soldering

+- [[fab-dat]] - [[fab-PCBA-dat]] - [[fab-stencil-dat]] - [[fab-3d-print-dat]]

+

+- [[fab-workspace-dat]]

+

+- [[fab-PCB-dat]] - [[fab-PCB-soldering-dat]] - [[fab-soldering-tools-dat]] - [[fab-PCB-desoldering-dat]] - [[fab-soldering-materials-dat]]

+

+- [[fab-PCB-dat]] - [[fab-PCB-soldering-dat]] - [[fab-PCB-soldering-tools-dat]] - [[fab-PCB-desoldering-dat]] - [[fab-soldering-materials-dat]]

+

+

+

+# PCB-soldering-dross-dat

+

+In the context of PCB soldering, the professional term for 锡渣 (xī zhā) is Solder Dross.

+

+While you might hear "solder scrap" or "waste solder" in casual conversation, "dross" is the specific technical term used in manufacturing and engineering.

+

+

+### What exactly is Solder Dross?

+

+Dross is a combination of oxidized metal and impurities that forms on the surface of molten solder, particularly during wave soldering or selective soldering processes. When the liquid solder is exposed to air, it reacts with oxygen to create a thick, crusty layer of metal oxides (mostly tin and lead oxides).

+

+

+### Key Terminology Comparison

+| Chinese Term | English Technical Term | Description |

+| :--- | :--- | :--- |

+| **锡渣** | **Solder Dross** | The oxidized "scum" that floats on top of a solder pot. |

+| **锡球 / 锡珠** | **Solder Ball / Solder Bead** | Small, unwanted spheres of solder that stick to the PCB surface. |

+| **锡桥** | **Solder Bridge** | An accidental connection between two conductors (a short circuit). |

+| **焊坝** | **Solder Dam** | A barrier (often solder mask) used to prevent solder from flowing where it shouldn't. |

+

+---

+

+### Why it matters in production

+In a professional setting, dross is managed carefully because:

+1. **Waste:** It consumes expensive solder alloy that could otherwise be used for joints.

+2. **Defects:** If dross particles get trapped in a solder joint, they can cause physical weakness or poor electrical conductivity.

+3. **Maintenance:** It must be regularly skimmed off the top of the solder pot. Many factories use "dross reducers" (chemical powders) or nitrogen-inert environments to minimize its formation.

+

+

+

+## common hobby level solutions

+

+Markdown

+### Reducing Solder Dross in Non-Professional Reflow Soldering

+

+For DIY enthusiasts or users using **non-professional equipment** (such as converted toaster ovens, hot plates, or heat guns), the "dross" or residue you see is usually caused by solder paste oxidation, flux charring, or poor temperature control.

+

+Here is how to minimize these issues in a home or lab environment:

+

+---

+

+### 1. Solder Paste Management (The Source)

+In SMT reflow, dross-like particles are often "solder balls" caused by degraded paste.

+* **Avoid Oxidation:** Solder paste has a shelf life. Once the flux dries out, the microscopic metal powder oxidizes. When heated, these powder grains won't fuse, creating a "sand-like" dross.

+* **Proper Warming:** If stored in a fridge, let the paste reach room temperature for 2-4 hours before opening. Using cold paste causes moisture to condense, leading to "spattering" and tiny solder beads during heating.

+

+### 2. Optimize the Temperature Profile

+Non-professional tools often heat too fast or stay at peak temperature too long.

+* **The Soak Phase:** Do not rush to the melting point. Maintain a temperature around **150°C** for 60-90 seconds. This allows the flux to clean the metal surfaces and prevents the "popcorn effect."

+* **Limit Peak Time:** Once the solder melts (approx. 217°C for lead-free), try to finish the reflow and start cooling within 30-60 seconds. Staying at high heat for too long burns the flux into a black, crusty residue.

+

+### 3. Use High-Quality External Flux

+If your solder joints look dull or have "scum" on top:

+* **Add Tacky Flux:** Apply a small amount of high-quality flux (like NC-559 or similar) to the pads before reflow.

+* **The Benefit:** Extra flux helps reduce any oxides that form during the uneven heating of a DIY oven, helping the liquid metal pull together into a clean, shiny joint.

+

+### 4. Stencil & Deposition Control

+"Dross" in SMT is often just excess solder that had nowhere to go.

+* **Use a Stencil:** Avoid hand-applying paste if possible. A stencil ensures the exact volume is applied.

+* **Reduce Apertures:** If you consistently see tiny beads around components, design your stencil openings to be about 90% of the actual pad size.

+

+### 5. Environment & Cleaning

+* **Minimize Airflow:** In a DIY toaster oven, try to keep the door closed and seal major gaps. Constant fresh air brings in more oxygen, which accelerates dross formation.

+* **Pre-Cleaning:** Use 99.9% Isopropyl Alcohol (IPA) to clean the PCB and component leads before soldering. Contaminants like finger oils often turn into "dross" under heat.

+

+---

+

+### Troubleshooting Table

+| Symptom | Primary Cause | Solution |

+| :--- | :--- | :--- |

+| **Solder Beads (Scattered dots)** | Rapid heating or moisture | Increase "soak" time at 150°C |

+| **Charred Residue (Black crust)** | Temperature too high/too long | Lower peak temp; shorten reflow time |

+| **Dull/Grainy Joints** | High oxidation | Use fresh paste; add extra flux |

+

+> **Pro Tip:** If using a **Hot Plate**, placing a small metal "tent" or cover over the PCB can help stabilize the temperature and create a micro-environment with less oxygen movement, resulting in much cleaner solder joints.

+

+

+

+## pressfional methods to prevent solder dross

+

+

+To prevent **Solder Dross** (锡渣) in a professional SMT (Surface Mount Technology) or through-hole environment, you must address the root cause: **Oxidation**.

+

+Dross forms when molten solder reacts with oxygen. In a standard SMT reflow process (using solder paste), dross is less of a concern than in **Wave Soldering** or **Selective Soldering**, where large pots of molten metal are exposed to air.

+

+Here are the professional methods to prevent and manage dross:

+

+### 1. Atmosphere Control (The Gold Standard)

+The most effective way to prevent dross is to remove the oxygen entirely.

+* **Nitrogen ($N_2$) Blanketing:** Filling the soldering machine with high-purity Nitrogen (typically 99.99% or oxygen levels below 500 ppm). Without oxygen, the metal cannot oxidize into dross.

+* **Inerting the Wave:** In wave soldering, specialized "hoods" or nitrogen diffusers cover the solder pot to keep the air out.

+

+

+

+### 2. Chemical Solutions

+If nitrogen is too expensive for your setup, you can use chemicals to inhibit oxidation:

+* **Dross Reducers / "Anti-Dross" Powder:** These are antioxidant powders (like phosphorus-based pellets) added to the solder pot. They float on top and react with oxygen so the solder doesn't have to.

+* **Solder Oils/Blankets:** A layer of specialized heat-stable oil is floated on the surface of the molten solder to create a physical barrier against air.

+

+### 3. Equipment & Process Optimization

+Mechanical turbulence is a major "dross generator." Every time the solder splashes or ripples, more surface area is exposed to air.

+* **Reduce Wave Height:** Keep the solder wave as low as possible while still making contact with the PCB.

+* **Minimize Turbulence:** Ensure pump speeds are steady and that the "fall" of the solder back into the pot is smooth rather than splashing.

+* **Standby Mode:** Use machines that automatically lower the pump speed or turn off the wave when no PCBs are detected on the conveyor.

+* **Keep the Pot Full:** A low solder level increases the distance the metal "falls" back into the pot, creating more bubbles and turbulence.

+

+

+

+### 4. Solder Quality & Maintenance

+* **Use Low-Drossing Alloys:** Professional-grade solder bars (like SAC305 or Sn63Pb37) often contain trace amounts of **Germanium (Ge)** or **Phosphorus (P)** which act as "oxygen scavengers" to keep the surface shiny.

+* **Controlled De-drossing:** When you must remove dross, use a **Solder Recovery System** (a mechanical press). "Raw" dross is actually 70%–90% good solder trapped in an oxide "web." These machines squeeze the good metal back out so you don't waste it.

+

+### Comparison Summary

+| Method | Effectiveness | Cost | Best For |

+| :--- | :--- | :--- | :--- |

+| **Nitrogen ($N_2$)** | Highest | High (Gas costs) | High-volume, High-reliability |

+| **Antioxidant Pellets** | Medium | Low | Small-to-medium shops |

+| **Wave Optimization** | Low-Medium | Free (Process) | All wave soldering |

+| **Solder Recovery** | High (for savings) | Moderate (Tool) | Reducing waste costs |

+

+> **Pro Tip:** If you are seeing "grainy" or "dull" joints on your PCBs, it’s a sign that dross is being sucked into the pump and mixed into your solder joints. Always skim the surface regularly but gently—vigorous stirring actually creates more dross!

+

+

+

+## ref

+

+

+# fab-PCB-soldering-skills-dat

+

+

+- use soldering flux

+

+- to resolder a chip, and to keep all the pins well contact, add weight on the chip to gain better contact

+

+

+

+

+

+

+## hang soldering

+

+

+

+

+# fab-soldering-dat

+

+

+- [[fab-PCB-dat]] - [[fab-PCB-soldering-dat]] - [[fab-PCB-soldering-tools-dat]] - [[fab-PCB-desoldering-dat]] - [[fab-soldering-materials-dat]]

+

+- [[fab-soldering-float]] - [[fab-soldering-float-dat]] - [[fab-soldering-dat]]

+

+

+

+

+

+- [[PCB-soldering-skills-dat]]

+

+- [[PCB-soldering-dross-dat]]

+

+- [[fab-soldering-tools-dat]] - [[soldering-tools-spot-welding-dat]] - [[soldering-iron-dat]] - [[preheat-bed-dat]] - [[hot-air-station-dat]]

+

+

+- [[fab-soldering-materials-dat]] - [[soldering-flux-dat]] - [[solder-paste-dat]]

+

+

+

+

+## ref

+

+- [[fab-soldering]]

+

+

+# soldering-materials-dat

+

+

+

+- [[fab-PCB-dat]] - [[fab-PCB-soldering-dat]] - [[fab-PCB-soldering-tools-dat]] - [[fab-PCB-desoldering-dat]] - [[fab-soldering-materials-dat]]

+

+

+

+- [[solder-paste-dat]] - [[soldering-flux-dat]]

+

+- [[battery-strips-dat]]

+

+## ref

+

+- [[PCB-soldering-tools-dat]]

+

+

+

+

+# solder-paste-dat

+

+- [[high-precise-printing-dat]]

+

+

+## solder dross issue

+

+

+### How to Fix "Grey" or Oxidized Solder Joints

+

+Grey joints are usually caused by **overheating** (burning off the flux), **underheating** (cold joints), or **slow cooling**. Follow these steps to "refresh" the joints:

+

+---

+

+### 1. The "Flux-and-Reflow" Method (Best for SMD)

+If the joint is just dull but the component is correctly aligned, **Flux** is your best friend.

+* **Apply Tacky Flux:** Cover the grey joints with a generous amount of high-quality "no-clean" or RMA tacky flux (e.g., Amtech NC-559).

+* **Re-apply Heat:** * **Hot Air Station:** Set to ~280°C - 300°C with low airflow. Heat the area until you see the solder turn liquid and "jump" into a shiny, spherical shape.

+ * **Soldering Iron:** Touch the joint briefly with a clean, tinned tip. The flux will smoke and chemically "eat" the grey oxide layer.

+* **Why it works:** Flux is a reducing agent. It chemically removes the oxygen from the "grey" tin-oxide and allows the pure metal to flow together again.

+

+

+### What happens inside the can at $30^\circ\text{C}$?

+

+1. **Flux Separation (The "Oil" Effect):** Solder paste is a suspension of heavy metal spheres in a lighter chemical flux. At $30^\circ\text{C}$, the flux becomes less viscous. The heavy solder powder will settle to the bottom, and a yellowish, oily liquid (the flux) will rise to the top.

+

+2. **Chemical Activity Loss:** Flux is designed to "activate" (clean oxides) at high temperatures. However, at $30^\circ\text{C}$, a slow chemical reaction begins prematurely. The flux starts "working" on the solder powder while it's still in the can, exhausting its strength before it ever touches your PCB.

+

+3. **Powder Oxidation:** Even in a "sealed" plastic can, there is trapped air (oxygen) inside. Heat acts as a catalyst. The microscopic surface area of the solder spheres is massive, and $30^\circ\text{C}$ provides enough energy for a thin layer of **Tin Oxide** ($SnO$ or $SnO_2$) to form on every single sphere.

+

+

+

+---

+

+### How to tell if your paste is "dead"

+Before using it on a real project, perform these three checks:

+

+* **The Stir Test:** Open the can. If there is a thick layer of liquid on top, try to stir it back in. If it remains "chunky," "dry," or like "wet sand" that won't smooth out, the flux has evaporated or polymerized. **Throw it away.**

+* **The Slump Test:** Apply a small amount to a surface. If it spreads out and loses its shape (slumps) at room temperature, it will likely cause "solder bridges" (连锡) during reflow.

+* **The Solder Ball Test:** Put a small dab on a piece of scrap PCB and heat it with a heat gun.

+ * **Good:** The paste melts into one single, shiny, beautiful silver ball.

+ * **Bad:** The paste melts but leaves behind dozens of tiny "satellites" (small grey dust-like balls) around the main drop. This is a sign of heavy oxidation.

+

+---

+

+### Comparison of Storage Conditions

+| Storage Temp | Expected Shelf Life | Resulting Quality |

+| :--- | :--- | :--- |

+| **$0\text{--}10^\circ\text{C}$ (Fridge)** | 6–12 Months | **Professional Grade.** Shiny joints, minimal dross. |

+| **$20\text{--}25^\circ\text{C}$ (Room)** | 1–2 Months | **Acceptable for DIY.** May require extra flux. |

+| **$30^\circ\text{C}+$ (Warm)** | < 3 Weeks | **Poor.** High risk of grey joints and solder beads. |

+

+---

+

+### Can you fix it?

+If you *must* use this paste and it has separated:

+1. **Manual Homogenization:** Stir it vigorously for at least 2–3 minutes with a clean spatula until it looks like creamy peanut butter.

+2. **Add "Fresh" Flux:** If the paste feels dry, add a few drops of high-quality **Tacky Flux** (like NC-559) and mix it in. This can sometimes "rescue" oxidized powder by providing the extra cleaning power needed to break through the $30^\circ\text{C}$ oxide layer.

+

+

+## “Solder paste should be more viscous so it doesn’t spread or drip.”

+

+- **More viscous** → thicker, stickier, flows slowly

+ → Good for solder paste — it stays where you apply it.

+

+- **Diluted** → thinned by adding liquid (like flux or solvent)

+ → Not good — it becomes too runny and won’t hold components well.

+

+

+

+

+

+## Low temperature soldering paste

+

+Low temperature soldering paste is a type of solder paste designed to melt and flow at lower temperatures than standard solder pastes. Here are its main features:

+

+- Melting Point: Typically melts between 130°C and 180°C, compared to standard lead-free solder pastes which melt around 217°C.

+- Composition: Often contains bismuth-based alloys (e.g., Sn42/Bi58) instead of traditional tin-silver-copper (SAC) alloys.

+- Applications: Ideal for temperature-sensitive components, rework, or double-sided PCB assembly where high heat could dam-Age parts.

+- Reduced Thermal Stress: Minimizes risk of warping or dam-Aging PCBs and components.

+- Energy Saving: Lower reflow oven temperatures reduce energy consumption.

+- Compatibility: Useful for mixed-technology boards or assemblies with plastic connectors and LEDs.

+

+

+

+

+### Solder Paste Types and Applications

+

+

+| Solder Paste Model | Composition | Powder Type | Application/Notes |

+| -------------------- | ------------------- | ----------- | --------------------------------------------------- |

+| Mobile Repair GY618B | Sn62.8-Pb36.8-Ag0.4 | Type 4 | For mobile phone repair |

+| A-888 | Sn63-Pb37 | Type 3 | resistors, capacitors, simple IC PCBs |

+| A-888 | Sn63-Pb37 | Type 4 | resistors, capacitors, fine-pitch/multi-pin IC PCBs |

+| SMT Chip A-888 | Sn63-Pb37 | Type 5 | resistors, capacitors, dense/multi-pin IC PCBs |

+| GY-626B | Sn62.9-Pb36.9-Ag0.2 | Type 4 | QFN type PCBs |

+| GY-618B-B | Sn62.8-Pb36.8-Ag0.4 | Type 4 | BGA pack-Age PCBs |

+| LED Chip GY361 | Sn55-Pb45 | Type 3 | LED lamps, strips, and tapes |

+| GY638A | Sn60-Pb40 | Type 3 | Performance superior to GY361 |

+

+

+

+## target

+

+- [[FPC-dat]]

+

+

+

+## Common type Solder Paste

+

+| melting point | tin content | Note |

+| ------------- | ----------- | -------------------------------------------------------------------- |

+| 138 C | 42% | ultra-low temperature, bismuth-based, for special low-temp soldering |

+| 150 C | 42% | low temperature, bismuth-based, for temperature-sensitive components |

+| 183 C | 63% | best for most common PCB, small spacing, high parts density |

+| 217 C | 99.3% | lead-free, SAC305 alloy, standard for RoHS compliant PCBs |

+

+

+

+

+

+

+

+

+

+

+

+

+## solder paste printer

+

+

+

+

+

+## ref

+

+- [[solder-paste]]

+

+- [[soldering-dat]]

+

+# soldering-flux-dat

+

+

+- [[solder-flux]]

+

+

+

+- helogen free == white

+

+

+环保助焊松香

+- 易焊锡

+- 防氧化

+- 无腐蚀性

+- 无铅环保

+- 绝缘阻抗高

+- 浸润性好

+

+

+## ref

+

+- [[soldering-tools-dat]]

+

+# fab-PCB-desoldering-dat

+

+

+- [[fab-PCB-dat]] - [[fab-PCB-soldering-dat]] - [[fab-PCB-soldering-tools-dat]] - [[fab-PCB-desoldering-dat]] - [[fab-soldering-materials-dat]]

+

+

+- [[PSO1043-dat]] == desoldering pump

+

+- [[PSO1038-dat]] == desoldering wire (wick)

+

+- [[hot-air-station-dat]]

+

+- [[Hot-Tweezer-dat]]: These are like regular tweezers but with heated tips. They can simultaneously heat and grip small two-leaded SMD components like resistors, capacitors, and SOT packages for easy removal.

+

+

+

+

+| Feature | Desoldering Wire (Wick) | Desoldering Pump |

+| ----------------- | ------------------------------ | --------------------------------------- |

+| **Function** | Absorbs melted solder | Sucks up melted solder |

+| **Best For** | Small, precise work | Removing large amounts of solder |

+| **Ease of Use** | Requires steady hand & flux | Requires quick reaction & suction |

+| **Effectiveness** | **Good for fine traces & SMD** | **Good for through-hole components** |

+| **Messiness** | Leaves minimal residue | Can scatter solder if not used properly |

+| **Durability** | One-time use per section | Reusable multiple times |

+| **Cost** | Cheap, but needs refilling | More expensive, but reusable |

+| **Skill Level** | Easier for beginners | Requires practice to master |

+| **Item** | [[PSO1043-dat]] | [[PSO1038-dat]] |

+

+

+

+

+## mess desoldering

+

+- [[preheat-bed-dat]]

+

+

+

+

+

+## ref

+

+- [[desoldering]] - [[soldering]]

+

+

+- [[soldering-dat]] - [[tech-dat]]

+

+# fab-soldering-tools-dat

+

+- [[fab-PCB-dat]] - [[fab-PCB-soldering-dat]] - [[fab-PCB-soldering-tools-dat]] - [[fab-PCB-desoldering-dat]] - [[fab-soldering-materials-dat]]

+

+main tools

+

+- [[soldering-iron-dat]] - [[soldering-tip-dat]] - [[soldering-station-dat]]

+

+best accessoeries

+

+- [[soldering-wick-dat]] - [[PSO1038-dat]]

+

+soldering iron rack - https://www.electrodragon.com/product/casting-metal-soldering-rack/ - [[PSOS010-dat]]

+

+

+

+- [[preheat-bed-dat]]

+

+- [[solder-paste-dat]]

+

+- [[fab-stencil-dat]]

+

+- [[PCB-Adhesive-dat]] - [[SMT-Red-Adhesive-dat]]

+

+- [[soldering-dat]] - [[desoldering-dat]]

+

+- [[spot-welding-dat]]

+

+- [[PCB-dat]]

+

+- [[PCB-cleaner-dat]]

+

+- [[hot-air-station-dat]]

+

+

+

+## soldering rack

+

+- [[PSOS033-dat]] - [[PSOS010-dat]]

+

+

+## soldering wires

+

+- [[PSO1030-dat]]

+

+

+

+## Soldering Flux

+

+- [[soldering-flux-dat]]

+

+- [[PSO1046-dat]]

+

+

+

+

+

+

+## ref

+

+- [[soldering-dat]]

+

+# hot-air-station-dat

+

+## common defective error

+

+- temperature sensor read wrong

+

+

+

+## hot air handle

+

+- [[high-voltage-warn-dat]]

+

+yellow wires 220VAC

+

+3V and 5V DC also on board for [[fan-dat]], etc

+

+

+

+wires

+

+✅ In a hot-air handle with only heater + temperature sensor, no fan and no reed switch

+

+The internal parts are:

+

+Heating element (ceramic heater) → always 2 wires

+

+Temperature sensor → usually 2 wires

+

+Protective ground wire → 1 wire

+

+This adds up to 5 wires, matching your description.

+

+## ref

+

+- [[hot-air-station]]

+

+- [[soldering-tools-dat]] - [[fab-workspace-dat]]

+

+# preheat-bed-dat

+

+- desoldering temperature 270 degree C

+

+## ref

+

+- [[desoldering-dat]]

+

+# soldering-iron-dat

+

+

+## Soldering Iron

+

+soldering iron

+

+- [[PTOS009-dat]]

+

+usb soldering iron - [[PSO1055-dat]]

+

+

+

+

+

+## soldering iron tips

+

+- [[PSO1025-dat]] - [[PSO1024-dat]] - [[PSO1023-dat]]

+

+all soldering tips family 1

+

+

+

+Common soldering tips system: (C1151), ESD(C1152), 900, 900M, 907, 933, 936, 937, 942

+

+

+

+Yes, the tip of a soldering iron usually has a surface coating, not just bare copper or iron. This coating serves several purposes: preventing corrosion, improving heat transfer, and extending lifespan. Common types of coatings include:

+

+1. **Iron Plating**

+ - Most soldering iron tips have a copper core, but copper oxidizes easily and wears quickly.

+ - The surface is plated with iron to prevent oxidation and improve durability.

+ - Advantages: High temperature resistance and long lifespan.

+

+2. **Nickel or Chrome Plating**

+ - Some tips add a layer of nickel or chrome on top of the iron plating.

+ - Purpose: Further corrosion resistance and increased surface hardness.

+

+3. **Solder Coating (Tin layer, formed during use)**

+ - When first used, a thin layer of solder forms on the tip from molten solder or flux.

+ - This tin layer protects the tip from oxidation and improves soldering performance.

+ - Tip: Always apply a thin layer of solder after use to extend the tip’s life.

+

+4. **Ceramic or Special Coatings (on some high-end tips)**

+ - Some high-temperature or specialty soldering tips have ceramic coatings.

+ - Purpose: Corrosion resistance, high temperature tolerance, and reduced solder sticking.

+

+**Summary**: The core is usually copper, with an iron plating, sometimes additional nickel/chrome, and a protective tin layer forms during use.

+

+

+

+

+## ref

+

+- [[soldering-tools-dat]]

+

+# soldering-tools-spot-welding-dat

+

+

+

+- [[battery-dat]] - [[fab-tools-dat]] - [[battery-tools-dat]] - [[battery-tester-dat]]

+

+

+- [[fab-soldering-materials-dat]]

+

+

+

+

+## cap super spot soldering

+

+Capacitor Discharge Spot Welder (简称 CD Spot Welder)

+

+电容不是电池，电容可零伏电压存放，长期使用免维护，没有记忆效应，也不存在过度放电的问题，比如吃灰2两年拿出来都可正常使用！

+大电流放电能力超强

+可长期使用实用工具，绝不是短期玩具！

+

+- [[capacitor-super-dat]] - [[capacitor-dat]]

+

+

+

+

+specifically for [[battery-dat]]

+

+

+

+- 激光转镍 ??

+

+

+

+

+## ref

+

+- [[battery-dat]]

+

+- [[soldering-tools-spot-welding]] - [[soldering-tools]]

+

+

+# soldering-wick-dat

+

+- [[fab-soldering-tools-dat]] - [[soldering-wick-dat]]

+

+- [[pros-kit-dat]]

+

+- [[PSO1038-dat]]

+

+

+宝工吸锡线清洁焊接点锡渣去除焊盘脱焊主板除锡带吸附9DP-031B

+

+9DP-031B

+

+

+

+台湾宝工 9DP-031A 吸锡网线 吸锡带 吸锡线 1.5mmx1.5米Pro'skit

+

+9DP-031A

+

+

+

+台湾宝工包邮 防烫吸锡网线吸锡带除锡网线进口DP-033A/B/C/D/E

+

+- DP-033A 1.5mmx2m

+- DP-033B 2mmx2m

+- DP-033C 2.5mmx2m

+- DP-033D 3mmx1.5m

+- DP-033E 3.5mmx1.5m

+

+

+

+

+

+

+## ref

+

+## soldering

+- [[fab-PCB-dat]] - [[fab-PCB-soldering-dat]] - [[fab-soldering-tools-dat]] - [[fab-PCB-desoldering-dat]] - [[fab-soldering-materials-dat]]

+## instruments

+- [[multimeter-dat]] - [[UNI-Trend-dat]] == [[UT118B-dat]] - [[PTOS035-dat]]

+- [[power-dat]] - [[CONN-DC-barrel-jack-dat]]