高，烙铁头可选尖头或马蹄头等以便传热和焊接（软包电池需要200W起的电烙铁，大单体需要500W起的电烙铁)
52		-
53		-3. 先加热被焊接部位 (烙铁头紧贴焊接部位几秒钟）再同时快速送锡至焊点，焊接完成；
54		-
55		-4. 注意：焊接过程烙铁不要离开金属表面，保持加热趁热焊接，锡丝尽量连续不断。
56		-
57		-## ref
58		-
59		-- [[desoldering-dat]]
60		-
61		-- [[welding-dat]] - [[spot-welding-dat]] - [[PTC-dat]]
62		-
63		-- [[ICT-testing]]
64		-
65		-- [[soldering]]
...	...	\ No newline at end of file

...	...	@@ -1,13 +0,0 @@
1		-
2		-# spot-welding-dat
3		-
4		-![](2025-06-13-13-43-52.png)
5		-
6		-specifically for [[battery-dat]]
7		-
8		-
9		-## ref
10		-
11		-- [[battery-dat]]
12		-
13		-- [[spot-welding]] - [[soldering]]
...	...	\ No newline at end of file

...	...	@@ -1,60 +0,0 @@
1		-
2		-# PCB-cleaner-dat
3		-
4		-## PCB-cleaner-dat
5		-
6		-### Product Usage Instructions
7		-
8		-Product dimensions and specifications
9		-
10		-Ultrasonic Cleaning: Pour the board cleaner into the ultrasonic cleaner, place the PCB board or workpiece to be cleaned inside, turn on the machine, and clean for 4-6 minutes. Then, ventilate and dry for 5-10 minutes.
11		-
12		-Immersion Cleaning: Pour this product into a container, immerse the PCB board, then use a brush to scrub it clean, and finally air dry.
13		-
14		-Spot Cleaning: Wet a brush or lint-free cloth with this product and directly scrub the oily area. Repeat the scrubbing several times, then air dry.
15		-
16		-Brush Cleaning: Pour out this product, soak a brush or lint-free cloth, and then wipe the item that needs cleaning.
17		-
18		-
19		-## Recommended Eco-Friendly and Cost-Effective PCB Cleaner
20		-
21		-### ✅ Recommended Product: Isopropyl Alcohol (IPA, concentration ≥ 99%)
22		-
23		-#### 🔹 Features
24		-
25		-- Eco-Friendly: Evaporates cleanly with no residue; biodegradable
26		-- Low Toxicity: Safer than strong solvents like acetone or trichloroethylene
27		-- Effective Cleaning: Removes flux, grease, dust effectively
28		-- Affordable: Inexpensive and widely available
29		-- Versatile: Suitable for most PCBs and electronic components
30		-
31		-#### 🔹 Precautions
32		-
33		-- Flammable – keep away from open flames
34		-- Ensure good ventilation during use
35		-- Choose ≥99% anhydrous IPA (electronic grade)
36		-
37		----
38		-
39		-### 🆚 Common PCB Cleaner Comparison Table
40		-
41		-\| Product Name \| Eco-Friendliness \| Price \| Cleaning Power \| Conductive \| Notes \|
42		-\|-----------------------\|------------------\|-----------\|----------------\|------------\|-----------------------------------------\|
43		-\| Isopropyl Alcohol (IPA) \| ★★★★☆ \| ★★★★★ \| ★★★★☆ \| No \| Best value, widely applicable \|
44		-\| Water-Based Cleaner \| ★★★★★ \| ★★★★☆ \| ★★★★☆ \| No \| Safe for equipment, slightly weaker \|
45		-\| Acetone \| ★★☆☆☆ \| ★★★★☆ \| ★★★★★ \| No \| Strong but harsh, can damage plastics \|
46		-\| Trichloroethylene \| ★☆☆☆☆ \| ★★★☆☆ \| ★★★★★ \| No \| Toxic, environmentally restricted \|
47		-
48		----
49		-
50		-### ✅ Summary Recommendation
51		-
52		-> If you’re looking for eco-friendly + affordable + convenient, the best option is:
53		->
54		-> ### 👉 High-Purity Isopropyl Alcohol (99% IPA)
55		-> Available in bulk or spray form; can be diluted slightly if needed.
56		-
57		-
58		-## ref
59		-
60		-- [[PCB-cleaner]]
...	...	\ No newline at end of file

...	...	@@ -1,36 +0,0 @@
1		-
2		-# tools-PCB-dat
3		-
4		-## modification tools
5		-
6		-- cutting tools == [[PSO1060-dat]], shortly cutt the PCB trace
7		-
8		-- mini drill bits == [[PTO1036-dat]], drill little holes to disconnect the PCB trace
9		-
10		-![](2025-05-16-14-18-42.png)
11		-
12		-
13		-## wires
14		-
15		-- [[flywire-dat]] - [[jumper-wire-dat]] - [[cable-dat]] - [[awg-wires-dat]]
16		-
17		-
18		-
19		-
20		-## other tools
21		-
22		-- [[hot-gun-glue-dat]] - [[glue-dat]]
23		-
24		-## cleaner
25		-
26		-- [[PCB-cleaner-dat]]
27		-
28		-
29		-## soldering rack
30		-
31		-[Soldering Iron Wires Rack w/cleaning slots R2](https://www.electrodragon.com/product/casting-metal-soldering-rack/) - [[PSOS010-dat]]
32		-
33		-
34		-## ref
35		-
36		-- [[tools-dat]]
...	...	\ No newline at end of file

...	...	@@ -1,41 +0,0 @@
1		-
2		-# desoldering-dat
3		-
4		-- [[PSO1043-dat]] == desoldering pump
5		-
6		-- [[PSO1038-dat]] == desoldering wire (wick)
7		-
8		-- [[hot-air-station-dat]]
9		-
10		-- [[Hot-Tweezer-dat]]: These are like regular tweezers but with heated tips. They can simultaneously heat and grip small two-leaded SMD components like resistors, capacitors, and SOT packages for easy removal.
11		-
12		-
13		-
14		-
15		-\| Feature \| Desoldering Wire (Wick) \| Desoldering Pump \|
16		-\| ----------------- \| ------------------------------ \| --------------------------------------- \|
17		-\| Function \| Absorbs melted solder \| Sucks up melted solder \|
18		-\| Best For \| Small, precise work \| Removing large amounts of solder \|
19		-\| Ease of Use \| Requires steady hand & flux \| Requires quick reaction & suction \|
20		-\| Effectiveness \| Good for fine traces & SMD \| Good for through-hole components \|
21		-\| Messiness \| Leaves minimal residue \| Can scatter solder if not used properly \|
22		-\| Durability \| One-time use per section \| Reusable multiple times \|
23		-\| Cost \| Cheap, but needs refilling \| More expensive, but reusable \|
24		-\| Skill Level \| Easier for beginners \| Requires practice to master \|
25		-\| Item \| [[PSO1043-dat]] \| [[PSO1038-dat]] \|
26		-
27		-
28		-
29		-
30		-## mess desoldering
31		-
32		-- [[preheat-bed-dat]]
33		-
34		-
35		-
36		-
37		-
38		-## ref
39		-
40		-
41		-- [[soldering-dat]] - [[tech-dat]]
...	...	\ No newline at end of file

...	...	@@ -16,7 +16,8 @@
16	16
17	17	- [[ADS7822-dat]] - 12-Bit, 200 kSPS, SPI Interface, Micro Power, Single Supply, Rail-to-Rail I/O ADC with Internal Reference
18	18
19		-
	19	+
	20	+- AD9224ARSZ - 12 Bit Analog to Digital Converter 1 Input 1 Pipelined 28-SSOP
20	21
21	22
22	23

...	...	@@ -1,12 +0,0 @@
1		-
2		-# temp-hum-sensor-dat
3		-
4		-
5		-## temp + hum + pressure
6		-
7		-- [[BME280-dat]]
8		-
9		-
10		-## temp + pressure, none-hum
11		-
12		-- [[BMP280-dat]]
...	...	\ No newline at end of file

...	...	@@ -1,24 +0,0 @@
1		-
2		-# pulse-rate-dat.md
3		-
4		-
5		-## Principle Introduction:
6		-
7		-How does the MAX30100 measure pulse rate?
8		-
9		-The device has two LEDs:
10		-
11		-one emits red light, and the other emits infrared light.
12		-
13		-Both red and infrared light are used to measure the oxygen level in the blood.
14		-
15		-When the heart pumps blood, the amount of oxygenated blood increases due to the higher blood volume. As the heart relaxes, the volume of oxygenated blood decreases. The pulse rate is determined by knowing the time interval between the increase and decrease of oxygenated blood.
16		-
17		-It turns out that oxygenated blood absorbs more infrared light and transmits more red light, while deoxygenated blood absorbs more red light and transmits more infrared light. This is the main operating principle of the MAX30100: it reads the absorption levels for both light sources and stores them in a buffer that can be read via I2C. However, it's not as simple as it sounds; significant data filtering and processing are involved.
18		-
19		-
20		-
21		-![](2025-05-05-18-26-49.png)
22		-
23		-
24		-

...	...	@@ -0,0 +1,12 @@
	1	+
	2	+# temp-hum-sensor-dat
	3	+
	4	+
	5	+## temp + hum + pressure
	6	+
	7	+- [[BME280-dat]]
	8	+
	9	+
	10	+## temp + pressure, none-hum
	11	+
	12	+- [[BMP280-dat]]
...	...	\ No newline at end of file

...	...	@@ -0,0 +1,24 @@
	1	+
	2	+# pulse-rate-dat.md
	3	+
	4	+
	5	+## Principle Introduction:
	6	+
	7	+How does the MAX30100 measure pulse rate?
	8	+
	9	+The device has two LEDs:
	10	+
	11	+one emits red light, and the other emits infrared light.
	12	+
	13	+Both red and infrared light are used to measure the oxygen level in the blood.
	14	+
	15	+When the heart pumps blood, the amount of oxygenated blood increases due to the higher blood volume. As the heart relaxes, the volume of oxygenated blood decreases. The pulse rate is determined by knowing the time interval between the increase and decrease of oxygenated blood.
	16	+
	17	+It turns out that oxygenated blood absorbs more infrared light and transmits more red light, while deoxygenated blood absorbs more red light and transmits more infrared light. This is the main operating principle of the MAX30100: it reads the absorption levels for both light sources and stores them in a buffer that can be read via I2C. However, it's not as simple as it sounds; significant data filtering and processing are involved.
	18	+
	19	+
	20	+
	21	+![](2025-05-05-18-26-49.png)
	22	+
	23	+
	24	+

...	...	@@ -0,0 +1,22 @@
	1	+
	2	+# sensor-bio-dat
	3	+
	4	+
	5	+- [[sensor-ecg-dat]] - [[ECG-dat]] - Electrocardiogram (ECG) Sensors and Modules
	6	+
	7	+- [[feel-sensor-dat]] - [[pulse-rate-dat]]
	8	+
	9	+
	10	+## un-sort
	11	+
	12	+
	13	+HM301D - Diagnostic-quality acquisition system for bio-electric sensors and bio-imp
	14	+
	15	+
	16	+
	17	+## ref
	18	+
	19	+
	20	+- [[sensor-dat]]
	21	+
	22	+

...	...	@@ -1,6 +1,11 @@
1	1
2	2	# opensource-dat
3	3
	4	+
	5	+
	6	+
	7	+
	8	+
4	9	## best projects
5	10
6	11
...	...	@@ -18,9 +23,16 @@
18	23
19	24	## new projects
20	25
	26	+https://github.com/T-vK/ESP32-BLE-Mouse
	27	+
	28	+https://github.com/lahirunirmalx/PS2Keyboard
	29	+
	30	+https://github.com/Te-update/Esp32-Hoverboard-Lawnmower
	31	+
	32	+
21	33	- ESP32-Paxcounter == https://github.com/cyberman54/ESP32-Paxcounter
22	34
23	35
24	36	## ref
25	37
26		-- [[opensource]]
...	...	\ No newline at end of file
	0	+- [[opensource]]s
...	...	\ No newline at end of file

...	...	@@ -0,0 +1,20 @@
	1	+
	2	+# PCB-fix-dat
	3	+
	4	+## simple fixing
	5	+
	6	+- PCB knife cutter
	7	+
	8	+- [[PSO1060-dat]] == [PCB Trace Cutter Editor Knife](https://www.electrodragon.com/product/pcb-cutterknife/)
	9	+
	10	+## mess fixing
	11	+
	12	+- also suitable for single trace editing
	13	+- Use a drill to make non-through holes to break PCB traces
	14	+- fast for large batch fixing
	15	+
	16	+
	17	+
	18	+## ref
	19	+
	20	+- [[PCB-dat]]
...	...	\ No newline at end of file

...	...	@@ -0,0 +1,13 @@
	1	+
	2	+# spot-welding-dat
	3	+
	4	+![](2025-06-13-13-43-52.png)
	5	+
	6	+specifically for [[battery-dat]]
	7	+
	8	+
	9	+## ref
	10	+
	11	+- [[battery-dat]]
	12	+
	13	+- [[spot-welding]] - [[soldering]]
...	...	\ No newline at end of file

...	...	@@ -0,0 +1,60 @@
	1	+
	2	+# PCB-cleaner-dat
	3	+
	4	+## PCB-cleaner-dat
	5	+
	6	+### Product Usage Instructions
	7	+
	8	+Product dimensions and specifications
	9	+
	10	+Ultrasonic Cleaning: Pour the board cleaner into the ultrasonic cleaner, place the PCB board or workpiece to be cleaned inside, turn on the machine, and clean for 4-6 minutes. Then, ventilate and dry for 5-10 minutes.
	11	+
	12	+Immersion Cleaning: Pour this product into a container, immerse the PCB board, then use a brush to scrub it clean, and finally air dry.
	13	+
	14	+Spot Cleaning: Wet a brush or lint-free cloth with this product and directly scrub the oily area. Repeat the scrubbing several times, then air dry.
	15	+
	16	+Brush Cleaning: Pour out this product, soak a brush or lint-free cloth, and then wipe the item that needs cleaning.
	17	+
	18	+
	19	+## Recommended Eco-Friendly and Cost-Effective PCB Cleaner
	20	+
	21	+### ✅ Recommended Product: Isopropyl Alcohol (IPA, concentration ≥ 99%)
	22	+
	23	+#### 🔹 Features
	24	+
	25	+- Eco-Friendly: Evaporates cleanly with no residue; biodegradable
	26	+- Low Toxicity: Safer than strong solvents like acetone or trichloroethylene
	27	+- Effective Cleaning: Removes flux, grease, dust effectively
	28	+- Affordable: Inexpensive and widely available
	29	+- Versatile: Suitable for most PCBs and electronic components
	30	+
	31	+#### 🔹 Precautions
	32	+
	33	+- Flammable – keep away from open flames
	34	+- Ensure good ventilation during use
	35	+- Choose ≥99% anhydrous IPA (electronic grade)
	36	+
	37	+---
	38	+
	39	+### 🆚 Common PCB Cleaner Comparison Table
	40	+
	41	+\| Product Name \| Eco-Friendliness \| Price \| Cleaning Power \| Conductive \| Notes \|
	42	+\|-----------------------\|------------------\|-----------\|----------------\|------------\|-----------------------------------------\|
	43	+\| Isopropyl Alcohol (IPA) \| ★★★★☆ \| ★★★★★ \| ★★★★☆ \| No \| Best value, widely applicable \|
	44	+\| Water-Based Cleaner \| ★★★★★ \| ★★★★☆ \| ★★★★☆ \| No \| Safe for equipment, slightly weaker \|
	45	+\| Acetone \| ★★☆☆☆ \| ★★★★☆ \| ★★★★★ \| No \| Strong but harsh, can damage plastics \|
	46	+\| Trichloroethylene \| ★☆☆☆☆ \| ★★★☆☆ \| ★★★★★ \| No \| Toxic, environmentally restricted \|
	47	+
	48	+---
	49	+
	50	+### ✅ Summary Recommendation
	51	+
	52	+> If you’re looking for eco-friendly + affordable + convenient, the best option is:
	53	+>
	54	+> ### 👉 High-Purity Isopropyl Alcohol (99% IPA)
	55	+> Available in bulk or spray form; can be diluted slightly if needed.
	56	+
	57	+
	58	+## ref
	59	+
	60	+- [[PCB-cleaner]]
...	...	\ No newline at end of file

...	...	@@ -0,0 +1,36 @@
	1	+
	2	+# tools-PCB-dat
	3	+
	4	+## modification tools
	5	+
	6	+- cutting tools == [[PSO1060-dat]], shortly cutt the PCB trace
	7	+
	8	+- mini drill bits == [[PTO1036-dat]], drill little holes to disconnect the PCB trace
	9	+
	10	+![](2025-05-16-14-18-42.png)
	11	+
	12	+
	13	+## wires
	14	+
	15	+- [[flywire-dat]] - [[jumper-wire-dat]] - [[cable-dat]] - [[awg-wires-dat]]
	16	+
	17	+
	18	+
	19	+
	20	+## other tools
	21	+
	22	+- [[hot-gun-glue-dat]] - [[glue-dat]]
	23	+
	24	+## cleaner
	25	+
	26	+- [[PCB-cleaner-dat]]
	27	+
	28	+
	29	+## soldering rack
	30	+
	31	+[Soldering Iron Wires Rack w/cleaning slots R2](https://www.electrodragon.com/product/casting-metal-soldering-rack/) - [[PSOS010-dat]]
	32	+
	33	+
	34	+## ref
	35	+
	36	+- [[tools-dat]]
...	...	\ No newline at end of file

...	...	@@ -0,0 +1,41 @@
	1	+
	2	+# desoldering-dat
	3	+
	4	+- [[PSO1043-dat]] == desoldering pump
	5	+
	6	+- [[PSO1038-dat]] == desoldering wire (wick)
	7	+
	8	+- [[hot-air-station-dat]]
	9	+
	10	+- [[Hot-Tweezer-dat]]: These are like regular tweezers but with heated tips. They can simultaneously heat and grip small two-leaded SMD components like resistors, capacitors, and SOT packages for easy removal.
	11	+
	12	+
	13	+
	14	+
	15	+\| Feature \| Desoldering Wire (Wick) \| Desoldering Pump \|
	16	+\| ----------------- \| ------------------------------ \| --------------------------------------- \|
	17	+\| Function \| Absorbs melted solder \| Sucks up melted solder \|
	18	+\| Best For \| Small, precise work \| Removing large amounts of solder \|
	19	+\| Ease of Use \| Requires steady hand & flux \| Requires quick reaction & suction \|
	20	+\| Effectiveness \| Good for fine traces & SMD \| Good for through-hole components \|
	21	+\| Messiness \| Leaves minimal residue \| Can scatter solder if not used properly \|
	22	+\| Durability \| One-time use per section \| Reusable multiple times \|
	23	+\| Cost \| Cheap, but needs refilling \| More expensive, but reusable \|
	24	+\| Skill Level \| Easier for beginners \| Requires practice to master \|
	25	+\| Item \| [[PSO1043-dat]] \| [[PSO1038-dat]] \|
	26	+
	27	+
	28	+
	29	+
	30	+## mess desoldering
	31	+
	32	+- [[preheat-bed-dat]]
	33	+
	34	+
	35	+
	36	+
	37	+
	38	+## ref
	39	+
	40	+
	41	+- [[soldering-dat]] - [[tech-dat]]
...	...	\ No newline at end of file

...	...	@@ -0,0 +1,65 @@
	1	+# soldering-dat
	2	+
	3	+- [[PSO1043-dat]] - [[PSO1038-dat]]
	4	+
	5	+- [[PCB-cleaner-dat]]
	6	+
	7	+- [[solder-paste-dat]] - [[fab-PCBA-dat]]
	8	+
	9	+- [[soldering-tools-dat]]
	10	+
	11	+- [[fab-PCB-soldering-dat]]
	12	+
	13	+
	14	+## soldering skills
	15	+
	16	+
	17	+
	18	+
	19	+
	20	+### soldering chip with pads underneath, such as QFN, BGA, LGA, etc.
	21	+
	22	+- [[allwinner-dat]]
	23	+
	24	+T113 soldering note: 务必先焊接除T113以外的元器件，烧录51单片机固件，按下面的说明，测量3.3V、1.5V、0.9V全部正常再焊T113，否则若EA3036的FB虚焊将会直接烧坏T113。
	25	+
	26	+T113 soldering note (English): Be sure to solder all components except T113 first, program the 51 MCU firmware, and follow the instructions below to measure 3.3V, 1.5V, and 0.9V to ensure they are all normal before soldering T113. Otherwise, if the FB pin of EA3036 is poorly soldered, T113 may be directly damaged.
	27	+
	28	+
	29	+
	30	+### FPC soldering
	31	+
	32	+- [[FPC-dat]]
	33	+
	34	+### alternative temperature-sensitive items soldering
	35	+
	36	+
	37	+> No special solder paste is needed; the key point is not to heat the FPC connector directly—apply heat from the back side of the PCB.
	38	+>
	39	+> Explanation:
	40	+> When soldering temperature-sensitive components like FPC (Flexible Printed Circuit) connectors, you generally do not need to use any special type of solder paste. The most important thing is to avoid applying hot air or direct heat to the FPC connector itself, as it can be easily damaged by high temperatures.
	41	+> Instead, use a hot air gun or soldering tool to heat the solder joints from the back side of the PCB. This approach helps protect the delicate connector and ensures a reliable solder joint.
	42	+
	43	+
	44	+
	45	+## tips
	46	+
	47	+焊接注意事项
	48	+
	49	+1. 确保焊接的部位干燥干净无油污无氧化；
	50	+
	51	+2. 选择60W或更大功率的电烙铁，保证温度足够高，烙铁头可选尖头或马蹄头等以便传热和焊接（软包电池需要200W起的电烙铁，大单体需要500W起的电烙铁)
	52	+
	53	+3. 先加热被焊接部位 (烙铁头紧贴焊接部位几秒钟）再同时快速送锡至焊点，焊接完成；
	54	+
	55	+4. 注意：焊接过程烙铁不要离开金属表面，保持加热趁热焊接，锡丝尽量连续不断。
	56	+
	57	+## ref
	58	+
	59	+- [[desoldering-dat]]
	60	+
	61	+- [[welding-dat]] - [[spot-welding-dat]] - [[PTC-dat]]
	62	+
	63	+- [[ICT-testing]]
	64	+
	65	+- [[soldering]]
...	...	\ No newline at end of file

...	...	@@ -3,6 +3,81 @@
3	3
4	4	- [[pnp-machine-dat]]
5	5
	6	+
	7	+## Reflow Solder Paste Comparison: 183°C vs 138°C
	8	+
	9	+### 🔧 1. Basic Alloy Differences
	10	+
	11	+\| Property \| Sn63/Pb37 \| Sn42/Bi58 \|
	12	+\|-----------\|------------\|-----------\|
	13	+\| Type \| Tin–Lead eutectic \| Low-temp bismuth-based \|
	14	+\| Melting Point \| 183 °C \| 138 °C \|
	15	+\| RoHS \| ❌ Not compliant \| ✅ RoHS compliant \|
	16	+\| Mechanical Strength \| High \| Lower (more brittle) \|
	17	+\| Thermal Fatigue Resistance \| Good \| Moderate to poor \|
	18	+\| Cost \| Low \| Medium–high \|
	19	+
	20	+---
	21	+
	22	+### 🌡️ 2. Typical Reflow Profile Comparison
	23	+
	24	+\| Stage \| Sn63/Pb37 (183 °C) \| Sn42/Bi58 (138 °C) \| Key Difference \|
	25	+\|--------\|--------------------\|--------------------\|----------------\|
	26	+\| Preheat \| 100–150 °C for 60–120 s \| 80–110 °C for 60–120 s \| Lower ramp to avoid flux burnout \|
	27	+\| Ramp Rate \| 1–3 °C/s \| 0.5–2 °C/s \| Gentler ramp for Bi alloy \|
	28	+\| Soak (Flux Activation) \| 150–170 °C for 60–120 s \| 110–130 °C for 60–120 s \| Lower soak temperature \|
	29	+\| Peak (Reflow) \| 210–225 °C \| 160–170 °C \| ~50 °C lower peak \|
	30	+\| Time Above Liquidus (TAL) \| 30–90 s \| 30–90 s \| Similar duration \|
	31	+\| Cooling Rate \| 2–4 °C/s \| 2–4 °C/s \| Avoid fast cooling to prevent cracks \|
	32	+
	33	+---
	34	+
	35	+### ⚙️ 3. Process Considerations
	36	+
	37	+\| Factor \| Sn63/Pb37 \| Sn42/Bi58 \|
	38	+\|--------\|------------\|------------\|
	39	+\| Heat Sensitivity \| Suitable for most PCBs \| Safer for heat-sensitive components (e.g. LEDs, flexible PCBs) \|
	40	+\| Joint Reliability \| Ductile, strong \| Brittle — not ideal for high vibration or stress \|
	41	+\| Storage Stability \| Good \| Can age faster; store below 10 °C \|
	42	+\| Rework Temp \| ~250 °C \| ~180 °C \| Easier to rework Bi-based solder \|
	43	+
	44	+---
	45	+
	46	+### 🔍 4. When to Choose Each
	47	+
	48	+- Use 183 °C (Sn63/Pb37) for:
	49	+ - Traditional boards
	50	+ - High mechanical or thermal cycling requirements
	51	+ - Non-RoHS projects
	52	+
	53	+- Use 138 °C (Sn42/Bi58) for:
	54	+ - Low-temp, heat-sensitive assemblies (e.g. OLED, sensors, flex PCBs)
	55	+ - Second-stage soldering (after high-temp parts are mounted)
	56	+ - RoHS-compliant builds needing minimal thermal stress
	57	+
	58	+---
	59	+
	60	+### 🧭 5. Example Temperature Profile (for reference)
	61	+
	62	+#### 🔹 Sn63/Pb37
	63	+
	64	+ Preheat: 25 → 150 °C @ 2 °C/s
	65	+ Soak: 150–170 °C for 90 s
	66	+ Peak: 215 °C for 45 s (TAL ~60 s)
	67	+ Cool: 3 °C/s
	68	+
	69	+#### 🔹 Sn42/Bi58
	70	+
	71	+ Preheat: 25 → 110 °C @ 1.5 °C/s
	72	+ Soak: 110–130 °C for 90 s
	73	+ Peak: 165 °C for 45 s (TAL ~60 s)
	74	+ Cool: 2 °C/s
	75	+
	76	+
	77	+
	78	+
	79	+
	80	+
6	81	## Causes of Solder Splashes / Solder Balls After Reflow Soldering
7	82
8	83	### 1. Solder Paste Issues

...	...	@@ -0,0 +1,5 @@
	1	+
	2	+# fab-PNP-machine-dat
	3	+
	4	+
	5	+- [[openpnp-dat]]
...	...	\ No newline at end of file

...	...	@@ -0,0 +1,23 @@
	1	+
	2	+# sheet-metal-fab-dat
	3	+
	4	+- Supported 3D (required) formats: .step, .stp; Supported 2D formats: dwg, dxf, pdf; Compressed packages (zip, rar) can be uploaded directly.
	5	+- Supports unified ordering for multiple parts in a compressed package; file names for 2D files, BOM lists, etc., need to be consistent (number of files per upload ≤20, individual file size <100M).
	6	+- If there are assembly relationships between parts, it is strongly recommended that you upload an assembly STEP file.
	7	+
	8	+
	9	+## Examples Stainless Steel 201
	10	+
	11	+- the following bending rack price == 20RM == 3 USD
	12	+
	13	+![](2025-06-16-12-38-08.png)
	14	+
	15	+## Example Plastic PP PE Sheet
	16	+
	17	+
	18	+
	19	+unit == mm, color == black
	20	+
	21	+## ref
	22	+
	23	+- [[CAD-dat]]
...	...	\ No newline at end of file

...	...	@@ -0,0 +1,10 @@
	1	+
	2	+# workspace-dat
	3	+
	4	+- [[heatbed-dat]]
	5	+
	6	+
	7	+
	8	+## ref
	9	+
	10	+- [[workspace]]
...	...	\ No newline at end of file

...	...	@@ -1,23 +0,0 @@
1		-
2		-# sheet-metal-fab-dat
3		-
4		-- Supported 3D (required) formats: .step, .stp; Supported 2D formats: dwg, dxf, pdf; Compressed packages (zip, rar) can be uploaded directly.
5		-- Supports unified ordering for multiple parts in a compressed package; file names for 2D files, BOM lists, etc., need to be consistent (number of files per upload ≤20, individual file size <100M).
6		-- If there are assembly relationships between parts, it is strongly recommended that you upload an assembly STEP file.
7		-
8		-
9		-## Examples Stainless Steel 201
10		-
11		-- the following bending rack price == 20RM == 3 USD
12		-
13		-![](2025-06-16-12-38-08.png)
14		-
15		-## Example Plastic PP PE Sheet
16		-
17		-
18		-
19		-unit == mm, color == black
20		-
21		-## ref
22		-
23		-- [[CAD-dat]]
...	...	\ No newline at end of file

...	...	@@ -2,8 +2,12 @@
2	2	# info-dat
3	3
4	4
	5	+- [[opensource-dat]]
	6	+
	7	+
	8	+
	9	+
5	10	- [[allwinner-dat]]
6	11
7	12	- [[RMP-driver-dat]]
8	13
9		-- [[opensource-dat]]
...	...	\ No newline at end of file