BOM-DAT/CONN-FPC-dat/CONN-FPC-dat.md
... ...
@@ -1,91 +1,91 @@
1
-
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-# CONN-FPC-dat
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-
4
-
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-- [[CONN-FPC-dat]] - [[FPC-dat]]
6
-
7
-
8
-
9
-
10
-FFC usually means “Flat Flex Cable”
11
-
12
-- add [[test-point-dat]] for debugging
13
-
14
-
15
-## Info
16
-
17
-- common pitch 0.5 mm
18
-
19
-overview
20
-
21
-![](2025-08-19-15-24-47.png)
22
-
23
-- common pitch 1.0 mm
24
-
25
-## type
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-
27
-FPC down flip
28
-
29
-![](53-53-16-17-07-2023.png)
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-
31
-
32
-
33
-FPC upper flip
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-
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-![](41-53-16-17-07-2023.png)
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-
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-![](32-14-18-03-08-2023.png)
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-
39
-
40
-
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-
42
-## footprint
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-
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-THD0510－xxCL－GF == datasheet [[THD0510-xxCL-GF.pdf]]
45
-
46
-
47
-- FPC-SMD_9P-P0.50_THD0510-09CL-GF
48
-- FPC-SMD_5P-P0.50_THD0510-05CL-GF == 间距:0.5mm P数:5P 翻盖式 下接
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-
50
-![](2025-07-14-01-04-01.png)
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-
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-![](2025-07-14-01-04-59.png)
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-
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-
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-
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-## dimension
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-
58
-![](05-55-16-17-07-2023.png)
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-
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-
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-## soldering
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-
63
-Use low-temperature solder [[solder-paste-dat]] to tin the pads first, then clean the pads with board cleaning solution, brush on BGA soldering flux, and finally use a hot plate. The result is almost as good as factory production.
64
-
65
-
66
-## manu code
67
-
68
-- AFC01-S06FCA-00 == 下接
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-- AFC01-S18FCA-00 == 下接
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-- THD0510-05CL-GF == 上接
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-- THD0510-09CL-GF == 上接
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-
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-- 34P 上接
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-
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-
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-
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-## stiffener
78
-
79
-For ordering at JLCPCB, define a seperate layer for your stiffeners, like I did here:
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-
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-![](2025-08-28-15-39-53.png)
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-
83
-This design actually has an FR4 and a polyimide stiffener, so two layers.
84
-
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-## ref
86
-
87
-- [[soldering-dat]]
88
-
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-- [[FPC-fab-dat]]
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-
1
+
2
+# CONN-FPC-dat
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+
4
+
5
+- [[CONN-FPC-dat]] - [[FPC-dat]]
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+
7
+
8
+
9
+
10
+FFC usually means “Flat Flex Cable”
11
+
12
+- add [[test-point-dat]] for debugging
13
+
14
+
15
+## Info
16
+
17
+- common pitch 0.5 mm
18
+
19
+overview
20
+
21
+![](2025-08-19-15-24-47.png)
22
+
23
+- common pitch 1.0 mm
24
+
25
+## type
26
+
27
+FPC down flip
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+
29
+![](53-53-16-17-07-2023.png)
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+
31
+
32
+
33
+FPC upper flip
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+
35
+![](41-53-16-17-07-2023.png)
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+
37
+![](32-14-18-03-08-2023.png)
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+
39
+
40
+
41
+
42
+## footprint
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+
44
+THD0510－xxCL－GF == datasheet [[THD0510-xxCL-GF.pdf]]
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+
46
+
47
+- FPC-SMD_9P-P0.50_THD0510-09CL-GF
48
+- FPC-SMD_5P-P0.50_THD0510-05CL-GF == 间距:0.5mm P数:5P 翻盖式 下接
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+
50
+![](2025-07-14-01-04-01.png)
51
+
52
+![](2025-07-14-01-04-59.png)
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+
54
+
55
+
56
+## dimension
57
+
58
+![](05-55-16-17-07-2023.png)
59
+
60
+
61
+## soldering
62
+
63
+Use low-temperature solder [[solder-paste-dat]] to tin the pads first, then clean the pads with board cleaning solution, brush on BGA soldering flux, and finally use a hot plate. The result is almost as good as factory production.
64
+
65
+
66
+## manu code
67
+
68
+- AFC01-S06FCA-00 == 下接
69
+- AFC01-S18FCA-00 == 下接
70
+- THD0510-05CL-GF == 上接
71
+- THD0510-09CL-GF == 上接
72
+
73
+- 34P 上接
74
+
75
+
76
+
77
+## stiffener
78
+
79
+For ordering at JLCPCB, define a seperate layer for your stiffeners, like I did here:
80
+
81
+![](2025-08-28-15-39-53.png)
82
+
83
+This design actually has an FR4 and a polyimide stiffener, so two layers.
84
+
85
+## ref
86
+
87
+- [[soldering-dat]]
88
+
89
+- [[FPC-fab-dat]]
90
+
91 91
- [[FPC]] - [[FPC-socket]] - [[FPC-pin]]
... ...
\ No newline at end of file
Chip-cn-dat/ismartware-dat/SW6106-dat/2026-06-03-01-45-21.png
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Binary files /dev/null and b/Chip-cn-dat/ismartware-dat/SW6106-dat/2026-06-03-01-45-21.png differ
Chip-cn-dat/ismartware-dat/SW6106-dat/SW6106-dat.md
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+
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+# SW6106-dat
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+
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+- [[power-bank-dat]] - [[battery-charger-dat]] - [[battery-charge-boost-dat]] - [[fast-charge-protocols-dat]] - [[SW6106-dat]]
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+
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+![](2026-06-03-01-45-21.png)
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+
8
+The SW6106 is a highly integrated power management IC for fast charge power bank application.
9
+It integrates 4A switching charger, 18W synchronous boost, PD/QC/AFC/FCP/PE/SFCP fast charge
10
+protocol, fuel gauge and power controller. With simple external components, The SW6106 provides
11
+a turn-key high efficiency solution for fast charge battery management.
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+
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+2. Applications
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+• Power Bank
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+• Battery Powered Device
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+3. Features
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+• Switching Charger
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+➢ Current up to 4A , Efficiency up to 96%
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+➢ Support 4.2/4.3/4.35/4.4 Battery
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+Voltage
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+➢ Support Battery NTC Protection
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+➢ Thermal Regulation
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+• Synchronous Boost
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+➢ Power up to 18W, Efficiency up to 95%
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+➢ Support Wire Drop Compensation
26
+➢ Load Insert Detect and Auto Turn on
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+➢ Light Load Detect and Auto Turn off
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+• Output Fast Charge Protocol
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+➢ Support PD3.0/PD2.0
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+➢ Support QC3.0/QC2.0
31
+➢ Support AFC
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+➢ Support FCP
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+➢ Support PE2.0/PE1.1
34
+➢ Support SFCP
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+• Input Fast Charge Protocol
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+➢ Support PD3.0/PD2.0
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+➢ Support AFC
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+➢ Support FCP
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+• Type-C Interface
40
+➢ Support USB Type-C Specification
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+➢ Support try.SRC Role
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+• BC1.2 Module
43
+➢ Support BC1.2 DCP
44
+➢ Support Apple & Samsung Device
45
+• Lightning Decryption
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+➢ Support Lightning Decryption
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+• Fuel Gauge
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+➢ Include 12bit ADC
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+➢ Support Percent Display
50
+➢ Support Various Battery Voltage
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+➢ Support 3~5 LEDs
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+➢ Automatic Recognition of LED
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+Number
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+• WLED Driver
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+➢ Support WLED Driver
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+• Fast Charge LED
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+➢ Support Fast Charge LED Driver
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+• Key Support
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+➢ Support Push Key
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+• Protection
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+➢ Input Over Voltage Protection
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+➢ Output Over Current Protection
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+➢ Output Short Protection
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+➢ Charger Over Time Protection
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+➢ Charger Over Voltage Protection
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+➢ Over Temperature Protection
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+• I2C Interface
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+• QFN-40(6x6mm) Package
... ...
\ No newline at end of file
Chip-cn-dat/ismartware-dat/ismartware-dat.md
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@@ -1,46 +1,49 @@
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-
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-# ismartware-dat
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-
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-
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-
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-- [[ismartware-dat]] - [[SW6124-dat]] - [[SW6201-dat]] - [[SW3518-dat]]
7
-
8
-
9
-
10
-## SW3518
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-
12
-
13
-支持 PD 的多快充协议双口充电解决方案
14
-
15
-SW3518S 是一款高集成度的多快充协议双口充电芯片， 支持 A+C 口任意口快充输出， 支持双 口独立限流。 其集成了 5A 高效率同步降压变换器， 支持 PPS/PD/QC/AFC/FCP/SCP/PE/SFCP/VOOC 等多种快充协议， 最大输出 PD 100W（20V@5A）， CC/CV 模式， 以及双口管理逻辑。 外围只需少 量的器件， 即可组成完整的高性能多快充协议双口充电解决方案。
16
-
17
-
18
-
19
-
20
-
21
-## SW3518 == 100W
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-
23
-
24
-- Supports all PPS 3.3-21V power levels
25
-- PPS maximum 3A, 63W
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-- PD maximum 20V 5A, 100W
27
-- PD above 60W requires a 100W data cable
28
-- Supports PPS/PD 3.0/PD 2.0
29
-- Supports QC4+/QC4/QC3.3/QC2.0, PE 2.0/PE 1.1
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-- Supports AFC/FCP/SFCP
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-- Supports VOOC (Generation 1): maximum 22.5W
32
-
33
-- 华为最大20wA口或者C口
34
-- 需要专用线只能A口OPP0一加最大20W真我不兼容VIV01Q00最大18W只能C口
35
-- 小米最大33w只能c口
36
-- 苹果全系支持（笔记本需要用100w专用双C线）只能C口三星支持全系C口
37
-- 注意由于OPPO私有协议原因对充电线要求很高，请尽可能
38
-- 购买品牌线
39
-- 重量：15g
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-- 充笔记本需要用100w专用双c线
41
-- 尺寸62.2*22*12mm
42
-
43
-
44
-## ref
45
-
1
+
2
+# ismartware-dat
3
+
4
+
5
+
6
+- [[ismartware-dat]] - [[SW6124-dat]] - [[SW6201-dat]] - [[SW3518-dat]]
7
+
8
+
9
+- [[power-bank-dat]] - [[battery-charger-dat]] - [[battery-charge-boost-dat]] - [[fast-charge-protocols-dat]] - [[SW6106-dat]] - [[ismartware-dat]]
10
+
11
+
12
+
13
+## SW3518
14
+
15
+
16
+支持 PD 的多快充协议双口充电解决方案
17
+
18
+SW3518S 是一款高集成度的多快充协议双口充电芯片， 支持 A+C 口任意口快充输出， 支持双 口独立限流。 其集成了 5A 高效率同步降压变换器， 支持 PPS/PD/QC/AFC/FCP/SCP/PE/SFCP/VOOC 等多种快充协议， 最大输出 PD 100W（20V@5A）， CC/CV 模式， 以及双口管理逻辑。 外围只需少 量的器件， 即可组成完整的高性能多快充协议双口充电解决方案。
19
+
20
+
21
+
22
+
23
+
24
+## SW3518 == 100W
25
+
26
+
27
+- Supports all PPS 3.3-21V power levels
28
+- PPS maximum 3A, 63W
29
+- PD maximum 20V 5A, 100W
30
+- PD above 60W requires a 100W data cable
31
+- Supports PPS/PD 3.0/PD 2.0
32
+- Supports QC4+/QC4/QC3.3/QC2.0, PE 2.0/PE 1.1
33
+- Supports AFC/FCP/SFCP
34
+- Supports VOOC (Generation 1): maximum 22.5W
35
+
36
+- 华为最大20wA口或者C口
37
+- 需要专用线只能A口OPP0一加最大20W真我不兼容VIV01Q00最大18W只能C口
38
+- 小米最大33w只能c口
39
+- 苹果全系支持（笔记本需要用100w专用双C线）只能C口三星支持全系C口
40
+- 注意由于OPPO私有协议原因对充电线要求很高，请尽可能
41
+- 购买品牌线
42
+- 重量：15g
43
+- 充笔记本需要用100w专用双c线
44
+- 尺寸62.2*22*12mm
45
+
46
+
47
+## ref
48
+
46 49
- [[power-bank-dat]]
... ...
\ No newline at end of file
Chip-dat/LMxx-dat/LM3914-dat/2026-06-03-02-04-19.png
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Binary files /dev/null and b/Chip-dat/LMxx-dat/LM3914-dat/2026-06-03-02-04-19.png differ
Chip-dat/LMxx-dat/LM3914-dat/LM3914-dat.md
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@@ -0,0 +1,14 @@
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+
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+
3
+# LM3914-dat
4
+
5
+- [[LMxx-dat]] - [[LM3914-dat]]
6
+
7
+LM3914是美国国家半导体公司的点状/条状显示驱动器，已经面市20多年了，LM3914可以精确的检测模拟电压，并使10个LED显示，显示方式点状模式点亮10个LED中的一个，或以条形模式逐个点亮LEDLM3914制作的电池电量显示，简单易懂，一目了然，让你随时知晓和掌控
8
+
9
+显示方式说明：显示电池上下限之间电压，分10档显示，每一灯亮代表电量显示的10%，10灯代表显示电量0%-100%范围，使电池的剩余电量一目了然；还可以改成单灯显示，就是显示只有一盏灯亮，更省电，单灯亮耗电4mA，全亮42mA
10
+
11
+
12
+![](2026-06-03-02-04-19.png)
13
+
14
+## ref
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\ No newline at end of file
Chip-dat/LMxx-dat/LMxx-dat.md
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@@ -1,18 +1,18 @@
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-
2
-# LMxx-dat
3
-
4
-
5
-- [[LMxx-dat]] - [[LM224-dat]]
6
-
7
-- [[74xx-dat]] - [[LMxx-dat]] - [[CDxx-dat]]
8
-
9
-- [[LM324-dat]] - [[LM358-dat]] - [[LM386-dat]] - [[LM393-dat]] - [[LM7705-dat]]
10
-
11
-- [[LM321-dat]] - [[LM358-dat]] - [[LM339-dat]]
12
-
13
-
14
-
15
-
16
-## ref
17
-
1
+
2
+# LMxx-dat
3
+
4
+
5
+- [[LMxx-dat]] - [[LM224-dat]]
6
+
7
+- [[74xx-dat]] - [[LMxx-dat]] - [[CDxx-dat]]
8
+
9
+- [[LM324-dat]] - [[LM358-dat]] - [[LM386-dat]] - [[LM393-dat]] - [[LM7705-dat]]
10
+
11
+- [[LM321-dat]] - [[LM358-dat]] - [[LM339-dat]]
12
+
13
+
14
+- [[LMxx-dat]] - [[LM3914-dat]]
15
+
16
+## ref
17
+
18 18
- [[TI-dat]]
... ...
\ No newline at end of file
Chip-dat/qualcomm-dat/CSR-dat/CSR8645-dat/CSR8645-dat.md
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@@ -0,0 +1,10 @@
1
+
2
+
3
+# CSR8645-dat
4
+
5
+- [[qualcomm-dat]] - [[BT-audio-dat]] - [[CSR8645-dat]] - [[CSR8635-dat]] - [[CSR-dat]]
6
+
7
+
8
+## ref
9
+
10
+- [[BT-audio]] - [[bluetooth]]
Chip-dat/qualcomm-dat/qualcomm-dat.md
... ...
@@ -1,32 +1,36 @@
1
-
2
-# qualcomm-dat
3
-
4
-- [[CSRA64215-dat]]
5
-
6
-- [[A212-dat]] platform
7
-
8
-- [[qualcomm-dat]] - [[BT-audio-dat]] - [[NBL1080-dat]] - [[CSRA64215-dat]]
9
-
10
-- CSR8645, CSR8635, CSR8625, CSR8615, CSR8605, CSR8640, CSR8630, CSR8620, CSR8610, CSR8600
11
-
12
-- [[qualcomm-dat]] - [[BT-audio-dat]]
13
-
14
-
15
-- [[CSR8635-dat]] - [[CSR-dat]]
16
-
17
-
18
-
19
-- [[bt-audio-dat]]
20
-
21
-- [[CSR8645-dat]] - [[CSR8635-dat]]
22
-
23
-
24
-
25
-## board
26
-
27
-- [[NBL1055-dat]]
28
-
29
-
30
-## ref
31
-
32
-- [[bt-audio-dat]]
... ...
\ No newline at end of file
0
+
1
+# qualcomm-dat
2
+
3
+- [[CSRA64215-dat]]
4
+
5
+- [[A212-dat]] platform
6
+
7
+- [[qualcomm-dat]] - [[BT-audio-dat]] - [[NBL1080-dat]] - [[CSRA64215-dat]]
8
+
9
+- CSR8645, CSR8635, CSR8625, CSR8615, CSR8605, CSR8640, CSR8630, CSR8620, CSR8610, CSR8600
10
+
11
+- [[qualcomm-dat]] - [[BT-audio-dat]]
12
+
13
+
14
+- [[CSR8635-dat]] - [[CSR-dat]]
15
+
16
+
17
+
18
+- [[bt-audio-dat]]
19
+
20
+- [[CSR8645-dat]] - [[CSR8635-dat]] - [[qualcomm-dat]] - [[BT-audio-dat]] - [[CSR8675-dat]]
21
+
22
+- [[QCC3084-dat]] - [[QCC5181-dat]] - [[QCC5125-dat]] - [[QCC3034-dat]] - [[QCC3095-dat]] - [[QCC3094-dat]] - [[qualcomm-dat]] - [[BT-audio-dat]]
23
+
24
+
25
+
26
+
27
+
28
+## board
29
+
30
+- [[NBL1055-dat]]
31
+
32
+
33
+## ref
34
+
35
+- [[bt-audio-dat]] - [[bt-audio]] - [[bluetooth]]
... ...
\ No newline at end of file
Network-dat/Bluetooth-dat/bt-audio-dat/bt-audio-dat.md
... ...
@@ -1,90 +1,92 @@
1
-
2
-# bt-audio-dat
3
-
4
-
5
-
6
-[legacy wiki page](https://www.electrodragon.com/w/Category:BT_Audio)
7
-
8
-## tech
9
-
10
-- [[bluetooth-dat]]
11
-
12
-- [[amplifier-audio-dat]]
13
-
14
-
15
-## boards
16
-
17
-- [[NBL1037-dat]] - [[NBL1038-dat]] - [[NBL1097-dat]]
18
-
19
-- [[NBL1111-dat]] - [[NBL1115-dat]]
20
-
21
-
22
-
23
-
24
-
25
-## decodec board
26
-
27
-- [[AMP1006-dat]]
28
-
29
-
30
-
31
-## chip
32
-
33
-- [[qualcomm-dat]]
34
-
35
-- [[CSR8645-dat]] - [[CSR8635-dat]] == [[NBL1050-dat]] - [[NBL1051-dat]] - [[NBL1054-dat]] - [[NBL1055-dat]]
36
-
37
-
38
-
39
-- [[CSRA64215-dat]] == [[NBL1083-dat]] - [[NBL1084-dat]] - [[NBL1084-dat]]
40
-
41
-- [[beken-dat]] - [[NBL1111-dat]] - [[NBL1115-dat]]
42
-
43
-- [[JieLi-dat]]
44
-
45
-
46
-
47
-
48
-### chip compare
49
-
50
-| Chip Model | Manufacturer | Ver. | aptX | Codec | Power Efficiency | Lifetime Status | Notable Features | Ideal Use Case |
51
-| --------------- | ------------------- | ---- | ------------- | --------------------------- | ---------------- | --------------- | ---------------------------------------------- | ---------------------------- |
52
-| CSR64215 | [[Qualcomm-dat]] | 4.2 | Yes | SBC, AAC, aptX | High | EOL | Low power, high-quality audio | Wireless audio devices |
53
-| QCC3031 | [[Qualcomm-dat]] | 5.0 | Yes (aptX HD) | SBC, AAC, aptX HD | High | Active | Advanced Bluetooth audio, low-power design | Bluetooth audio products |
54
-| QCC5181 | [[Qualcomm-dat]] | 5.2 | Yes (aptX HD) | SBC, AAC, aptX HD, LE Audio | Very High | Active | TrueWireless Mirroring, LE Audio support | Modern Bluetooth headphones |
55
-| CSR8675 | [[Qualcomm-dat]] | 4.2 | Yes (aptX HD) | SBC, AAC, aptX HD | Moderate | Active | aptX HD, premium audio features | High-end headphones/speakers |
56
-| CSR8645 | [[Qualcomm-dat]] | 4.0 | Yes | SBC, AAC, aptX | Moderate | EOL | Mid-range audio support | Affordable audio devices |
57
-| CSR8635 | [[Qualcomm-dat]] | 4.0 | Yes | SBC, AAC, aptX | Moderate | EOL | Budget-friendly with aptX | Low-cost audio solutions |
58
-| QCC3003/QCC3008 | [[Qualcomm-dat]] | 5.0 | Yes | SBC, AAC, aptX, TWS+ | Very High | Active | TrueWireless Stereo, low power | Modern Bluetooth audio |
59
-| nRF52832 | [[Nordic-dat]] | 5.0 | No | SBC | High | Active | Low-energy profile, flexible for IoT and audio | IoT and general Bluetooth |
60
-| CC2564C | [[TI-bt-audio-dat]] | 4.1 | No | SBC | Moderate | Active | Dual-mode (Classic + Low Energy) | IoT and audio solutions |
61
-| ATS2825 | Actions Semi | 5.0 | No | SBC | High | Active | Cost-effective, supports basic audio | Budget Bluetooth devices |
62
-| RTL8763B | [[Realtek-dat]] | 5.0 | No | SBC, AAC | High | Active | Low latency, reliable for TWS earbuds | True Wireless Earbuds |
63
-| [[BK8000-dat]] | [[beken-dat]] |
64
-| [[BK3266-dat]] | [[beken-dat]] | 5.0 |
65
-
66
-
67
-## chip solutions
68
-
69
-- [[qualcomm-dat]] - [[Nordic-dat]] - [[TI-bt-audio-dat]] - [[Dialog-dat]]
70
-
71
-CN - [[Actions-Semi-dat]] - [[RDA-dat]] - [[Beken-dat]] - [[jieli-dat]]
72
-asia - [[airoha-dat]] - [[Realtek-dat]]
73
-
74
-## bluetooth 5.0
75
-
76
-Bluetooth 5.0 does support longer range but with a 10 meters range this solution clearly does not take advantage of this new feature. Bluetooth 5 announcement did not include any specific about audio improvement, So I had a look at a Bluetooth 5 paper, and audio is mentioned three times:
77
-
78
-- Bluetooth 5 introduces the ability to perform periodic data to be broadcast, it’s possible to chain packets and deterministic advertising, which allows scanners together and for each packet to contain a different to synchronicity their scanning for packets with the subset of the whole data set. Schedule of the advertising device. This can be a more power-efficient way to perform scanning and is also likely to pave the way for new uses of Bluetooth LE in connection-less scenarios, such as audio applications
79
-- The Bluetooth 4 channel selection algorithm used in frequency hopping produced only 12 distinct sequences of channels and all packets in a given connection event would use the same channel, which is not optimal for some applications, such as audio. Bluetooth 5 introduced a new channel selection algorithm called channel selection algorithm #2. Hopping sequences are now pseudo random and the distinct sequences which are possible are very large.
80
-- Bluetooth’s advertising extensions feature will pave the way for next-generation beacons, advanced audio applications and more.
81
-
82
-
83
-
84
-## ref
85
-
86
-- [[I2S-dat]] - [[Analog-audio-dat]] - [[TP6132-dat]]
87
-
88
-- [[NBL1050-dat]] - [[NBL1054-dat]] - [[NBL1055-dat]]
89
-
1
+
2
+# bt-audio-dat
3
+
4
+
5
+
6
+[legacy wiki page](https://www.electrodragon.com/w/Category:BT_Audio)
7
+
8
+## tech
9
+
10
+- [[bluetooth-dat]]
11
+
12
+- [[amplifier-audio-dat]]
13
+
14
+
15
+## boards
16
+
17
+- [[NBL1037-dat]] - [[NBL1038-dat]] - [[NBL1097-dat]]
18
+
19
+- [[NBL1111-dat]] - [[NBL1115-dat]]
20
+
21
+
22
+
23
+
24
+
25
+## decodec board
26
+
27
+- [[AMP1006-dat]]
28
+
29
+
30
+
31
+## chip
32
+
33
+- [[qualcomm-dat]]
34
+
35
+- [[CSR8645-dat]] - [[CSR8635-dat]] == [[NBL1050-dat]] - [[NBL1051-dat]] - [[NBL1054-dat]] - [[NBL1055-dat]]
36
+
37
+
38
+
39
+- [[CSRA64215-dat]] == [[NBL1083-dat]] - [[NBL1084-dat]] - [[NBL1084-dat]]
40
+
41
+- [[beken-dat]] - [[NBL1111-dat]] - [[NBL1115-dat]]
42
+
43
+- [[JieLi-dat]]
44
+
45
+- [[CSR8645-dat]] - [[CSR8635-dat]] - [[qualcomm-dat]] - [[BT-audio-dat]] - [[CSR8675-dat]]
46
+
47
+- [[QCC3084-dat]] - [[QCC5181-dat]] - [[QCC5125-dat]] - [[QCC3034-dat]] - [[QCC3095-dat]] - [[QCC3094-dat]] - [[qualcomm-dat]] - [[BT-audio-dat]]
48
+
49
+
50
+### chip compare
51
+
52
+| Chip Model | Manufacturer | Ver. | aptX | Codec | Power Efficiency | Lifetime Status | Notable Features | Ideal Use Case |
53
+| --------------- | ------------------- | ---- | ------------- | --------------------------- | ---------------- | --------------- | ---------------------------------------------- | ---------------------------- |
54
+| CSR64215 | [[Qualcomm-dat]] | 4.2 | Yes | SBC, AAC, aptX | High | EOL | Low power, high-quality audio | Wireless audio devices |
55
+| QCC3031 | [[Qualcomm-dat]] | 5.0 | Yes (aptX HD) | SBC, AAC, aptX HD | High | Active | Advanced Bluetooth audio, low-power design | Bluetooth audio products |
56
+| QCC5181 | [[Qualcomm-dat]] | 5.2 | Yes (aptX HD) | SBC, AAC, aptX HD, LE Audio | Very High | Active | TrueWireless Mirroring, LE Audio support | Modern Bluetooth headphones |
57
+| CSR8675 | [[Qualcomm-dat]] | 4.2 | Yes (aptX HD) | SBC, AAC, aptX HD | Moderate | Active | aptX HD, premium audio features | High-end headphones/speakers |
58
+| CSR8645 | [[Qualcomm-dat]] | 4.0 | Yes | SBC, AAC, aptX | Moderate | EOL | Mid-range audio support | Affordable audio devices |
59
+| CSR8635 | [[Qualcomm-dat]] | 4.0 | Yes | SBC, AAC, aptX | Moderate | EOL | Budget-friendly with aptX | Low-cost audio solutions |
60
+| QCC3003/QCC3008 | [[Qualcomm-dat]] | 5.0 | Yes | SBC, AAC, aptX, TWS+ | Very High | Active | TrueWireless Stereo, low power | Modern Bluetooth audio |
61
+| nRF52832 | [[Nordic-dat]] | 5.0 | No | SBC | High | Active | Low-energy profile, flexible for IoT and audio | IoT and general Bluetooth |
62
+| CC2564C | [[TI-bt-audio-dat]] | 4.1 | No | SBC | Moderate | Active | Dual-mode (Classic + Low Energy) | IoT and audio solutions |
63
+| ATS2825 | Actions Semi | 5.0 | No | SBC | High | Active | Cost-effective, supports basic audio | Budget Bluetooth devices |
64
+| RTL8763B | [[Realtek-dat]] | 5.0 | No | SBC, AAC | High | Active | Low latency, reliable for TWS earbuds | True Wireless Earbuds |
65
+| [[BK8000-dat]] | [[beken-dat]] |
66
+| [[BK3266-dat]] | [[beken-dat]] | 5.0 |
67
+
68
+
69
+## chip solutions
70
+
71
+- [[qualcomm-dat]] - [[Nordic-dat]] - [[TI-bt-audio-dat]] - [[Dialog-dat]]
72
+
73
+CN - [[Actions-Semi-dat]] - [[RDA-dat]] - [[Beken-dat]] - [[jieli-dat]]
74
+asia - [[airoha-dat]] - [[Realtek-dat]]
75
+
76
+## bluetooth 5.0
77
+
78
+Bluetooth 5.0 does support longer range but with a 10 meters range this solution clearly does not take advantage of this new feature. Bluetooth 5 announcement did not include any specific about audio improvement, So I had a look at a Bluetooth 5 paper, and audio is mentioned three times:
79
+
80
+- Bluetooth 5 introduces the ability to perform periodic data to be broadcast, it’s possible to chain packets and deterministic advertising, which allows scanners together and for each packet to contain a different to synchronicity their scanning for packets with the subset of the whole data set. Schedule of the advertising device. This can be a more power-efficient way to perform scanning and is also likely to pave the way for new uses of Bluetooth LE in connection-less scenarios, such as audio applications
81
+- The Bluetooth 4 channel selection algorithm used in frequency hopping produced only 12 distinct sequences of channels and all packets in a given connection event would use the same channel, which is not optimal for some applications, such as audio. Bluetooth 5 introduced a new channel selection algorithm called channel selection algorithm #2. Hopping sequences are now pseudo random and the distinct sequences which are possible are very large.
82
+- Bluetooth’s advertising extensions feature will pave the way for next-generation beacons, advanced audio applications and more.
83
+
84
+
85
+
86
+## ref
87
+
88
+- [[I2S-dat]] - [[Analog-audio-dat]] - [[TP6132-dat]]
89
+
90
+- [[NBL1050-dat]] - [[NBL1054-dat]] - [[NBL1055-dat]]
91
+
90 92
- [[audio-dat]] - [[amplifier-audio-dat]]
... ...
\ No newline at end of file
Tech-dat/tech-dat.md
... ...
@@ -7,7 +7,7 @@
7 7
8 8
- [[board-dat]] - [[board-new-dat]] - [[chip-dat]] - [[chip-cn-dat]] - [[glob-top-dat]]
9 9
10
-- [[app-dat]] - [[rc-apps-dat]] - [[rc-boat-dat]]
10
+- [[app-dat]] - [[rc-apps-dat]] - [[rc-boat-dat]] - [[rc-rover-dat]]
11 11
12 12
- [[circuits-dat]]
13 13
app-dat/RC-apps-dat/rc-rover-dat/2026-06-03-01-50-35.png
... ...
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app-dat/RC-apps-dat/rc-rover-dat/2026-06-03-01-51-59.png
... ...
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app-dat/RC-apps-dat/rc-rover-dat/2026-06-03-01-52-16.png
... ...
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app-dat/RC-apps-dat/rc-rover-dat/rc-rover-dat.md
... ...
@@ -1,141 +1,146 @@
1
-
2
-# rover-dat
3
-
4
-- [[ardupilot-dat]] - [[rc-dat]]
5
-
6
-
7
-
8
-- [[RC-car-dat]] - [[rover-dat]] - [[RC-car-hack-dat]]
9
-
10
-- [[rc-signal-dat]]
11
-
12
-- ARKV6X Flight Controller Overview
13
-- ARK FPV Flight Controller Overview == STM32H743IIK6 MCU
14
-- CUAV V5 Plus Overview == STM32F765
15
-
16
-- [[motor-rover-dat]]
17
-
18
-
19
-## build types
20
-
21
-- [[rc-car-toy-dat]] - [[rc-car-dat]] - [[Curiosity-rover-dat]] - [[app-remote-rover-dat]] - [[tank-dat]] - [[rc-vehicles-dat]]
22
-
23
-
24
-
25
-
26
-## features
27
-
28
-- [[servo-dat]] - [[gimbal]] to take action or control [[sensor-Camera-dat]]
29
-
30
-- [[DCDC-down-dat]]
31
-
32
-- [[ELRS-dat]] - [[RC-dat]]
33
-
34
-- [[relay-dat]] - [[mosfet-dat]] - [[acturator-dat]] conrol
35
-
36
-- [[pump-dat]] - water shoot
37
-
38
-- [[buzzer-dat]] - sound alarm
39
-
40
-- [[selfie-stick-dat]]
41
-
42
-- [[USB-dat]] - [[power-dat]] charge
43
-
44
-- [[ADC-dat]] - [[battery-dat]] monitor
45
-
46
-- [[network-dat]] - communication - [[A7670-dat]]
47
-
48
-- [[location-dat]]
49
-
50
-
51
-## mechanics
52
-
53
-- [[suspension-dat]] - [[mechanics-dat]] - [[chassis-dat]] - [[wheels-dat]] - [[shaft-connector-dat]]
54
-
55
-
56
-
57
-
58
-
59
-
60
-## boards
61
-
62
-- [[SDR1064-dat]] - [[SDR1117-dat]]
63
-
64
-
65
-
66
-## rover info
67
-
68
-![](2025-11-27-15-32-34.png)
69
-
70
-## stroller version
71
-
72
-![](2025-11-27-15-33-49.png)
73
-
74
-![](2025-11-27-15-34-08.png)
75
-
76
-
77
-
78
-## code
79
-
80
-- [[RC-code-dat]]
81
-
82
-
83
-
84
-## 3D printed
85
-
86
-- [[markus-rover-dat]]
87
-
88
-
89
-### 3D files
90
-
91
-![](2025-05-23-15-11-02.png)
92
-
93
-[differential drive robot](https://cad.onshape.com/documents/78baf3d450629341539223b8/w/67b1d15167c8efd1d8242192/e/0e64a58d61cf14a49375d9c6?renderMode=0&uiState=68301fdbbe87bf505c7cb858)
94
-
95
-[TT Motor 4WD Car Mecanum wheel](https://cad.onshape.com/documents/ffe6ad9ac868a2e0b125a547/w/06961ea3665cb10f47c1f6fe/e/c6b6790270216188fea6ddec?renderMode=0&uiState=6830205c37d051363fada807)
96
-
97
-[Another TT Motor 4WD Car Mecanum wheel](https://cad.onshape.com/documents/3fc9a68709b7b211c126b7b0/w/fd59e3cfbe0cf012d3264ef8/e/f35859a1e063a8642be26811?renderMode=0&uiState=68302088624d574aaab00cc0)
98
-
99
-
100
-
101
-
102
-
103
-## board 2
104
-
105
-- [[ESP32-dat]] - [[ELRS-dat]]
106
-
107
-## board
108
-
109
-- [[SDR1064-dat]]
110
-
111
-chip based [[PCA9685-dat]], [[L293-dat]], [[L298-dat]], [[TB6612-dat]] see more at [[motor-driver-dat]]
112
-
113
-Parts - [[TT-motor-dat]] - [[mecanum-wheel-dat]]
114
-
115
-
116
-## Rover Price and BOM cost 4WD
117
-
118
-- 4x 125mm [[wheel-dat]] plus [[shaft-connector-dat]] = 4x $3 == $12
119
-- 4x 100KG [[Motor-reduction-Gear-dat]] == 4x $11 = $44
120
-- [[sheet-dat]] built frame == $5
121
-- 4x [[motor-driver-dat]] plus [[MCU-dat]] == 4x $2 + 1x $2 == $10
122
-- 1x [[battery-dat]] == $5
123
-- 1x [[battery-charger-dat]] == $1
124
-
125
-subtotal == $77
126
-
127
-
128
-
129
-
130
-
131
-
132
-
133
-## ref
134
-
135
-- [[dc-motor-dat]] - [[motor-driver-dat]] - [[motor-dat]] - [[servo-dat]]
136
-
137
-- [[motor-rover-dat]]
138
-
139
-- [[rc-car]] - [[maker]]
140
-
1
+
2
+# rover-dat
3
+
4
+- [[ardupilot-dat]] - [[rc-dat]]
5
+
6
+
7
+
8
+- [[RC-car-dat]] - [[rover-dat]] - [[RC-car-hack-dat]]
9
+
10
+- [[rc-signal-dat]]
11
+
12
+- ARKV6X Flight Controller Overview
13
+- ARK FPV Flight Controller Overview == STM32H743IIK6 MCU
14
+- CUAV V5 Plus Overview == STM32F765
15
+
16
+- [[motor-rover-dat]]
17
+
18
+
19
+## build types
20
+
21
+- [[rc-car-toy-dat]] - [[rc-car-dat]] - [[Curiosity-rover-dat]] - [[app-remote-rover-dat]] - [[tank-dat]] - [[rc-vehicles-dat]]
22
+
23
+
24
+
25
+
26
+## features
27
+
28
+- [[servo-dat]] - [[gimbal]] to take action or control [[sensor-Camera-dat]]
29
+
30
+- [[DCDC-down-dat]]
31
+
32
+- [[ELRS-dat]] - [[RC-dat]]
33
+
34
+- [[relay-dat]] - [[mosfet-dat]] - [[acturator-dat]] conrol
35
+
36
+- [[pump-dat]] - water shoot
37
+
38
+- [[buzzer-dat]] - sound alarm
39
+
40
+- [[selfie-stick-dat]]
41
+
42
+- [[USB-dat]] - [[power-dat]] charge
43
+
44
+- [[ADC-dat]] - [[battery-dat]] monitor
45
+
46
+- [[network-dat]] - communication - [[A7670-dat]]
47
+
48
+- [[location-dat]]
49
+
50
+
51
+## mechanics
52
+
53
+- [[suspension-dat]] - [[mechanics-dat]] - [[chassis-dat]] - [[wheels-dat]] - [[shaft-connector-dat]]
54
+
55
+
56
+
57
+
58
+
59
+
60
+## boards
61
+
62
+- [[SDR1064-dat]] - [[SDR1117-dat]]
63
+
64
+
65
+
66
+## rover info
67
+
68
+![](2025-11-27-15-32-34.png)
69
+
70
+## stroller version
71
+
72
+![](2025-11-27-15-33-49.png)
73
+
74
+![](2025-11-27-15-34-08.png)
75
+
76
+
77
+
78
+## code
79
+
80
+- [[RC-code-dat]]
81
+
82
+
83
+
84
+## 3D printed
85
+
86
+- [[markus-rover-dat]]
87
+
88
+
89
+### 3D files
90
+
91
+![](2025-05-23-15-11-02.png)
92
+
93
+[differential drive robot](https://cad.onshape.com/documents/78baf3d450629341539223b8/w/67b1d15167c8efd1d8242192/e/0e64a58d61cf14a49375d9c6?renderMode=0&uiState=68301fdbbe87bf505c7cb858)
94
+
95
+[TT Motor 4WD Car Mecanum wheel](https://cad.onshape.com/documents/ffe6ad9ac868a2e0b125a547/w/06961ea3665cb10f47c1f6fe/e/c6b6790270216188fea6ddec?renderMode=0&uiState=6830205c37d051363fada807)
96
+
97
+[Another TT Motor 4WD Car Mecanum wheel](https://cad.onshape.com/documents/3fc9a68709b7b211c126b7b0/w/fd59e3cfbe0cf012d3264ef8/e/f35859a1e063a8642be26811?renderMode=0&uiState=68302088624d574aaab00cc0)
98
+
99
+
100
+
101
+
102
+
103
+## board 2
104
+
105
+- [[ESP32-dat]] - [[ELRS-dat]]
106
+
107
+## board
108
+
109
+- [[SDR1064-dat]]
110
+
111
+chip based [[PCA9685-dat]], [[L293-dat]], [[L298-dat]], [[TB6612-dat]] see more at [[motor-driver-dat]]
112
+
113
+Parts - [[TT-motor-dat]] - [[mecanum-wheel-dat]]
114
+
115
+
116
+## Rover Price and BOM cost 4WD
117
+
118
+- 4x 125mm [[wheel-dat]] plus [[shaft-connector-dat]] = 4x $3 == $12
119
+- 4x 100KG [[Motor-reduction-Gear-dat]] == 4x $11 = $44
120
+- [[sheet-dat]] built frame == $5
121
+- 4x [[motor-driver-dat]] plus [[MCU-dat]] == 4x $2 + 1x $2 == $10
122
+- 1x [[battery-dat]] == $5
123
+- 1x [[battery-charger-dat]] == $1
124
+
125
+subtotal == $77
126
+
127
+
128
+
129
+## build
130
+
131
+![](2026-06-03-01-50-35.png)
132
+
133
+![](2026-06-03-01-51-59.png)
134
+
135
+![](2026-06-03-01-52-16.png)
136
+
137
+
138
+## ref
139
+
140
+- [[dc-motor-dat]] - [[motor-driver-dat]] - [[motor-dat]] - [[servo-dat]]
141
+
142
+- [[motor-rover-dat]]
143
+
144
+- [[rc-car]] - [[maker]]
145
+
141 146
- [[rover-v2]]
... ...
\ No newline at end of file
app-dat/power-bank-dat/power-bank-dat.md
... ...
@@ -1,91 +1,91 @@
1
-
2
-# power-bank-dat
3
-
4
-
5
-- [[PMIC-dat]] - [[power-dat]]
6
-
7
-- [[power-UPS-dat]] - [[power-bank-dat]]
8
-
9
-
10
-
11
-## QC
12
-
13
-- 100W
14
- - [[IP2368-dat]] - [[IP236x-dat]]
15
-- 65W
16
-- digital display + [[QC-dat]] == 22.5W
17
-
18
-
19
-
20
-
21
-- [[SW6201-dat]] - [[ismartware-dat]] - [[SW3518-dat]]
22
-
23
-- [[IP5356-dat]] - [[injoinic-dat]] - [[IP5306-dat]]
24
-
25
-- [[battery-protection-dat]] - [[battery-dat]]
26
-
27
-- [[TPS6123x-dat]] - [[TI-power-dcdc-boost-dat]]
28
-
29
-- [[LDR5108-dat]] - [[Legendary-dat]] - [[power-bank-dat]]
30
-
31
-- [[ETA-solutions-dat]]
32
-
33
-
34
-
35
-## products
36
-
37
-- [[MPS-dat]] - [[MP2636-dat]]
38
-
39
-![](2026-04-04-17-17-11.png)
40
-
41
-HOLTEK合泰电源总控单片机。== HT45SC428
42
-
43
-![](2026-04-04-17-21-34.png)
44
-
45
-![](2026-04-04-17-21-45.png)
46
-
47
-
48
-
49
-# portable-power-bank-dat
50
-
51
-### How Power Bank Capacity (e.g., 20000 mAh) is Calculated
52
-
53
-The capacity advertised on a power bank, such as 20000 mAh, typically represents the **total combined capacity of its internal battery cells**. Here's the breakdown:
54
-
55
-1. **Internal Battery Cells:**
56
- * Power banks contain one or more individual battery cells, usually Lithium-ion (Li-ion) or Lithium-polymer (Li-Po).
57
-
58
-2. **Individual Cell Capacity:**
59
- * Each internal cell has its own capacity rating, measured in milliampere-hours (mAh). Examples include 2500mAh, 3350mAh, 5000mAh per cell.
60
-
61
-3. **Parallel Connection:**
62
- * To achieve a higher total capacity, these individual cells are connected **in parallel** inside the power bank.
63
- * In a parallel circuit, the total capacity is the sum of the individual capacities.
64
-
65
-4. **Calculation Example:**
66
- * A 20000 mAh power bank might be constructed using:
67
- * 4 cells × 5000 mAh/cell = `20000 mAh`
68
- * 6 cells × ~3350 mAh/cell ≈ `20100 mAh` (often rounded down or marketed as 20000 mAh)
69
- * 8 cells × 2500 mAh/cell = `20000 mAh`
70
-
71
-**Key Considerations:**
72
-
73
-* **Cell Voltage:** This advertised capacity (e.g., 20000 mAh) is based on the **nominal voltage of the internal cells** (typically 3.6V or 3.7V).
74
-* **Output Voltage & Efficiency:** When charging a device, the power bank converts the internal cell voltage to the required output voltage (e.g., 5V, 9V, 12V via USB). This conversion process isn't 100% efficient; some energy is lost as heat.
75
-* **Rated Capacity:** Because of the voltage conversion and efficiency losses, the actual amount of charge delivered *to your device* at the output voltage will be lower than the internal cell capacity. This usable output is often listed separately as the **Rated Capacity** (e.g., "Rated Capacity: 12500mAh at 5V").
76
-
77
-
78
-## ref
79
-
80
-
81
-- [[injoinic-dat]] - [[IP5306-dat]] - [[IP5316-dat]]
82
-
83
-
84
-
85
-
86
-
87
-
88
-
89
-## ref
90
-
1
+
2
+# power-bank-dat
3
+
4
+
5
+- [[PMIC-dat]] - [[power-dat]]
6
+
7
+- [[power-UPS-dat]] - [[power-bank-dat]]
8
+
9
+
10
+
11
+## QC
12
+
13
+- 100W
14
+ - [[IP2368-dat]] - [[IP236x-dat]]
15
+- 65W
16
+- digital display + [[QC-dat]] == 22.5W
17
+
18
+
19
+
20
+
21
+- [[SW6201-dat]] - [[ismartware-dat]] - [[SW3518-dat]] - [[SW6106-dat]]
22
+
23
+- [[IP5356-dat]] - [[injoinic-dat]] - [[IP5306-dat]]
24
+
25
+- [[battery-protection-dat]] - [[battery-dat]]
26
+
27
+- [[TPS6123x-dat]] - [[TI-power-dcdc-boost-dat]]
28
+
29
+- [[LDR5108-dat]] - [[Legendary-dat]] - [[power-bank-dat]]
30
+
31
+- [[ETA-solutions-dat]]
32
+
33
+
34
+
35
+## products
36
+
37
+- [[MPS-dat]] - [[MP2636-dat]]
38
+
39
+![](2026-04-04-17-17-11.png)
40
+
41
+HOLTEK合泰电源总控单片机。== HT45SC428
42
+
43
+![](2026-04-04-17-21-34.png)
44
+
45
+![](2026-04-04-17-21-45.png)
46
+
47
+
48
+
49
+# portable-power-bank-dat
50
+
51
+### How Power Bank Capacity (e.g., 20000 mAh) is Calculated
52
+
53
+The capacity advertised on a power bank, such as 20000 mAh, typically represents the **total combined capacity of its internal battery cells**. Here's the breakdown:
54
+
55
+1. **Internal Battery Cells:**
56
+ * Power banks contain one or more individual battery cells, usually Lithium-ion (Li-ion) or Lithium-polymer (Li-Po).
57
+
58
+2. **Individual Cell Capacity:**
59
+ * Each internal cell has its own capacity rating, measured in milliampere-hours (mAh). Examples include 2500mAh, 3350mAh, 5000mAh per cell.
60
+
61
+3. **Parallel Connection:**
62
+ * To achieve a higher total capacity, these individual cells are connected **in parallel** inside the power bank.
63
+ * In a parallel circuit, the total capacity is the sum of the individual capacities.
64
+
65
+4. **Calculation Example:**
66
+ * A 20000 mAh power bank might be constructed using:
67
+ * 4 cells × 5000 mAh/cell = `20000 mAh`
68
+ * 6 cells × ~3350 mAh/cell ≈ `20100 mAh` (often rounded down or marketed as 20000 mAh)
69
+ * 8 cells × 2500 mAh/cell = `20000 mAh`
70
+
71
+**Key Considerations:**
72
+
73
+* **Cell Voltage:** This advertised capacity (e.g., 20000 mAh) is based on the **nominal voltage of the internal cells** (typically 3.6V or 3.7V).
74
+* **Output Voltage & Efficiency:** When charging a device, the power bank converts the internal cell voltage to the required output voltage (e.g., 5V, 9V, 12V via USB). This conversion process isn't 100% efficient; some energy is lost as heat.
75
+* **Rated Capacity:** Because of the voltage conversion and efficiency losses, the actual amount of charge delivered *to your device* at the output voltage will be lower than the internal cell capacity. This usable output is often listed separately as the **Rated Capacity** (e.g., "Rated Capacity: 12500mAh at 5V").
76
+
77
+
78
+## ref
79
+
80
+
81
+- [[injoinic-dat]] - [[IP5306-dat]] - [[IP5316-dat]]
82
+
83
+
84
+
85
+
86
+
87
+
88
+
89
+## ref
90
+
91 91
- [[app-dat]]
... ...
\ No newline at end of file
battery-dat/battery-charger-dat/battery-charge-boost-dat/battery-charge-boost-dat.md
... ...
@@ -11,6 +11,6 @@
11 11
12 12
- [[power-bank-dat]]
13 13
14
-
14
+- [[SW6106-dat]] - [[ismartware-dat]]
15 15
16 16
## ref
... ...
\ No newline at end of file
fab-dat/fab-PCB-soldering-dat/fab-soldering-materials-dat/fab-soldering-materials-dat.md
... ...
@@ -1,24 +0,0 @@
1
-
2
-
3
-# soldering-materials-dat
4
-
5
-
6
-
7
-- [[fab-PCB-dat]] - [[fab-PCB-soldering-dat]] - [[fab-PCB-soldering-tools-dat]] - [[fab-PCB-desoldering-dat]] - [[fab-soldering-materials-dat]]
8
-
9
-
10
-
11
-- [[solder-paste-dat]] - [[soldering-flux-dat]]
12
-
13
-- [[battery-strips-dat]]
14
-
15
-
16
-
17
-
18
-
19
-## ref
20
-
21
-- [[fab-PCB-soldering-tools-dat]]
22
-
23
-
24
-
fab-dat/fab-PCB-soldering-dat/fab-soldering-materials-dat/solder-paste-dat/2024-02-17-16-19-00.png
... ...
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fab-dat/fab-PCB-soldering-dat/fab-soldering-materials-dat/solder-paste-dat/2024-02-17-16-20-20.png
... ...
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fab-dat/fab-PCB-soldering-dat/fab-soldering-materials-dat/solder-paste-dat/2024-02-17-16-20-38.png
... ...
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fab-dat/fab-PCB-soldering-dat/fab-soldering-materials-dat/solder-paste-dat/2024-02-17-16-20-49.png
... ...
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fab-dat/fab-PCB-soldering-dat/fab-soldering-materials-dat/solder-paste-dat/2025-08-08-12-11-20.png
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fab-dat/fab-PCB-soldering-dat/fab-soldering-materials-dat/solder-paste-dat/solder-paste-dat.md
... ...
@@ -1,190 +0,0 @@
1
-
2
-# solder-paste-dat
3
-
4
-- [[high-precise-printing-dat]]
5
-
6
-- [[fab-PCB-soldering-dat]] - [[solder-paste-dat]]
7
-
8
-
9
-## supporting tools
10
-
11
-- [[syringe-dat]] - [[syringe-pusher-dat]]
12
-
13
-- [[Flux-Thinner-dat]]
14
-
15
-- [[soldering-flux-dat]]
16
-
17
-
18
-
19
-## Solder Paste Thinner: Essential Guidelines
20
-
21
-The liquid used to adjust the viscosity of solder paste is professionally referred to as **Solder Paste Thinner** (or Flux Thinner).
22
-
23
-**CRITICAL WARNING:** In professional electronics manufacturing, **it is generally discouraged to thin solder paste.** Solder paste is a carefully engineered chemical mixture. If it has dried out or expired, the flux activity and the rheology (flow characteristics) have already been degraded. Adding a thinner often results in:
24
-* **Bridge defects** during reflow.
25
-* **Solder beading** or "tombstoning" due to altered wetting properties.
26
-* **Voids** in the solder joint caused by improper solvent evaporation.
27
-
28
----
29
-
30
-### 1. Composition
31
-Specialized solder paste thinners typically consist of:
32
-* **Glycol Ethers (e.g., Propylene Glycol Ethers):** These are the primary solvents that dissolve the resin/rosin binder.
33
-* **Surfactants:** Added to maintain the thixotropic properties (the ability to flow under shear stress but stay stationary when idle).
34
-* **Stability Agents:** Prevent the metal particles from settling out of the flux medium.
35
-
36
-### 2. Best Practices for Use
37
-If you must attempt to salvage a paste (for non-critical prototyping), follow these strict rules:
38
-
39
-* **Use Only Professional Grade Thinner:** Do not use general solvents like acetone, lacquer thinner, or standard hardware store cleaners. These will chemically destroy the flux.
40
-* **Minimal Dosage:** Add only **1% to 3% by weight**. Adding too much will cause the paste to slump, leading to shorts between fine-pitch pads.
41
-* **Homogeneous Mixing:** Use a mechanical or manual spatula to stir the paste for at least 3-5 minutes until the consistency is uniform.
42
-* **Stabilization:** Let the paste sit for at least 30 minutes after mixing before using it to allow the chemical solvents to distribute evenly.
43
-
44
-
45
-
46
-### 3. Troubleshooting "Dry" Paste
47
-Before reaching for a thinner, check these common issues:
48
-* **Temperature (The #1 Culprit):** Solder paste must be stored in a refrigerator (typically 2°C–10°C). It **must** be brought to room temperature (naturally, in its container) for at least 2–4 hours before opening. If opened while cold, moisture from the air will condense into the paste, causing it to appear dry or gritty.
49
-* **Shelf Life:** Check the expiration date. Once the activator in the flux is exhausted, no amount of thinner will restore the paste's ability to create a reliable solder joint.
50
-
51
-### 4. Important Distinction
52
-* **Thinners:** Are for modifying the paste's viscosity.
53
-* **Cleaners (IPA/Alcohol):** Are for removing flux residues **after** soldering or cleaning stencils. **Never mix these into your solder paste.**
54
-
55
-
56
-
57
-## solder dross issue
58
-
59
-
60
-### How to Fix "Grey" or Oxidized Solder Joints
61
-
62
-Grey joints are usually caused by **overheating** (burning off the flux), **underheating** (cold joints), or **slow cooling**. Follow these steps to "refresh" the joints:
63
-
64
----
65
-
66
-### 1. The "Flux-and-Reflow" Method (Best for SMD)
67
-If the joint is just dull but the component is correctly aligned, **Flux** is your best friend.
68
-* **Apply Tacky Flux:** Cover the grey joints with a generous amount of high-quality "no-clean" or RMA tacky flux (e.g., Amtech NC-559).
69
-* **Re-apply Heat:** * **Hot Air Station:** Set to ~280°C - 300°C with low airflow. Heat the area until you see the solder turn liquid and "jump" into a shiny, spherical shape.
70
- * **Soldering Iron:** Touch the joint briefly with a clean, tinned tip. The flux will smoke and chemically "eat" the grey oxide layer.
71
-* **Why it works:** Flux is a reducing agent. It chemically removes the oxygen from the "grey" tin-oxide and allows the pure metal to flow together again.
72
-
73
-
74
-### What happens inside the can at $30^\circ\text{C}$?
75
-
76
-1. **Flux Separation (The "Oil" Effect):** Solder paste is a suspension of heavy metal spheres in a lighter chemical flux. At $30^\circ\text{C}$, the flux becomes less viscous. The heavy solder powder will settle to the bottom, and a yellowish, oily liquid (the flux) will rise to the top.
77
-
78
-2. **Chemical Activity Loss:** Flux is designed to "activate" (clean oxides) at high temperatures. However, at $30^\circ\text{C}$, a slow chemical reaction begins prematurely. The flux starts "working" on the solder powder while it's still in the can, exhausting its strength before it ever touches your PCB.
79
-
80
-3. **Powder Oxidation:** Even in a "sealed" plastic can, there is trapped air (oxygen) inside. Heat acts as a catalyst. The microscopic surface area of the solder spheres is massive, and $30^\circ\text{C}$ provides enough energy for a thin layer of **Tin Oxide** ($SnO$ or $SnO_2$) to form on every single sphere.
81
-
82
-
83
-
84
----
85
-
86
-### How to tell if your paste is "dead"
87
-Before using it on a real project, perform these three checks:
88
-
89
-* **The Stir Test:** Open the can. If there is a thick layer of liquid on top, try to stir it back in. If it remains "chunky," "dry," or like "wet sand" that won't smooth out, the flux has evaporated or polymerized. **Throw it away.**
90
-* **The Slump Test:** Apply a small amount to a surface. If it spreads out and loses its shape (slumps) at room temperature, it will likely cause "solder bridges" (连锡) during reflow.
91
-* **The Solder Ball Test:** Put a small dab on a piece of scrap PCB and heat it with a heat gun.
92
- * **Good:** The paste melts into one single, shiny, beautiful silver ball.
93
- * **Bad:** The paste melts but leaves behind dozens of tiny "satellites" (small grey dust-like balls) around the main drop. This is a sign of heavy oxidation.
94
-
95
----
96
-
97
-### Comparison of Storage Conditions
98
-| Storage Temp | Expected Shelf Life | Resulting Quality |
99
-| :--- | :--- | :--- |
100
-| **$0\text{--}10^\circ\text{C}$ (Fridge)** | 6–12 Months | **Professional Grade.** Shiny joints, minimal dross. |
101
-| **$20\text{--}25^\circ\text{C}$ (Room)** | 1–2 Months | **Acceptable for DIY.** May require extra flux. |
102
-| **$30^\circ\text{C}+$ (Warm)** | < 3 Weeks | **Poor.** High risk of grey joints and solder beads. |
103
-
104
----
105
-
106
-### Can you fix it?
107
-If you *must* use this paste and it has separated:
108
-1. **Manual Homogenization:** Stir it vigorously for at least 2–3 minutes with a clean spatula until it looks like creamy peanut butter.
109
-2. **Add "Fresh" Flux:** If the paste feels dry, add a few drops of high-quality **Tacky Flux** (like NC-559) and mix it in. This can sometimes "rescue" oxidized powder by providing the extra cleaning power needed to break through the $30^\circ\text{C}$ oxide layer.
110
-
111
-
112
-## “Solder paste should be more viscous so it doesn’t spread or drip.”
113
-
114
-- **More viscous** → thicker, stickier, flows slowly
115
- → Good for solder paste — it stays where you apply it.
116
-
117
-- **Diluted** → thinned by adding liquid (like flux or solvent)
118
- → Not good — it becomes too runny and won’t hold components well.
119
-
120
-
121
-
122
-
123
-
124
-## Low temperature soldering paste
125
-
126
-Low temperature soldering paste is a type of solder paste designed to melt and flow at lower temperatures than standard solder pastes. Here are its main features:
127
-
128
-- Melting Point: Typically melts between 130°C and 180°C, compared to standard lead-free solder pastes which melt around 217°C.
129
-- Composition: Often contains bismuth-based alloys (e.g., Sn42/Bi58) instead of traditional tin-silver-copper (SAC) alloys.
130
-- Applications: Ideal for temperature-sensitive components, rework, or double-sided PCB assembly where high heat could dam-Age parts.
131
-- Reduced Thermal Stress: Minimizes risk of warping or dam-Aging PCBs and components.
132
-- Energy Saving: Lower reflow oven temperatures reduce energy consumption.
133
-- Compatibility: Useful for mixed-technology boards or assemblies with plastic connectors and LEDs.
134
-
135
-
136
-
137
-
138
-### Solder Paste Types and Applications
139
-
140
-
141
-| Solder Paste Model | Composition | Powder Type | Application/Notes |
142
-| -------------------- | ------------------- | ----------- | --------------------------------------------------- |
143
-| Mobile Repair GY618B | Sn62.8-Pb36.8-Ag0.4 | Type 4 | For mobile phone repair |
144
-| A-888 | Sn63-Pb37 | Type 3 | resistors, capacitors, simple IC PCBs |
145
-| A-888 | Sn63-Pb37 | Type 4 | resistors, capacitors, fine-pitch/multi-pin IC PCBs |
146
-| SMT Chip A-888 | Sn63-Pb37 | Type 5 | resistors, capacitors, dense/multi-pin IC PCBs |
147
-| GY-626B | Sn62.9-Pb36.9-Ag0.2 | Type 4 | QFN type PCBs |
148
-| GY-618B-B | Sn62.8-Pb36.8-Ag0.4 | Type 4 | BGA pack-Age PCBs |
149
-| LED Chip GY361 | Sn55-Pb45 | Type 3 | LED lamps, strips, and tapes |
150
-| GY638A | Sn60-Pb40 | Type 3 | Performance superior to GY361 |
151
-
152
-
153
-
154
-## target
155
-
156
-- [[FPC-dat]]
157
-
158
-
159
-
160
-## Common type Solder Paste
161
-
162
-| melting point | tin content | Note |
163
-| ------------- | ----------- | -------------------------------------------------------------------- |
164
-| 138 C | 42% | ultra-low temperature, bismuth-based, for special low-temp soldering |
165
-| 150 C | 42% | low temperature, bismuth-based, for temperature-sensitive components |
166
-| 183 C | 63% | best for most common PCB, small spacing, high parts density |
167
-| 217 C | 99.3% | lead-free, SAC305 alloy, standard for RoHS compliant PCBs |
168
-
169
-
170
-
171
-
172
-![](2024-02-17-16-19-00.png)
173
-
174
-![](2024-02-17-16-20-20.png)
175
-
176
-![](2024-02-17-16-20-38.png)
177
-
178
-![](2024-02-17-16-20-49.png)
179
-
180
-## solder paste printer
181
-
182
-![](2025-08-08-12-11-20.png)
183
-
184
-
185
-
186
-## ref
187
-
188
-- [[solder-paste]]
189
-
190
-- [[soldering-dat]]
... ...
\ No newline at end of file
fab-dat/fab-PCB-soldering-dat/fab-soldering-materials-dat/soldering-flux-dat/2025-09-10-17-34-56.png
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... ...
@@ -1,23 +0,0 @@
1
-
2
-# soldering-flux-dat
3
-
4
-
5
-- [[solder-flux]]
6
-
7
-![](2025-09-10-17-34-56.png)
8
-
9
-- helogen free == white
10
-
11
-
12
-环保助焊松香
13
-- 易焊锡
14
-- 防氧化
15
-- 无腐蚀性
16
-- 无铅环保
17
-- 绝缘阻抗高
18
-- 浸润性好
19
-
20
-
21
-## ref
22
-
23
-- [[soldering-tools-dat]]
... ...
\ No newline at end of file
fab-dat/fab-PCB-soldering-tools-dat/2025-03-04-14-13-55.png
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... ...
@@ -1,11 +1,14 @@
1 1
2
-# fab-soldering-tools-dat
2
+# fab-PCB-soldering-tools-dat
3 3
4 4
- [[fab-PCB-dat]] - [[fab-PCB-soldering-dat]] - [[fab-PCB-soldering-tools-dat]] - [[fab-PCB-desoldering-dat]] - [[fab-soldering-materials-dat]]
5 5
6 6
main tools
7 7
8
-- [[soldering-iron-dat]] - [[soldering-tip-dat]] - [[soldering-station-dat]]
8
+- [[soldering-iron-dat]] - [[soldering-iron-tip-dat]] - [[soldering-iron-tip-refresher-dat]]
9
+
10
+- [[soldering-station-dat]]
11
+
9 12
10 13
best accessoeries
11 14
... ...
@@ -59,4 +62,4 @@ soldering iron rack - https://www.electrodragon.com/product/casting-metal-solder
59 62
60 63
## ref
61 64
62
-- [[soldering-dat]]
... ...
\ No newline at end of file
0
+- [[fab-PCB-soldering-tools-dat]] - [[fab-PCB-soldering-tools]]
... ...
\ No newline at end of file
fab-dat/fab-PCB-soldering-tools-dat/fab-soldering-materials-dat/fab-soldering-materials-dat.md
... ...
@@ -0,0 +1,24 @@
1
+
2
+
3
+# soldering-materials-dat
4
+
5
+
6
+
7
+- [[fab-PCB-dat]] - [[fab-PCB-soldering-dat]] - [[fab-PCB-soldering-tools-dat]] - [[fab-PCB-desoldering-dat]] - [[fab-soldering-materials-dat]]
8
+
9
+
10
+
11
+- [[solder-paste-dat]] - [[soldering-flux-dat]]
12
+
13
+- [[battery-strips-dat]]
14
+
15
+
16
+
17
+
18
+
19
+## ref
20
+
21
+- [[fab-PCB-soldering-tools-dat]]
22
+
23
+
24
+
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... ...
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@@ -0,0 +1,190 @@
1
+
2
+# solder-paste-dat
3
+
4
+- [[high-precise-printing-dat]]
5
+
6
+- [[fab-PCB-soldering-dat]] - [[solder-paste-dat]]
7
+
8
+
9
+## supporting tools
10
+
11
+- [[syringe-dat]] - [[syringe-pusher-dat]]
12
+
13
+- [[Flux-Thinner-dat]]
14
+
15
+- [[soldering-flux-dat]]
16
+
17
+
18
+
19
+## Solder Paste Thinner: Essential Guidelines
20
+
21
+The liquid used to adjust the viscosity of solder paste is professionally referred to as **Solder Paste Thinner** (or Flux Thinner).
22
+
23
+**CRITICAL WARNING:** In professional electronics manufacturing, **it is generally discouraged to thin solder paste.** Solder paste is a carefully engineered chemical mixture. If it has dried out or expired, the flux activity and the rheology (flow characteristics) have already been degraded. Adding a thinner often results in:
24
+* **Bridge defects** during reflow.
25
+* **Solder beading** or "tombstoning" due to altered wetting properties.
26
+* **Voids** in the solder joint caused by improper solvent evaporation.
27
+
28
+---
29
+
30
+### 1. Composition
31
+Specialized solder paste thinners typically consist of:
32
+* **Glycol Ethers (e.g., Propylene Glycol Ethers):** These are the primary solvents that dissolve the resin/rosin binder.
33
+* **Surfactants:** Added to maintain the thixotropic properties (the ability to flow under shear stress but stay stationary when idle).
34
+* **Stability Agents:** Prevent the metal particles from settling out of the flux medium.
35
+
36
+### 2. Best Practices for Use
37
+If you must attempt to salvage a paste (for non-critical prototyping), follow these strict rules:
38
+
39
+* **Use Only Professional Grade Thinner:** Do not use general solvents like acetone, lacquer thinner, or standard hardware store cleaners. These will chemically destroy the flux.
40
+* **Minimal Dosage:** Add only **1% to 3% by weight**. Adding too much will cause the paste to slump, leading to shorts between fine-pitch pads.
41
+* **Homogeneous Mixing:** Use a mechanical or manual spatula to stir the paste for at least 3-5 minutes until the consistency is uniform.
42
+* **Stabilization:** Let the paste sit for at least 30 minutes after mixing before using it to allow the chemical solvents to distribute evenly.
43
+
44
+
45
+
46
+### 3. Troubleshooting "Dry" Paste
47
+Before reaching for a thinner, check these common issues:
48
+* **Temperature (The #1 Culprit):** Solder paste must be stored in a refrigerator (typically 2°C–10°C). It **must** be brought to room temperature (naturally, in its container) for at least 2–4 hours before opening. If opened while cold, moisture from the air will condense into the paste, causing it to appear dry or gritty.
49
+* **Shelf Life:** Check the expiration date. Once the activator in the flux is exhausted, no amount of thinner will restore the paste's ability to create a reliable solder joint.
50
+
51
+### 4. Important Distinction
52
+* **Thinners:** Are for modifying the paste's viscosity.
53
+* **Cleaners (IPA/Alcohol):** Are for removing flux residues **after** soldering or cleaning stencils. **Never mix these into your solder paste.**
54
+
55
+
56
+
57
+## solder dross issue
58
+
59
+
60
+### How to Fix "Grey" or Oxidized Solder Joints
61
+
62
+Grey joints are usually caused by **overheating** (burning off the flux), **underheating** (cold joints), or **slow cooling**. Follow these steps to "refresh" the joints:
63
+
64
+---
65
+
66
+### 1. The "Flux-and-Reflow" Method (Best for SMD)
67
+If the joint is just dull but the component is correctly aligned, **Flux** is your best friend.
68
+* **Apply Tacky Flux:** Cover the grey joints with a generous amount of high-quality "no-clean" or RMA tacky flux (e.g., Amtech NC-559).
69
+* **Re-apply Heat:** * **Hot Air Station:** Set to ~280°C - 300°C with low airflow. Heat the area until you see the solder turn liquid and "jump" into a shiny, spherical shape.
70
+ * **Soldering Iron:** Touch the joint briefly with a clean, tinned tip. The flux will smoke and chemically "eat" the grey oxide layer.
71
+* **Why it works:** Flux is a reducing agent. It chemically removes the oxygen from the "grey" tin-oxide and allows the pure metal to flow together again.
72
+
73
+
74
+### What happens inside the can at $30^\circ\text{C}$?
75
+
76
+1. **Flux Separation (The "Oil" Effect):** Solder paste is a suspension of heavy metal spheres in a lighter chemical flux. At $30^\circ\text{C}$, the flux becomes less viscous. The heavy solder powder will settle to the bottom, and a yellowish, oily liquid (the flux) will rise to the top.
77
+
78
+2. **Chemical Activity Loss:** Flux is designed to "activate" (clean oxides) at high temperatures. However, at $30^\circ\text{C}$, a slow chemical reaction begins prematurely. The flux starts "working" on the solder powder while it's still in the can, exhausting its strength before it ever touches your PCB.
79
+
80
+3. **Powder Oxidation:** Even in a "sealed" plastic can, there is trapped air (oxygen) inside. Heat acts as a catalyst. The microscopic surface area of the solder spheres is massive, and $30^\circ\text{C}$ provides enough energy for a thin layer of **Tin Oxide** ($SnO$ or $SnO_2$) to form on every single sphere.
81
+
82
+
83
+
84
+---
85
+
86
+### How to tell if your paste is "dead"
87
+Before using it on a real project, perform these three checks:
88
+
89
+* **The Stir Test:** Open the can. If there is a thick layer of liquid on top, try to stir it back in. If it remains "chunky," "dry," or like "wet sand" that won't smooth out, the flux has evaporated or polymerized. **Throw it away.**
90
+* **The Slump Test:** Apply a small amount to a surface. If it spreads out and loses its shape (slumps) at room temperature, it will likely cause "solder bridges" (连锡) during reflow.
91
+* **The Solder Ball Test:** Put a small dab on a piece of scrap PCB and heat it with a heat gun.
92
+ * **Good:** The paste melts into one single, shiny, beautiful silver ball.
93
+ * **Bad:** The paste melts but leaves behind dozens of tiny "satellites" (small grey dust-like balls) around the main drop. This is a sign of heavy oxidation.
94
+
95
+---
96
+
97
+### Comparison of Storage Conditions
98
+| Storage Temp | Expected Shelf Life | Resulting Quality |
99
+| :--- | :--- | :--- |
100
+| **$0\text{--}10^\circ\text{C}$ (Fridge)** | 6–12 Months | **Professional Grade.** Shiny joints, minimal dross. |
101
+| **$20\text{--}25^\circ\text{C}$ (Room)** | 1–2 Months | **Acceptable for DIY.** May require extra flux. |
102
+| **$30^\circ\text{C}+$ (Warm)** | < 3 Weeks | **Poor.** High risk of grey joints and solder beads. |
103
+
104
+---
105
+
106
+### Can you fix it?
107
+If you *must* use this paste and it has separated:
108
+1. **Manual Homogenization:** Stir it vigorously for at least 2–3 minutes with a clean spatula until it looks like creamy peanut butter.
109
+2. **Add "Fresh" Flux:** If the paste feels dry, add a few drops of high-quality **Tacky Flux** (like NC-559) and mix it in. This can sometimes "rescue" oxidized powder by providing the extra cleaning power needed to break through the $30^\circ\text{C}$ oxide layer.
110
+
111
+
112
+## “Solder paste should be more viscous so it doesn’t spread or drip.”
113
+
114
+- **More viscous** → thicker, stickier, flows slowly
115
+ → Good for solder paste — it stays where you apply it.
116
+
117
+- **Diluted** → thinned by adding liquid (like flux or solvent)
118
+ → Not good — it becomes too runny and won’t hold components well.
119
+
120
+
121
+
122
+
123
+
124
+## Low temperature soldering paste
125
+
126
+Low temperature soldering paste is a type of solder paste designed to melt and flow at lower temperatures than standard solder pastes. Here are its main features:
127
+
128
+- Melting Point: Typically melts between 130°C and 180°C, compared to standard lead-free solder pastes which melt around 217°C.
129
+- Composition: Often contains bismuth-based alloys (e.g., Sn42/Bi58) instead of traditional tin-silver-copper (SAC) alloys.
130
+- Applications: Ideal for temperature-sensitive components, rework, or double-sided PCB assembly where high heat could dam-Age parts.
131
+- Reduced Thermal Stress: Minimizes risk of warping or dam-Aging PCBs and components.
132
+- Energy Saving: Lower reflow oven temperatures reduce energy consumption.
133
+- Compatibility: Useful for mixed-technology boards or assemblies with plastic connectors and LEDs.
134
+
135
+
136
+
137
+
138
+### Solder Paste Types and Applications
139
+
140
+
141
+| Solder Paste Model | Composition | Powder Type | Application/Notes |
142
+| -------------------- | ------------------- | ----------- | --------------------------------------------------- |
143
+| Mobile Repair GY618B | Sn62.8-Pb36.8-Ag0.4 | Type 4 | For mobile phone repair |
144
+| A-888 | Sn63-Pb37 | Type 3 | resistors, capacitors, simple IC PCBs |
145
+| A-888 | Sn63-Pb37 | Type 4 | resistors, capacitors, fine-pitch/multi-pin IC PCBs |
146
+| SMT Chip A-888 | Sn63-Pb37 | Type 5 | resistors, capacitors, dense/multi-pin IC PCBs |
147
+| GY-626B | Sn62.9-Pb36.9-Ag0.2 | Type 4 | QFN type PCBs |
148
+| GY-618B-B | Sn62.8-Pb36.8-Ag0.4 | Type 4 | BGA pack-Age PCBs |
149
+| LED Chip GY361 | Sn55-Pb45 | Type 3 | LED lamps, strips, and tapes |
150
+| GY638A | Sn60-Pb40 | Type 3 | Performance superior to GY361 |
151
+
152
+
153
+
154
+## target
155
+
156
+- [[FPC-dat]]
157
+
158
+
159
+
160
+## Common type Solder Paste
161
+
162
+| melting point | tin content | Note |
163
+| ------------- | ----------- | -------------------------------------------------------------------- |
164
+| 138 C | 42% | ultra-low temperature, bismuth-based, for special low-temp soldering |
165
+| 150 C | 42% | low temperature, bismuth-based, for temperature-sensitive components |
166
+| 183 C | 63% | best for most common PCB, small spacing, high parts density |
167
+| 217 C | 99.3% | lead-free, SAC305 alloy, standard for RoHS compliant PCBs |
168
+
169
+
170
+
171
+
172
+![](2024-02-17-16-19-00.png)
173
+
174
+![](2024-02-17-16-20-20.png)
175
+
176
+![](2024-02-17-16-20-38.png)
177
+
178
+![](2024-02-17-16-20-49.png)
179
+
180
+## solder paste printer
181
+
182
+![](2025-08-08-12-11-20.png)
183
+
184
+
185
+
186
+## ref
187
+
188
+- [[solder-paste]]
189
+
190
+- [[soldering-dat]]
... ...
\ No newline at end of file
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@@ -0,0 +1,29 @@
1
+
2
+# soldering-flux-dat
3
+
4
+
5
+- [[solder-flux]]
6
+
7
+![](2025-09-10-17-34-56.png)
8
+
9
+- helogen free == white
10
+
11
+
12
+环保助焊松香
13
+- 易焊锡
14
+- 防氧化
15
+- 无腐蚀性
16
+- 无铅环保
17
+- 绝缘阻抗高
18
+- 浸润性好
19
+
20
+【白色无铅无卤】无酸助焊膏
21
+
22
+- 无铅
23
+- 无卤
24
+
25
+![](2026-06-03-02-09-01.png)
26
+
27
+## ref
28
+
29
+- [[soldering-tools-dat]]
... ...
\ No newline at end of file
fab-dat/fab-PCB-soldering-tools-dat/soldering-iron-dat/soldering-iron-dat.md
... ...
@@ -13,42 +13,7 @@ usb soldering iron - [[PSO1055-dat]]
13 13
- [[portable-soldering-iron-dat]]
14 14
15 15
16
-
17
-## soldering iron tips
18
-
19
-- [[PSO1025-dat]] - [[PSO1024-dat]] - [[PSO1023-dat]]
20
-
21
-all soldering tips family 1
22
-
23
-![](2025-03-04-14-13-55.png)
24
-
25
-Common soldering tips system: (C1151), ESD(C1152), 900, 900M, 907, 933, 936, 937, 942
26
-
27
-
28
-
29
-Yes, the tip of a soldering iron usually has a surface coating, not just bare copper or iron. This coating serves several purposes: preventing corrosion, improving heat transfer, and extending lifespan. Common types of coatings include:
30
-
31
-1. **Iron Plating**
32
- - Most soldering iron tips have a copper core, but copper oxidizes easily and wears quickly.
33
- - The surface is plated with iron to prevent oxidation and improve durability.
34
- - Advantages: High temperature resistance and long lifespan.
35
-
36
-2. **Nickel or Chrome Plating**
37
- - Some tips add a layer of nickel or chrome on top of the iron plating.
38
- - Purpose: Further corrosion resistance and increased surface hardness.
39
-
40
-3. **Solder Coating (Tin layer, formed during use)**
41
- - When first used, a thin layer of solder forms on the tip from molten solder or flux.
42
- - This tin layer protects the tip from oxidation and improves soldering performance.
43
- - Tip: Always apply a thin layer of solder after use to extend the tip’s life.
44
-
45
-4. **Ceramic or Special Coatings (on some high-end tips)**
46
- - Some high-temperature or specialty soldering tips have ceramic coatings.
47
- - Purpose: Corrosion resistance, high temperature tolerance, and reduced solder sticking.
48
-
49
-**Summary**: The core is usually copper, with an iron plating, sometimes additional nickel/chrome, and a protective tin layer forms during use.
50
-
51
-
16
+- [[soldering-iron-dat]] - [[soldering-iron-tip-dat]] - [[soldering-iron-tip-refresher-dat]]
52 17
53 18
54 19
## ref
fab-dat/fab-PCB-soldering-tools-dat/soldering-iron-tip-dat/2025-03-04-14-13-55.png
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@@ -0,0 +1,41 @@
1
+
2
+
3
+# soldering-iron-tip-dat
4
+
5
+- [[soldering-iron-dat]] - [[soldering-iron-tip-dat]] - [[soldering-iron-tip-refresher-dat]]
6
+
7
+
8
+## soldering iron tips
9
+
10
+- [[PSO1025-dat]] - [[PSO1024-dat]] - [[PSO1023-dat]]
11
+
12
+all soldering tips family 1
13
+
14
+![](2025-03-04-14-13-55.png)
15
+
16
+Common soldering tips system: (C1151), ESD(C1152), 900, 900M, 907, 933, 936, 937, 942
17
+
18
+
19
+
20
+Yes, the tip of a soldering iron usually has a surface coating, not just bare copper or iron. This coating serves several purposes: preventing corrosion, improving heat transfer, and extending lifespan. Common types of coatings include:
21
+
22
+1. **Iron Plating**
23
+ - Most soldering iron tips have a copper core, but copper oxidizes easily and wears quickly.
24
+ - The surface is plated with iron to prevent oxidation and improve durability.
25
+ - Advantages: High temperature resistance and long lifespan.
26
+
27
+2. **Nickel or Chrome Plating**
28
+ - Some tips add a layer of nickel or chrome on top of the iron plating.
29
+ - Purpose: Further corrosion resistance and increased surface hardness.
30
+
31
+3. **Solder Coating (Tin layer, formed during use)**
32
+ - When first used, a thin layer of solder forms on the tip from molten solder or flux.
33
+ - This tin layer protects the tip from oxidation and improves soldering performance.
34
+ - Tip: Always apply a thin layer of solder after use to extend the tip’s life.
35
+
36
+4. **Ceramic or Special Coatings (on some high-end tips)**
37
+ - Some high-temperature or specialty soldering tips have ceramic coatings.
38
+ - Purpose: Corrosion resistance, high temperature tolerance, and reduced solder sticking.
39
+
40
+**Summary**: The core is usually copper, with an iron plating, sometimes additional nickel/chrome, and a protective tin layer forms during use.
41
+
fab-dat/fab-PCB-soldering-tools-dat/soldering-iron-tip-refresher-dat/2026-06-03-02-16-13.png
... ...
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fab-dat/fab-PCB-soldering-tools-dat/soldering-iron-tip-refresher-dat/soldering-iron-tip-refresher-dat.md
... ...
@@ -0,0 +1,13 @@
1
+
2
+
3
+# soldering-iron-tip-refresher-dat
4
+
5
+- [[soldering-iron-dat]] - [[soldering-iron-tip-dat]] - [[soldering-iron-tip-refresher-dat]]
6
+
7
+化学还原（助焊剂/复活膏）： 所谓的“烙铁头复活膏”通常含有高活性的还原剂（如氯化铵或特殊的有机酸）。在高温下，这些成分会发生化学反应，将金属氧化物还原为金属状态，或者将其转化为易于清理的化合物。
8
+
9
+![](2026-06-03-02-16-13.png)
10
+
11
+## ref
12
+
13
+- [[fab-PCB-soldering-tools]] - [[soldering-iron]]
... ...
\ No newline at end of file