e68e379f75f1a9cd4dff97c34b1580a8cf4ce719
PCB-dat/4-layer-dat/4-layer-dat.md
| ... | ... | @@ -1,6 +1,13 @@ |
| 1 | 1 | |
| 2 | 2 | # 4-layer-dat |
| 3 | 3 | |
| 4 | +## specs |
|
| 5 | + |
|
| 6 | +- inner layer == 0.5 oz |
|
| 7 | + |
|
| 8 | + |
|
| 9 | +## lamination |
|
| 10 | + |
|
| 4 | 11 | The typical lamination order for a 4-layer PCB is: |
| 5 | 12 | |
| 6 | 13 | - Top Layer: Signal layer |
| ... | ... | @@ -8,7 +15,7 @@ The typical lamination order for a 4-layer PCB is: |
| 8 | 15 | - Inner Layer 2: Ground plane (e.g., GND or VCC) |
| 9 | 16 | - Bottom Layer: Signal layer |
| 10 | 17 | |
| 11 | -## lamination order |
|
| 18 | +### lamination order |
|
| 12 | 19 | |
| 13 | 20 | "4-layer PCB stack-up: |
| 14 | 21 | |
| ... | ... | @@ -19,7 +26,7 @@ The typical lamination order for a 4-layer PCB is: |
| 19 | 26 | |
| 20 | 27 | Please follow this lamination order for manufacturing." |
| 21 | 28 | |
| 22 | -## 🔄 Typical 4-Layer Stackup (Example) |
|
| 29 | +### 🔄 Typical 4-Layer Stackup (Example) |
|
| 23 | 30 | |
| 24 | 31 | | Layer | Purpose | |
| 25 | 32 | |-------|-----------------------------| |
Tech-dat/BTB-dat/BTB-dat.md
| ... | ... | @@ -11,7 +11,7 @@ |
| 11 | 11 | |
| 12 | 12 | ## UN-common used |
| 13 | 13 | |
| 14 | -80P |
|
| 14 | +0.8mm 40P ~ 80P ~ 120P |
|
| 15 | 15 | |
| 16 | 16 |  |
| 17 | 17 |