b5329d41ea52701633c3f73f6481dd69a19a1c01
Home.md
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| 44 | 44 | |
| 45 | 45 | - [[service-dat]] - [[discount-dat]] - [[shipment-dat]] |
| 46 | 46 | |
| 47 | -- [[fab-dat]] - [[fab-qc-dat]] - [[fab-PCB-dat]] - [[PCB-standards-dat]] |
|
| 47 | +- [[fab-dat]] - [[fab-qc-dat]] - [[fab-PCB-dat]] - [[PCB-standards-dat]] - [[fab-soldering-dat]] |
|
| 48 | 48 | |
| 49 | 49 | |
| 50 | 50 | ## Weekly Updates |
fab-dat/fab-soldering-dat/PCB-desoldering-dat/PCB-desoldering-dat.md
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| 1 | + |
|
| 2 | +# desoldering-dat |
|
| 3 | + |
|
| 4 | +- [[PSO1043-dat]] == desoldering pump |
|
| 5 | + |
|
| 6 | +- [[PSO1038-dat]] == desoldering wire (wick) |
|
| 7 | + |
|
| 8 | +- [[hot-air-station-dat]] |
|
| 9 | + |
|
| 10 | +- [[Hot-Tweezer-dat]]: These are like regular tweezers but with heated tips. They can simultaneously heat and grip small two-leaded SMD components like resistors, capacitors, and SOT packages for easy removal. |
|
| 11 | + |
|
| 12 | + |
|
| 13 | + |
|
| 14 | + |
|
| 15 | +| Feature | Desoldering Wire (Wick) | Desoldering Pump | |
|
| 16 | +| ----------------- | ------------------------------ | --------------------------------------- | |
|
| 17 | +| **Function** | Absorbs melted solder | Sucks up melted solder | |
|
| 18 | +| **Best For** | Small, precise work | Removing large amounts of solder | |
|
| 19 | +| **Ease of Use** | Requires steady hand & flux | Requires quick reaction & suction | |
|
| 20 | +| **Effectiveness** | **Good for fine traces & SMD** | **Good for through-hole components** | |
|
| 21 | +| **Messiness** | Leaves minimal residue | Can scatter solder if not used properly | |
|
| 22 | +| **Durability** | One-time use per section | Reusable multiple times | |
|
| 23 | +| **Cost** | Cheap, but needs refilling | More expensive, but reusable | |
|
| 24 | +| **Skill Level** | Easier for beginners | Requires practice to master | |
|
| 25 | +| **Item** | [[PSO1043-dat]] | [[PSO1038-dat]] | |
|
| 26 | + |
|
| 27 | + |
|
| 28 | + |
|
| 29 | + |
|
| 30 | +## mess desoldering |
|
| 31 | + |
|
| 32 | +- [[preheat-bed-dat]] |
|
| 33 | + |
|
| 34 | + |
|
| 35 | + |
|
| 36 | + |
|
| 37 | + |
|
| 38 | +## ref |
|
| 39 | + |
|
| 40 | +- [[desoldering]] - [[soldering]] |
|
| 41 | + |
|
| 42 | + |
|
| 43 | +- [[soldering-dat]] - [[tech-dat]] |
|
| ... | ... | \ No newline at end of file |
fab-dat/fab-soldering-dat/PCB-desoldering-dat/desoldering-dat.md
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| 1 | - |
|
| 2 | -# desoldering-dat |
|
| 3 | - |
|
| 4 | -- [[PSO1043-dat]] == desoldering pump |
|
| 5 | - |
|
| 6 | -- [[PSO1038-dat]] == desoldering wire (wick) |
|
| 7 | - |
|
| 8 | -- [[hot-air-station-dat]] |
|
| 9 | - |
|
| 10 | -- [[Hot-Tweezer-dat]]: These are like regular tweezers but with heated tips. They can simultaneously heat and grip small two-leaded SMD components like resistors, capacitors, and SOT packages for easy removal. |
|
| 11 | - |
|
| 12 | - |
|
| 13 | - |
|
| 14 | - |
|
| 15 | -| Feature | Desoldering Wire (Wick) | Desoldering Pump | |
|
| 16 | -| ----------------- | ------------------------------ | --------------------------------------- | |
|
| 17 | -| **Function** | Absorbs melted solder | Sucks up melted solder | |
|
| 18 | -| **Best For** | Small, precise work | Removing large amounts of solder | |
|
| 19 | -| **Ease of Use** | Requires steady hand & flux | Requires quick reaction & suction | |
|
| 20 | -| **Effectiveness** | **Good for fine traces & SMD** | **Good for through-hole components** | |
|
| 21 | -| **Messiness** | Leaves minimal residue | Can scatter solder if not used properly | |
|
| 22 | -| **Durability** | One-time use per section | Reusable multiple times | |
|
| 23 | -| **Cost** | Cheap, but needs refilling | More expensive, but reusable | |
|
| 24 | -| **Skill Level** | Easier for beginners | Requires practice to master | |
|
| 25 | -| **Item** | [[PSO1043-dat]] | [[PSO1038-dat]] | |
|
| 26 | - |
|
| 27 | - |
|
| 28 | - |
|
| 29 | - |
|
| 30 | -## mess desoldering |
|
| 31 | - |
|
| 32 | -- [[preheat-bed-dat]] |
|
| 33 | - |
|
| 34 | - |
|
| 35 | - |
|
| 36 | - |
|
| 37 | - |
|
| 38 | -## ref |
|
| 39 | - |
|
| 40 | -- [[desoldering]] - [[soldering]] |
|
| 41 | - |
|
| 42 | - |
|
| 43 | -- [[soldering-dat]] - [[tech-dat]] |
|
| ... | ... | \ No newline at end of file |
fab-dat/fab-soldering-dat/PCB-soldering-materials-dat/PCB-soldering-materials-dat.md
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| 1 | + |
|
| 2 | + |
|
| 3 | +# soldering-materials-dat |
|
| 4 | + |
|
| 5 | + |
|
| 6 | +- [[solder-paste-dat]] - [[soldering-flux-dat]] |
|
| 7 | + |
|
| 8 | + |
|
| 9 | + |
|
| 10 | + |
|
| 11 | +## soldering wire |
|
| 12 | + |
|
| 13 | +Nickel, Copper, and Sandwich (For 18650/21700) |
|
| 14 | + |
|
| 15 | +| Material | Best Use Case | Pros | Cons | |
|
| 16 | +| :-------------- | :--------------------------------- | :--------------------------------------------------------------------------- | :--------------------------------------------------------------------- | |
|
| 17 | +| **Pure Nickel** | Standard DIY packs (5A-15A) | Easiest to spot weld; corrosion resistant. | Higher resistance than copper; heats up at high current. | |
|
| 18 | +| **Pure Copper** | High-performance (30A+) | Lowest resistance; minimal heat generation. | Extremely difficult to spot weld (requires laser/ultrasonic). | |
|
| 19 | +| **Sandwich** | High-current DIY (Nickel + Copper) | Better conductivity than pure nickel; weldable with high-power spot welders. | Hard to tune welding parameters; risk of "cold" welds or blow-through. | |
|
| 20 | + |
|
| 21 | + |
|
| 22 | + |
|
| 23 | +--- |
|
| 24 | + |
|
| 25 | +### 2. Al-Ni (Aluminum-Nickel) Composite Strips |
|
| 26 | + |
|
| 27 | +**Primary Purpose:** Transitioning between dissimilar metals. |
|
| 28 | + |
|
| 29 | +* **When to use:** Specifically for **Pouch Cells** or **Prismatic Cells** where the positive terminal (tab) is made of **Aluminum**. |
|
| 30 | +* **Why:** Aluminum and Nickel do not bond well through standard spot welding. |
|
| 31 | +* **How it works:** The strip is bi-metallic (half Al, half Ni). |
|
| 32 | + * **Al side** is welded to the battery's Aluminum tab. |
|
| 33 | + * **Ni side** provides a weldable surface for standard nickel busbars or wires. |
|
| 34 | +* **Summary:** It is a "bridge" material, not for 18650s (which use steel/nickel caps), but for batteries with raw aluminum electrodes. |
|
| 35 | + |
|
| 36 | + |
|
| 37 | + |
|
| 38 | + |
|
| 39 | + |
|
| 40 | + |
|
| 41 | +## 18650 Interconnect Materials: Why vs. Why Not |
|
| 42 | + |
|
| 43 | +| Material | Conductivity | Weldability | Best Used For... | |
|
| 44 | +| :-------------- | :---------------- | :------------ | :----------------------------------------------------------- | |
|
| 45 | +| **Pure Nickel** | Good (~25% of Cu) | **Excellent** | Standard DIY packs, Robotics (Rover V2), Electric bikes. | |
|
| 46 | +| **Pure Copper** | **Best (100%)** | **Very Poor** | Ultra-high performance racing drones or EV modules. | |
|
| 47 | +| **Sandwich** | High | **Difficult** | High-current DIY builds (Copper strip under a Nickel strip). | |
|
| 48 | + |
|
| 49 | +--- |
|
| 50 | + |
|
| 51 | +### Why we choose Pure Nickel for 18650s: |
|
| 52 | +1. **High Resistance (Ideal for Welding):** Spot welding relies on electrical resistance to generate heat. Nickel resists current just enough to melt instantly at the contact point, creating a strong bond. |
|
| 53 | +2. **Thermal Control:** Copper is a "heat sink"—it pulls heat away so fast that the weld point never gets hot enough to melt, but the battery cell underneath gets dangerously hot. |
|
| 54 | +3. **Corrosion Resistance:** Nickel does not rust or oxidize easily. Copper turns green (oxidizes) over time, which increases resistance and creates "hot spots." |
|
| 55 | +4. **Tool Compatibility:** Most hobbyist spot welders (Sunkko, Malectrics, Kweld) are designed specifically for the physics of nickel. |
|
| 56 | + |
|
| 57 | + |
|
| 58 | + |
|
| 59 | +## ref |
|
| 60 | + |
|
| 61 | +- [[soldering-tools-dat]] |
|
| 62 | + |
|
| 63 | + |
|
| 64 | + |
fab-dat/fab-soldering-dat/PCB-soldering-materials-dat/solder-paste-dat/2024-02-17-16-19-00.png
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fab-dat/fab-soldering-dat/PCB-soldering-materials-dat/solder-paste-dat/2024-02-17-16-20-38.png
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fab-dat/fab-soldering-dat/PCB-soldering-materials-dat/solder-paste-dat/2024-02-17-16-20-49.png
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fab-dat/fab-soldering-dat/PCB-soldering-materials-dat/solder-paste-dat/2025-08-08-12-11-20.png
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fab-dat/fab-soldering-dat/PCB-soldering-materials-dat/solder-paste-dat/solder-paste-dat.md
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| 1 | + |
|
| 2 | +# solder-paste-dat |
|
| 3 | + |
|
| 4 | +- [[high-precise-printing-dat]] |
|
| 5 | + |
|
| 6 | + |
|
| 7 | +## “Solder paste should be more viscous so it doesn’t spread or drip.” |
|
| 8 | + |
|
| 9 | +- **More viscous** → thicker, stickier, flows slowly |
|
| 10 | + → Good for solder paste — it stays where you apply it. |
|
| 11 | + |
|
| 12 | +- **Diluted** → thinned by adding liquid (like flux or solvent) |
|
| 13 | + → Not good — it becomes too runny and won’t hold components well. |
|
| 14 | + |
|
| 15 | + |
|
| 16 | + |
|
| 17 | + |
|
| 18 | + |
|
| 19 | +## Low temperature soldering paste |
|
| 20 | + |
|
| 21 | +Low temperature soldering paste is a type of solder paste designed to melt and flow at lower temperatures than standard solder pastes. Here are its main features: |
|
| 22 | + |
|
| 23 | +- Melting Point: Typically melts between 130°C and 180°C, compared to standard lead-free solder pastes which melt around 217°C. |
|
| 24 | +- Composition: Often contains bismuth-based alloys (e.g., Sn42/Bi58) instead of traditional tin-silver-copper (SAC) alloys. |
|
| 25 | +- Applications: Ideal for temperature-sensitive components, rework, or double-sided PCB assembly where high heat could dam-Age parts. |
|
| 26 | +- Reduced Thermal Stress: Minimizes risk of warping or dam-Aging PCBs and components. |
|
| 27 | +- Energy Saving: Lower reflow oven temperatures reduce energy consumption. |
|
| 28 | +- Compatibility: Useful for mixed-technology boards or assemblies with plastic connectors and LEDs. |
|
| 29 | + |
|
| 30 | + |
|
| 31 | + |
|
| 32 | + |
|
| 33 | +### Solder Paste Types and Applications |
|
| 34 | + |
|
| 35 | + |
|
| 36 | +| Solder Paste Model | Composition | Powder Type | Application/Notes | |
|
| 37 | +| -------------------- | ------------------- | ----------- | --------------------------------------------------- | |
|
| 38 | +| Mobile Repair GY618B | Sn62.8-Pb36.8-Ag0.4 | Type 4 | For mobile phone repair | |
|
| 39 | +| A-888 | Sn63-Pb37 | Type 3 | resistors, capacitors, simple IC PCBs | |
|
| 40 | +| A-888 | Sn63-Pb37 | Type 4 | resistors, capacitors, fine-pitch/multi-pin IC PCBs | |
|
| 41 | +| SMT Chip A-888 | Sn63-Pb37 | Type 5 | resistors, capacitors, dense/multi-pin IC PCBs | |
|
| 42 | +| GY-626B | Sn62.9-Pb36.9-Ag0.2 | Type 4 | QFN type PCBs | |
|
| 43 | +| GY-618B-B | Sn62.8-Pb36.8-Ag0.4 | Type 4 | BGA pack-Age PCBs | |
|
| 44 | +| LED Chip GY361 | Sn55-Pb45 | Type 3 | LED lamps, strips, and tapes | |
|
| 45 | +| GY638A | Sn60-Pb40 | Type 3 | Performance superior to GY361 | |
|
| 46 | + |
|
| 47 | + |
|
| 48 | + |
|
| 49 | +## target |
|
| 50 | + |
|
| 51 | +- [[FPC-dat]] |
|
| 52 | + |
|
| 53 | + |
|
| 54 | + |
|
| 55 | +## Common type Solder Paste |
|
| 56 | + |
|
| 57 | +| melting point | tin content | Note | |
|
| 58 | +| ------------- | ----------- | -------------------------------------------------------------------- | |
|
| 59 | +| 138 C | 42% | ultra-low temperature, bismuth-based, for special low-temp soldering | |
|
| 60 | +| 150 C | 42% | low temperature, bismuth-based, for temperature-sensitive components | |
|
| 61 | +| 183 C | 63% | best for most common PCB, small spacing, high parts density | |
|
| 62 | +| 217 C | 99.3% | lead-free, SAC305 alloy, standard for RoHS compliant PCBs | |
|
| 63 | + |
|
| 64 | + |
|
| 65 | + |
|
| 66 | + |
|
| 67 | + |
|
| 68 | + |
|
| 69 | + |
|
| 70 | + |
|
| 71 | + |
|
| 72 | + |
|
| 73 | + |
|
| 74 | + |
|
| 75 | +## solder paste printer |
|
| 76 | + |
|
| 77 | + |
|
| 78 | + |
|
| 79 | + |
|
| 80 | + |
|
| 81 | +## ref |
|
| 82 | + |
|
| 83 | +- [[solder-paste]] |
|
| 84 | + |
|
| 85 | +- [[soldering-dat]] |
|
| ... | ... | \ No newline at end of file |
fab-dat/fab-soldering-dat/PCB-soldering-materials-dat/soldering-flux-dat/2025-09-10-17-34-56.png
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fab-dat/fab-soldering-dat/PCB-soldering-materials-dat/soldering-flux-dat/soldering-flux-dat.md
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| 1 | + |
|
| 2 | +# soldering-flux-dat |
|
| 3 | + |
|
| 4 | + |
|
| 5 | + |
|
| 6 | +- helogen free == white |
|
| 7 | + |
|
| 8 | + |
|
| 9 | +环保助焊松香 |
|
| 10 | +- 易焊锡 |
|
| 11 | +- 防氧化 |
|
| 12 | +- 无腐蚀性 |
|
| 13 | +- 无铅环保 |
|
| 14 | +- 绝缘阻抗高 |
|
| 15 | +- 浸润性好 |
|
| 16 | + |
|
| 17 | + |
|
| 18 | +## ref |
|
| 19 | + |
|
| 20 | +- [[soldering-tools-dat]] |
|
| ... | ... | \ No newline at end of file |
fab-dat/fab-soldering-dat/PCB-soldering-tools-dat/solder-paste-dat/2024-02-17-16-19-00.png
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fab-dat/fab-soldering-dat/PCB-soldering-tools-dat/solder-paste-dat/2024-02-17-16-20-20.png
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fab-dat/fab-soldering-dat/PCB-soldering-tools-dat/solder-paste-dat/2024-02-17-16-20-38.png
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fab-dat/fab-soldering-dat/PCB-soldering-tools-dat/solder-paste-dat/2024-02-17-16-20-49.png
| ... | ... | Binary files a/fab-dat/fab-soldering-dat/PCB-soldering-tools-dat/solder-paste-dat/2024-02-17-16-20-49.png and /dev/null differ |
fab-dat/fab-soldering-dat/PCB-soldering-tools-dat/solder-paste-dat/2025-08-08-12-11-20.png
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fab-dat/fab-soldering-dat/PCB-soldering-tools-dat/solder-paste-dat/solder-paste-dat.md
| ... | ... | @@ -1,85 +0,0 @@ |
| 1 | - |
|
| 2 | -# solder-paste-dat |
|
| 3 | - |
|
| 4 | -- [[high-precise-printing-dat]] |
|
| 5 | - |
|
| 6 | - |
|
| 7 | -## “Solder paste should be more viscous so it doesn’t spread or drip.” |
|
| 8 | - |
|
| 9 | -- **More viscous** → thicker, stickier, flows slowly |
|
| 10 | - → Good for solder paste — it stays where you apply it. |
|
| 11 | - |
|
| 12 | -- **Diluted** → thinned by adding liquid (like flux or solvent) |
|
| 13 | - → Not good — it becomes too runny and won’t hold components well. |
|
| 14 | - |
|
| 15 | - |
|
| 16 | - |
|
| 17 | - |
|
| 18 | - |
|
| 19 | -## Low temperature soldering paste |
|
| 20 | - |
|
| 21 | -Low temperature soldering paste is a type of solder paste designed to melt and flow at lower temperatures than standard solder pastes. Here are its main features: |
|
| 22 | - |
|
| 23 | -- Melting Point: Typically melts between 130°C and 180°C, compared to standard lead-free solder pastes which melt around 217°C. |
|
| 24 | -- Composition: Often contains bismuth-based alloys (e.g., Sn42/Bi58) instead of traditional tin-silver-copper (SAC) alloys. |
|
| 25 | -- Applications: Ideal for temperature-sensitive components, rework, or double-sided PCB assembly where high heat could dam-Age parts. |
|
| 26 | -- Reduced Thermal Stress: Minimizes risk of warping or dam-Aging PCBs and components. |
|
| 27 | -- Energy Saving: Lower reflow oven temperatures reduce energy consumption. |
|
| 28 | -- Compatibility: Useful for mixed-technology boards or assemblies with plastic connectors and LEDs. |
|
| 29 | - |
|
| 30 | - |
|
| 31 | - |
|
| 32 | - |
|
| 33 | -### Solder Paste Types and Applications |
|
| 34 | - |
|
| 35 | - |
|
| 36 | -| Solder Paste Model | Composition | Powder Type | Application/Notes | |
|
| 37 | -| -------------------- | ------------------- | ----------- | --------------------------------------------------- | |
|
| 38 | -| Mobile Repair GY618B | Sn62.8-Pb36.8-Ag0.4 | Type 4 | For mobile phone repair | |
|
| 39 | -| A-888 | Sn63-Pb37 | Type 3 | resistors, capacitors, simple IC PCBs | |
|
| 40 | -| A-888 | Sn63-Pb37 | Type 4 | resistors, capacitors, fine-pitch/multi-pin IC PCBs | |
|
| 41 | -| SMT Chip A-888 | Sn63-Pb37 | Type 5 | resistors, capacitors, dense/multi-pin IC PCBs | |
|
| 42 | -| GY-626B | Sn62.9-Pb36.9-Ag0.2 | Type 4 | QFN type PCBs | |
|
| 43 | -| GY-618B-B | Sn62.8-Pb36.8-Ag0.4 | Type 4 | BGA pack-Age PCBs | |
|
| 44 | -| LED Chip GY361 | Sn55-Pb45 | Type 3 | LED lamps, strips, and tapes | |
|
| 45 | -| GY638A | Sn60-Pb40 | Type 3 | Performance superior to GY361 | |
|
| 46 | - |
|
| 47 | - |
|
| 48 | - |
|
| 49 | -## target |
|
| 50 | - |
|
| 51 | -- [[FPC-dat]] |
|
| 52 | - |
|
| 53 | - |
|
| 54 | - |
|
| 55 | -## Common type Solder Paste |
|
| 56 | - |
|
| 57 | -| melting point | tin content | Note | |
|
| 58 | -| ------------- | ----------- | -------------------------------------------------------------------- | |
|
| 59 | -| 138 C | 42% | ultra-low temperature, bismuth-based, for special low-temp soldering | |
|
| 60 | -| 150 C | 42% | low temperature, bismuth-based, for temperature-sensitive components | |
|
| 61 | -| 183 C | 63% | best for most common PCB, small spacing, high parts density | |
|
| 62 | -| 217 C | 99.3% | lead-free, SAC305 alloy, standard for RoHS compliant PCBs | |
|
| 63 | - |
|
| 64 | - |
|
| 65 | - |
|
| 66 | - |
|
| 67 | - |
|
| 68 | - |
|
| 69 | - |
|
| 70 | - |
|
| 71 | - |
|
| 72 | - |
|
| 73 | - |
|
| 74 | - |
|
| 75 | -## solder paste printer |
|
| 76 | - |
|
| 77 | - |
|
| 78 | - |
|
| 79 | - |
|
| 80 | - |
|
| 81 | -## ref |
|
| 82 | - |
|
| 83 | -- [[solder-paste]] |
|
| 84 | - |
|
| 85 | -- [[soldering-dat]] |
|
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fab-dat/fab-soldering-dat/PCB-soldering-tools-dat/soldering-flux-dat/2025-09-10-17-34-56.png
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fab-dat/fab-soldering-dat/PCB-soldering-tools-dat/soldering-flux-dat/soldering-flux-dat.md
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| 1 | - |
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| 2 | -# soldering-flux-dat |
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| 3 | - |
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| 4 | - |
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| 5 | - |
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| 6 | -- helogen free == white |
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| 7 | - |
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| 8 | - |
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| 9 | -环保助焊松香 |
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| 10 | -- 易焊锡 |
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| 11 | -- 防氧化 |
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| 12 | -- 无腐蚀性 |
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| 13 | -- 无铅环保 |
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| 14 | -- 绝缘阻抗高 |
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| 15 | -- 浸润性好 |
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| 16 | - |
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| 17 | - |
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| 18 | -## ref |
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| 19 | - |
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| 20 | -- [[soldering-tools-dat]] |
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fab-dat/fab-soldering-dat/PCB-soldering-tools-dat/soldering-materials-dat/soldering-materials-dat.md
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| 1 | - |
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| 2 | - |
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| 3 | -# soldering-materials-dat |
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| 4 | - |
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| 5 | - |
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| 6 | -Nickel, Copper, and Sandwich (For 18650/21700) |
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| 7 | - |
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| 8 | -| Material | Best Use Case | Pros | Cons | |
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| 9 | -| :-------------- | :--------------------------------- | :--------------------------------------------------------------------------- | :--------------------------------------------------------------------- | |
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| 10 | -| **Pure Nickel** | Standard DIY packs (5A-15A) | Easiest to spot weld; corrosion resistant. | Higher resistance than copper; heats up at high current. | |
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| 11 | -| **Pure Copper** | High-performance (30A+) | Lowest resistance; minimal heat generation. | Extremely difficult to spot weld (requires laser/ultrasonic). | |
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| 12 | -| **Sandwich** | High-current DIY (Nickel + Copper) | Better conductivity than pure nickel; weldable with high-power spot welders. | Hard to tune welding parameters; risk of "cold" welds or blow-through. | |
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| 13 | - |
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| 14 | - |
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| 15 | - |
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| 16 | ---- |
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| 17 | - |
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| 18 | -### 2. Al-Ni (Aluminum-Nickel) Composite Strips |
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| 19 | - |
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| 20 | -**Primary Purpose:** Transitioning between dissimilar metals. |
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| 21 | - |
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| 22 | -* **When to use:** Specifically for **Pouch Cells** or **Prismatic Cells** where the positive terminal (tab) is made of **Aluminum**. |
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| 23 | -* **Why:** Aluminum and Nickel do not bond well through standard spot welding. |
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| 24 | -* **How it works:** The strip is bi-metallic (half Al, half Ni). |
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| 25 | - * **Al side** is welded to the battery's Aluminum tab. |
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| 26 | - * **Ni side** provides a weldable surface for standard nickel busbars or wires. |
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| 27 | -* **Summary:** It is a "bridge" material, not for 18650s (which use steel/nickel caps), but for batteries with raw aluminum electrodes. |
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| 28 | - |
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| 29 | - |
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| 30 | - |
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| 31 | - |
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| 32 | - |
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| 33 | - |
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| 34 | -## 18650 Interconnect Materials: Why vs. Why Not |
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| 35 | - |
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| 36 | -| Material | Conductivity | Weldability | Best Used For... | |
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| 37 | -| :-------------- | :---------------- | :------------ | :----------------------------------------------------------- | |
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| 38 | -| **Pure Nickel** | Good (~25% of Cu) | **Excellent** | Standard DIY packs, Robotics (Rover V2), Electric bikes. | |
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| 39 | -| **Pure Copper** | **Best (100%)** | **Very Poor** | Ultra-high performance racing drones or EV modules. | |
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| 40 | -| **Sandwich** | High | **Difficult** | High-current DIY builds (Copper strip under a Nickel strip). | |
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| 41 | - |
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| 42 | ---- |
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| 43 | - |
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| 44 | -### Why we choose Pure Nickel for 18650s: |
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| 45 | -1. **High Resistance (Ideal for Welding):** Spot welding relies on electrical resistance to generate heat. Nickel resists current just enough to melt instantly at the contact point, creating a strong bond. |
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| 46 | -2. **Thermal Control:** Copper is a "heat sink"—it pulls heat away so fast that the weld point never gets hot enough to melt, but the battery cell underneath gets dangerously hot. |
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| 47 | -3. **Corrosion Resistance:** Nickel does not rust or oxidize easily. Copper turns green (oxidizes) over time, which increases resistance and creates "hot spots." |
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| 48 | -4. **Tool Compatibility:** Most hobbyist spot welders (Sunkko, Malectrics, Kweld) are designed specifically for the physics of nickel. |
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| 49 | - |
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| 50 | - |
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| 51 | - |
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| 52 | -## ref |
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| 53 | - |
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| 54 | -- [[soldering-tools-dat]] |
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| 55 | - |
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| 56 | - |
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| 57 | - |
fab-dat/fab-soldering-dat/fab-PCB-soldering-skills-dat/fab-PCB-soldering-skills-dat.md
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| 1 | - |
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| 2 | -# fab-PCB-soldering-skills-dat |
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| 3 | - |
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| 4 | - |
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| 5 | -- use soldering flux |
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| 6 | - |
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| 7 | -- to resolder a chip, and to keep all the pins well contact, add weight on the chip to gain better contact |
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| 8 | - |
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| 9 | - |
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| 10 | - |
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| 11 | - |
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| 12 | - |
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| 13 | - |
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| 14 | - |
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| 15 | - |
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| 16 | - |
fab-dat/fab-soldering-dat/fab-soldering-dat.md
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| 1 | +# fab-soldering-dat |
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| 2 | + |
|
| 3 | +- [[PCB-soldering-skills-dat]] |
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| 4 | + |
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| 5 | +- [[PCB-desoldering-dat]] |
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| 6 | + |
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| 7 | +- [[PCB-soldering-dross-dat]] |
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| 8 | + |
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| 9 | +- [[PCB-soldering-tools-dat]] - [[soldering-tools-spot-welding-dat]] - [[soldering-iron-dat]] - [[preheat-bed-dat]] - [[hot-air-station-dat]] |
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| 10 | + |
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| 11 | + |
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| 12 | +- [[soldering-materials-dat]] - [[soldering-flux-dat]] - [[solder-paste-dat]] |
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| 13 | + |
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| 14 | + |
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| 15 | + |
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| 16 | + |
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| 17 | +## ref |
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| 18 | + |
|
| 19 | + |