BOM-DAT/0402-dat/0402-dat.md
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@@ -2,6 +2,7 @@
2 2
# 0402-dat
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4 4
- 0.1UF
5
+- 0.47UF
5 6
- 1K
6 7
- 1UF
7 8
- 100K
BOM-DAT/FPC-dat/FPC-dat.md
... ...
@@ -40,7 +40,7 @@ THD0510－xxCL－GF == datasheet [[THD0510-xxCL-GF.pdf]]
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41 41
## soldering
42 42
43
-Use low-temperature solder [[soldering-paste-dat]] to tin the pads first, then clean the pads with board cleaning solution, brush on BGA soldering flux, and finally use a hot plate. The result is almost as good as factory production.
43
+Use low-temperature solder [[solder-paste-dat]] to tin the pads first, then clean the pads with board cleaning solution, brush on BGA soldering flux, and finally use a hot plate. The result is almost as good as factory production.
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45 45
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## ref
Tech-dat/prototyping-dat/solder-paste-dat/solder-paste-dat.md
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@@ -0,0 +1,41 @@
1
+
2
+# solder-paste-dat
3
+
4
+## Low temperature soldering paste
5
+
6
+Low temperature soldering paste is a type of solder paste designed to melt and flow at lower temperatures than standard solder pastes. Here are its main features:
7
+
8
+- Melting Point: Typically melts between 130°C and 180°C, compared to standard lead-free solder pastes which melt around 217°C.
9
+- Composition: Often contains bismuth-based alloys (e.g., Sn42/Bi58) instead of traditional tin-silver-copper (SAC) alloys.
10
+- Applications: Ideal for temperature-sensitive components, rework, or double-sided PCB assembly where high heat could dam-Age parts.
11
+- Reduced Thermal Stress: Minimizes risk of warping or dam-Aging PCBs and components.
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+- Energy Saving: Lower reflow oven temperatures reduce energy consumption.
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+- Compatibility: Useful for mixed-technology boards or assemblies with plastic connectors and LEDs.
14
+
15
+
16
+
17
+
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+### Solder Paste Types and Applications
19
+
20
+
21
+| Solder Paste Model | Composition | Powder Type | Application/Notes |
22
+| -------------------- | ------------------- | ----------- | --------------------------------------------------- |
23
+| Mobile Repair GY618B | Sn62.8-Pb36.8-Ag0.4 | Type 4 | For mobile phone repair |
24
+| A-888 | Sn63-Pb37 | Type 3 | resistors, capacitors, simple IC PCBs |
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+| A-888 | Sn63-Pb37 | Type 4 | resistors, capacitors, fine-pitch/multi-pin IC PCBs |
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+| SMT Chip A-888 | Sn63-Pb37 | Type 5 | resistors, capacitors, dense/multi-pin IC PCBs |
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+| GY-626B | Sn62.9-Pb36.9-Ag0.2 | Type 4 | QFN type PCBs |
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+| GY-618B-B | Sn62.8-Pb36.8-Ag0.4 | Type 4 | BGA pack-Age PCBs |
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+| LED Chip GY361 | Sn55-Pb45 | Type 3 | LED lamps, strips, and tapes |
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+| GY638A | Sn60-Pb40 | Type 3 | Performance superior to GY361 |
31
+
32
+
33
+
34
+## target
35
+
36
+- [[FPC-dat]]
37
+
38
+
39
+## ref
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+
41
+- [[soldering-dat]]
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\ No newline at end of file
Tech-dat/prototyping-dat/soldering-dat/soldering-dat.md
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@@ -4,7 +4,7 @@
4 4
5 5
- [[PCB-cleaner-dat]]
6 6
7
-- [[soldering-paste-dat]]
7
+- [[solder-paste-dat]]
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9 9
## Soldering Iron and Tips
10 10
Tech-dat/prototyping-dat/soldering-paste-dat/soldering-paste-dat.md
... ...
@@ -1,25 +0,0 @@
1
-
2
-# soldering-paste-dat
3
-
4
-## Low temperature soldering paste
5
-
6
-Low temperature soldering paste is a type of solder paste designed to melt and flow at lower temperatures than standard solder pastes. Here are its main features:
7
-
8
-- Melting Point: Typically melts between 130°C and 180°C, compared to standard lead-free solder pastes which melt around 217°C.
9
-- Composition: Often contains bismuth-based alloys (e.g., Sn42/Bi58) instead of traditional tin-silver-copper (SAC) alloys.
10
-- Applications: Ideal for temperature-sensitive components, rework, or double-sided PCB assembly where high heat could damage parts.
11
-- Reduced Thermal Stress: Minimizes risk of warping or damaging PCBs and components.
12
-- Energy Saving: Lower reflow oven temperatures reduce energy consumption.
13
-- Compatibility: Useful for mixed-technology boards or assemblies with plastic connectors and LEDs.
14
-
15
-
16
-
17
-
18
-## target
19
-
20
-- [[FPC-dat]]
21
-
22
-
23
-## ref
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-
25
-- [[soldering-dat]]
... ...
\ No newline at end of file