Chip-cn-dat/RDA-dat/RDA5981-dat.md
... ...
@@ -1,7 +1,7 @@
1 1
2
-# RDA5981 dat
2
+# RDA5981-dat
3 3
4
-legacy wiki page - https://w.electrodragon.com/w/RDA5981
4
+[legacy wiki page](https://w.electrodragon.com/w/RDA5981)
5 5
6 6
github sdk - https://github.com/Edragon/RDA-RDA5981
7 7
Chip-dat/richtek-dat/richtek-dat.md
... ...
@@ -16,6 +16,8 @@ The RT9742 integrates an over-current protection circuit, a short fold back circ
16 16
- [[power-protection-dat]]
17 17
18 18
19
+
20
+
19 21
## RT9080
20 22
21 23
- RT9080 - 2μA IQ, 600mA Low-Dropout Linear Regulator
PCB-dat/PCB-soldering-dat/PCB-soldering-dat.md
... ...
@@ -0,0 +1,65 @@
1
+# soldering-dat
2
+
3
+- [[PSO1043-dat]] - [[PSO1038-dat]]
4
+
5
+- [[PCB-cleaner-dat]]
6
+
7
+- [[solder-paste-dat]] - [[fab-PCBA-dat]]
8
+
9
+- [[soldering-tools-dat]]
10
+
11
+
12
+
13
+
14
+## soldering skills
15
+
16
+
17
+
18
+
19
+
20
+### soldering chip with pads underneath, such as QFN, BGA, LGA, etc.
21
+
22
+- [[allwinner-dat]]
23
+
24
+T113 soldering note: 务必先焊接除T113以外的元器件，烧录51单片机固件，按下面的说明，测量3.3V、1.5V、0.9V全部正常再焊T113，否则若EA3036的FB虚焊将会直接烧坏T113。
25
+
26
+T113 soldering note (English): Be sure to solder all components except T113 first, program the 51 MCU firmware, and follow the instructions below to measure 3.3V, 1.5V, and 0.9V to ensure they are all normal before soldering T113. Otherwise, if the FB pin of EA3036 is poorly soldered, T113 may be directly damaged.
27
+
28
+
29
+
30
+### FPC soldering
31
+
32
+- [[FPC-dat]]
33
+
34
+### alternative temperature-sensitive items soldering
35
+
36
+
37
+> No special solder paste is needed; the key point is not to heat the FPC connector directly—apply heat from the back side of the PCB.
38
+>
39
+> **Explanation:**
40
+> When soldering temperature-sensitive components like FPC (Flexible Printed Circuit) connectors, you generally do not need to use any special type of solder paste. The most important thing is to avoid applying hot air or direct heat to the FPC connector itself, as it can be easily damaged by high temperatures.
41
+> Instead, use a hot air gun or soldering tool to heat the solder joints from the back side of the PCB. This approach helps protect the delicate connector and ensures a reliable solder joint.
42
+
43
+
44
+
45
+## tips
46
+
47
+焊接注意事项
48
+
49
+1. 确保焊接的部位干燥干净无油污无氧化；
50
+
51
+2. 选择60W或更大功率的电烙铁，保证温度足够高，烙铁头可选尖头或马蹄头等以便传热和焊接（软包电池需要200W起的电烙铁，大单体需要500W起的电烙铁)
52
+
53
+3. 先加热被焊接部位 (烙铁头紧贴焊接部位几秒钟）再同时快速送锡至焊点，焊接完成；
54
+
55
+4. 注意：焊接过程烙铁不要离开金属表面，保持加热趁热焊接，锡丝尽量连续不断。
56
+
57
+## ref
58
+
59
+- [[desoldering-dat]]
60
+
61
+- [[welding-dat]] - [[spot-welding-dat]] - [[PTC-dat]]
62
+
63
+- [[ICT-testing]]
64
+
65
+- [[soldering]]
... ...
\ No newline at end of file
PCB-dat/soldering-dat/soldering-dat.md
... ...
@@ -1,53 +0,0 @@
1
-# soldering-dat
2
-
3
-- [[PSO1043-dat]] - [[PSO1038-dat]]
4
-
5
-- [[PCB-cleaner-dat]]
6
-
7
-- [[solder-paste-dat]]
8
-
9
-- [[soldering-tools-dat]]
10
-
11
-
12
-
13
-
14
-## soldering skills
15
-
16
-
17
-
18
-
19
-
20
-### soldering chip with pads underneath, such as QFN, BGA, LGA, etc.
21
-
22
-- [[allwinner-dat]]
23
-
24
-T113 soldering note: 务必先焊接除T113以外的元器件，烧录51单片机固件，按下面的说明，测量3.3V、1.5V、0.9V全部正常再焊T113，否则若EA3036的FB虚焊将会直接烧坏T113。
25
-
26
-T113 soldering note (English): Be sure to solder all components except T113 first, program the 51 MCU firmware, and follow the instructions below to measure 3.3V, 1.5V, and 0.9V to ensure they are all normal before soldering T113. Otherwise, if the FB pin of EA3036 is poorly soldered, T113 may be directly damaged.
27
-
28
-
29
-
30
-### FPC soldering
31
-
32
-- [[FPC-dat]]
33
-
34
-### alternative temperature-sensitive items soldering
35
-
36
-
37
-> No special solder paste is needed; the key point is not to heat the FPC connector directly—apply heat from the back side of the PCB.
38
->
39
-> **Explanation:**
40
-> When soldering temperature-sensitive components like FPC (Flexible Printed Circuit) connectors, you generally do not need to use any special type of solder paste. The most important thing is to avoid applying hot air or direct heat to the FPC connector itself, as it can be easily damaged by high temperatures.
41
-> Instead, use a hot air gun or soldering tool to heat the solder joints from the back side of the PCB. This approach helps protect the delicate connector and ensures a reliable solder joint.
42
-
43
-
44
-
45
-## ref
46
-
47
-- [[desoldering-dat]]
48
-
49
-- [[welding-dat]] - [[spot-welding-dat]] - [[PTC-dat]]
50
-
51
-- [[ICT-testing]]
52
-
53
-- [[soldering]]
... ...
\ No newline at end of file
Tech-dat/chemistry-dat/chemistry-dat.md
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@@ -10,4 +10,6 @@
10 10
11 11
## ref
12 12
13
-- [[tech-dat]]
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\ No newline at end of file
0
+- [[tech-dat]]
1
+
2
+- [[chemistry]]
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\ No newline at end of file
Tech-dat/logic-dat/logic-gate-dat/Buffer-dat/buffer-dat.md
... ...
@@ -37,16 +37,21 @@ Summary:
37 37
**74HC245** is a high-speed **bi-directional bus buffer**, typically used for **bus-oriented communication** and interfacing between microcontrollers and peripherals.
38 38
39 39
40
-## SINGLE BUFFER/DRIVER WITH OPEN DRAIN OUTPUT
40
+## 1ch SINGLE BUFFER/DRIVER WITH OPEN DRAIN OUTPUT
41 41
42 42
74LVC1G07
43 43
44 44
**SN74LVC1G07** – Single Buffer/Driver with Open-Drain Output
45 45
46
+- SN74LVC1G07 Single Buffer/Driver With Open-Drain Output
46 47
47 48
![](2024-01-18-18-16-22.png)
48 49
49 50
51
+
52
+
53
+
54
+
50 55
## SINGLE SCHMITT-TRIGGER INVERETER
51 56
52 57
74AHC1G14
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@@ -61,10 +66,7 @@ Summary:
61 66
## SN74LVC2G04 Dual Inverter Gate
62 67
63 68
64
-# buffer-dat
65
-
66 69
67
-- SN74LVC1G07 Single Buffer/Driver With Open-Drain Output
68 70
69 71
## Inverter
70 72
... ...
@@ -72,4 +74,10 @@ SN74LVC1G14 Single Schmitt-Trigger Inverter - https://www.ti.com/lit/ds/symlink/
72 74
73 75
- [[74hc541-dat]] - [[74hct245-dat]]
74 76
75
-**74AHC1G125** – Single Bus Buffer Gate with **3-State Output**
... ...
\ No newline at end of file
0
+**74AHC1G125** – Single Bus Buffer Gate with **3-State Output**
1
+
2
+
3
+
4
+## ref
5
+
6
+- [[logic-gate-dat]]
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\ No newline at end of file
fab-PCBA-dat/fab-PCBA-dat.md
... ...
@@ -2,11 +2,11 @@
2 2
# PCBA-dat
3 3
4 4
5
-- [[soldering-dat]] - [[desoldering-dat]]
5
+- [[PCB-soldering-dat]] - [[desoldering-dat]]
6 6
7 7
- [[spot-welding-dat]]
8 8
9
-- [[solder-paste-dat]]
9
+- [[solder-paste-dat]] - [[soldering-tools-dat]]
10 10
11 11
- [[PCB-dat]]
12 12
fab-PCBA-dat/fab-Stencil-DAT/fab-stencil-dat.md
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@@ -1,6 +1,8 @@
1 1
2 2
# fab-stencil-dat
3 3
4
+- [[fab-PCBA-dat]]
5
+
4 6
5 7
## common size frameless
6 8
fab-PCBA-dat/solder-paste-dat/2024-02-17-16-19-00.png
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fab-PCBA-dat/solder-paste-dat/solder-paste-dat.md
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@@ -1,70 +0,0 @@
1
-
2
-# solder-paste-dat
3
-
4
-## Low temperature soldering paste
5
-
6
-Low temperature soldering paste is a type of solder paste designed to melt and flow at lower temperatures than standard solder pastes. Here are its main features:
7
-
8
-- Melting Point: Typically melts between 130°C and 180°C, compared to standard lead-free solder pastes which melt around 217°C.
9
-- Composition: Often contains bismuth-based alloys (e.g., Sn42/Bi58) instead of traditional tin-silver-copper (SAC) alloys.
10
-- Applications: Ideal for temperature-sensitive components, rework, or double-sided PCB assembly where high heat could dam-Age parts.
11
-- Reduced Thermal Stress: Minimizes risk of warping or dam-Aging PCBs and components.
12
-- Energy Saving: Lower reflow oven temperatures reduce energy consumption.
13
-- Compatibility: Useful for mixed-technology boards or assemblies with plastic connectors and LEDs.
14
-
15
-
16
-
17
-
18
-### Solder Paste Types and Applications
19
-
20
-
21
-| Solder Paste Model | Composition | Powder Type | Application/Notes |
22
-| -------------------- | ------------------- | ----------- | --------------------------------------------------- |
23
-| Mobile Repair GY618B | Sn62.8-Pb36.8-Ag0.4 | Type 4 | For mobile phone repair |
24
-| A-888 | Sn63-Pb37 | Type 3 | resistors, capacitors, simple IC PCBs |
25
-| A-888 | Sn63-Pb37 | Type 4 | resistors, capacitors, fine-pitch/multi-pin IC PCBs |
26
-| SMT Chip A-888 | Sn63-Pb37 | Type 5 | resistors, capacitors, dense/multi-pin IC PCBs |
27
-| GY-626B | Sn62.9-Pb36.9-Ag0.2 | Type 4 | QFN type PCBs |
28
-| GY-618B-B | Sn62.8-Pb36.8-Ag0.4 | Type 4 | BGA pack-Age PCBs |
29
-| LED Chip GY361 | Sn55-Pb45 | Type 3 | LED lamps, strips, and tapes |
30
-| GY638A | Sn60-Pb40 | Type 3 | Performance superior to GY361 |
31
-
32
-
33
-
34
-## target
35
-
36
-- [[FPC-dat]]
37
-
38
-
39
-
40
-## Common type Solder Paste
41
-
42
-| melting point | tin content | Note |
43
-| ------------- | ----------- | -------------------------------------------------------------------- |
44
-| 138 C | 42% | ultra-low temperature, bismuth-based, for special low-temp soldering |
45
-| 150 C | 42% | low temperature, bismuth-based, for temperature-sensitive components |
46
-| 183 C | 63% | best for most common PCB, small spacing, high parts density |
47
-| 217 C | 99.3% | lead-free, SAC305 alloy, standard for RoHS compliant PCBs |
48
-
49
-
50
-
51
-
52
-![](2024-02-17-16-19-00.png)
53
-
54
-![](2024-02-17-16-20-20.png)
55
-
56
-![](2024-02-17-16-20-38.png)
57
-
58
-![](2024-02-17-16-20-49.png)
59
-
60
-## solder paste printer
61
-
62
-![](2025-08-08-12-11-20.png)
63
-
64
-
65
-
66
-## ref
67
-
68
-- [[solder-paste]]
69
-
70
-- [[soldering-dat]]
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\ No newline at end of file
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tools-dat/soldering-tools-dat/solder-paste-dat/solder-paste-dat.md
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@@ -0,0 +1,70 @@
1
+
2
+# solder-paste-dat
3
+
4
+## Low temperature soldering paste
5
+
6
+Low temperature soldering paste is a type of solder paste designed to melt and flow at lower temperatures than standard solder pastes. Here are its main features:
7
+
8
+- Melting Point: Typically melts between 130°C and 180°C, compared to standard lead-free solder pastes which melt around 217°C.
9
+- Composition: Often contains bismuth-based alloys (e.g., Sn42/Bi58) instead of traditional tin-silver-copper (SAC) alloys.
10
+- Applications: Ideal for temperature-sensitive components, rework, or double-sided PCB assembly where high heat could dam-Age parts.
11
+- Reduced Thermal Stress: Minimizes risk of warping or dam-Aging PCBs and components.
12
+- Energy Saving: Lower reflow oven temperatures reduce energy consumption.
13
+- Compatibility: Useful for mixed-technology boards or assemblies with plastic connectors and LEDs.
14
+
15
+
16
+
17
+
18
+### Solder Paste Types and Applications
19
+
20
+
21
+| Solder Paste Model | Composition | Powder Type | Application/Notes |
22
+| -------------------- | ------------------- | ----------- | --------------------------------------------------- |
23
+| Mobile Repair GY618B | Sn62.8-Pb36.8-Ag0.4 | Type 4 | For mobile phone repair |
24
+| A-888 | Sn63-Pb37 | Type 3 | resistors, capacitors, simple IC PCBs |
25
+| A-888 | Sn63-Pb37 | Type 4 | resistors, capacitors, fine-pitch/multi-pin IC PCBs |
26
+| SMT Chip A-888 | Sn63-Pb37 | Type 5 | resistors, capacitors, dense/multi-pin IC PCBs |
27
+| GY-626B | Sn62.9-Pb36.9-Ag0.2 | Type 4 | QFN type PCBs |
28
+| GY-618B-B | Sn62.8-Pb36.8-Ag0.4 | Type 4 | BGA pack-Age PCBs |
29
+| LED Chip GY361 | Sn55-Pb45 | Type 3 | LED lamps, strips, and tapes |
30
+| GY638A | Sn60-Pb40 | Type 3 | Performance superior to GY361 |
31
+
32
+
33
+
34
+## target
35
+
36
+- [[FPC-dat]]
37
+
38
+
39
+
40
+## Common type Solder Paste
41
+
42
+| melting point | tin content | Note |
43
+| ------------- | ----------- | -------------------------------------------------------------------- |
44
+| 138 C | 42% | ultra-low temperature, bismuth-based, for special low-temp soldering |
45
+| 150 C | 42% | low temperature, bismuth-based, for temperature-sensitive components |
46
+| 183 C | 63% | best for most common PCB, small spacing, high parts density |
47
+| 217 C | 99.3% | lead-free, SAC305 alloy, standard for RoHS compliant PCBs |
48
+
49
+
50
+
51
+
52
+![](2024-02-17-16-19-00.png)
53
+
54
+![](2024-02-17-16-20-20.png)
55
+
56
+![](2024-02-17-16-20-38.png)
57
+
58
+![](2024-02-17-16-20-49.png)
59
+
60
+## solder paste printer
61
+
62
+![](2025-08-08-12-11-20.png)
63
+
64
+
65
+
66
+## ref
67
+
68
+- [[solder-paste]]
69
+
70
+- [[soldering-dat]]
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\ No newline at end of file
tools-dat/soldering-tools-dat/soldering-flux-dat/2025-09-10-17-34-56.png
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tools-dat/soldering-tools-dat/soldering-flux-dat/soldering-flux-dat.md
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@@ -0,0 +1,20 @@
1
+
2
+# soldering-flux-dat
3
+
4
+![](2025-09-10-17-34-56.png)
5
+
6
+- helogen free == white
7
+
8
+
9
+环保助焊松香
10
+- 易焊锡
11
+- 防氧化
12
+- 无腐蚀性
13
+- 无铅环保
14
+- 绝缘阻抗高
15
+- 浸润性好
16
+
17
+
18
+## ref
19
+
20
+- [[soldering-tools-dat]]
... ...
\ No newline at end of file
tools-dat/soldering-tools-dat/soldering-iron-dat/soldering-iron-dat.md
... ...
@@ -10,6 +10,10 @@ soldering iron
10 10
11 11
usb soldering iron - [[PSO1055-dat]]
12 12
13
+
14
+
15
+
16
+
13 17
## soldering iron tips
14 18
15 19
- [[PSO1025-dat]] - [[PSO1024-dat]] - [[PSO1023-dat]]
tools-dat/soldering-tools-dat/soldering-tools-dat.md
... ...
@@ -1,9 +1,25 @@
1 1
2 2
# soldering-tools-dat
3 3
4
-- [[soldering-iron-dat]]
4
+- [[soldering-iron-dat]] - [[soldering-tip-dat]]
5 5
6
+- [[preheat-bed-dat]]
6 7
8
+- [[soldering-flux-dat]]
9
+
10
+- [[solder-paste-dat]]
11
+
12
+- [[fab-stencil-dat]]
13
+
14
+- [[PCB-Adhesive-dat]] - [[SMT-Red-Adhesive-dat]]
15
+
16
+- [[soldering-dat]] - [[desoldering-dat]]
17
+
18
+- [[spot-welding-dat]]
19
+
20
+- [[PCB-dat]]
21
+
22
+- [[PCB-cleaner-dat]]
7 23
8 24
9 25
## soldering wires