Board-dat/SDR/SDR1120-dat/SDR1120-dat.md
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@@ -10,7 +10,9 @@ product url -
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wireless motor drive board
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-- [[L9110-dat]] - [[attiny13-dat]] - [[EDRF1-dat]] == [[NWL1089-dat]]
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+- [[L9110-dat]] - [[attiny13-dat]]
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+
15
+- [[EDRF1-dat]] == [[NWL1089-dat]] - [[RF-LINK-dat]]
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15 17
- [[motor-driver-dat]] - [[motor-dat]]
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Chip-dat/gensys-logic-dat/GL3520-dat/2026-05-15-14-33-19.png
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Chip-dat/gensys-logic-dat/GL3520-dat/GL3520-dat.md
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+
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+# GL3520-dat.md
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+
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+- [[GL850-dat]] - [[gensys-logic-dat]] - [[GL3520-dat]] - [[GL823-dat]] - [[USB-hub-dat]] - [[USB-3.0-dat]]
5
+
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+
7
+![](2026-05-15-14-33-19.png)
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+
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+- [[Flash-dat]] - [[Flash-Nor-dat]] - FM25F01
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+
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+![](2026-05-15-14-34-02.png)
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+
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+![](2026-05-15-14-35-19.png)
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+
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+
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+
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+## ref
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+
Chip-dat/gensys-logic-dat/GL823-DS.pdf
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Chip-dat/gensys-logic-dat/GL823-dat.md
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1
-
2
-# GL823-dat.md
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-
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-- datasheet == [[GL823-DS.pdf]]
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-
6
-
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-## GL823-dat
8
-
9
-USB 2.0 SD/MMC Card Reader Controller
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-
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-- [[GL823-dat]] datasheet [[GL823-DS.pdf]]
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-
13
--  USB specification compliance
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- - Comply with **480Mbps Universal Serial Bus specification rev. 2.0**
15
- - Comply with USB Storage Class specification rev. 1.0
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- - Support one device address and up to four endpoints: Control (0)/ Bulk Read (1)/ Bulk Write (2)/Interrupt
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- (3)
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--  Integrated USB building blocks
19
- - USB2.0 transceiver macro (UTM), Serial Interface Engine (SIE), Build-in power-on reset (POR) and
20
- low-voltage detector (LVD)
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-  Embedded 8051 micro-controller
22
- - Operate @ 60 MHz clock, 12 clocks per instruction cycle
23
- - Embedded mask ROM and internal SRAM
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--  Secure DigitalTM (SD) and MultiMediaCardTM (MMC)*Note1
25
- - Support SD specification v1.0 / v1.1 / v2.0/ SDHC (Up to 32GB)
26
- - Compatible with SDXC (Up to 2TB)
27
- - Support MMC specification v3.x / v4.0 / v4.1 / v4.2.
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- - x1 / x4 bit data bus
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--  On chip clock source and no need of 12MHz Crystal Clock input.
30
--  On-Chip 5V to 3.3V and 3.3V to 1.8V regulators
31
--  Support 5V to 3.3V Band Gap Regulator for stable voltage supply
32
--  Provide Over-Current protection mechanism for safety power supply
33
--  On-Chip power MOSFETs for supplying flash media card power
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--  Support Power Saving mode/ Selective suspend mode for better power management. Only available in QFN-24(A) package.
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--  Support external serial EEPROM interface for the flexibility to load the vendor information and system options
36
--  Operating system supported: Windows 7/Vista32&64/XP/2000/Me/98/98SE, Mac OS 9.X/10.X, Linux Kernel 2.4.X/2.6.X
37
- - Pass Windows Vista/ Windows 7 (Submission ID: 1355289)
38
--  USB-IF Logo (Submission TID: 40000940)
39
--  Package available in 24 pin SSOP (209 mil) and 24 pin QFN (4x4 mm)
40
-
41
-
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-## ref
43
-
44
-- [[GL823]]
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\ No newline at end of file
Chip-dat/gensys-logic-dat/GL823-dat/GL823-DS.pdf
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Chip-dat/gensys-logic-dat/GL823-dat/GL823-dat.md
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+
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+# GL823-dat.md
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+
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+- datasheet == [[GL823-DS.pdf]]
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+
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+
7
+## GL823-dat
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+
9
+USB 2.0 SD/MMC Card Reader Controller
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+
11
+- [[GL823-dat]] datasheet [[GL823-DS.pdf]]
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+
13
+-  USB specification compliance
14
+ - Comply with **480Mbps Universal Serial Bus specification rev. 2.0**
15
+ - Comply with USB Storage Class specification rev. 1.0
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+ - Support one device address and up to four endpoints: Control (0)/ Bulk Read (1)/ Bulk Write (2)/Interrupt
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+ (3)
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+-  Integrated USB building blocks
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+ - USB2.0 transceiver macro (UTM), Serial Interface Engine (SIE), Build-in power-on reset (POR) and
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+ low-voltage detector (LVD)
21
+  Embedded 8051 micro-controller
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+ - Operate @ 60 MHz clock, 12 clocks per instruction cycle
23
+ - Embedded mask ROM and internal SRAM
24
+-  Secure DigitalTM (SD) and MultiMediaCardTM (MMC)*Note1
25
+ - Support SD specification v1.0 / v1.1 / v2.0/ SDHC (Up to 32GB)
26
+ - Compatible with SDXC (Up to 2TB)
27
+ - Support MMC specification v3.x / v4.0 / v4.1 / v4.2.
28
+ - x1 / x4 bit data bus
29
+-  On chip clock source and no need of 12MHz Crystal Clock input.
30
+-  On-Chip 5V to 3.3V and 3.3V to 1.8V regulators
31
+-  Support 5V to 3.3V Band Gap Regulator for stable voltage supply
32
+-  Provide Over-Current protection mechanism for safety power supply
33
+-  On-Chip power MOSFETs for supplying flash media card power
34
+-  Support Power Saving mode/ Selective suspend mode for better power management. Only available in QFN-24(A) package.
35
+-  Support external serial EEPROM interface for the flexibility to load the vendor information and system options
36
+-  Operating system supported: Windows 7/Vista32&64/XP/2000/Me/98/98SE, Mac OS 9.X/10.X, Linux Kernel 2.4.X/2.6.X
37
+ - Pass Windows Vista/ Windows 7 (Submission ID: 1355289)
38
+-  USB-IF Logo (Submission TID: 40000940)
39
+-  Package available in 24 pin SSOP (209 mil) and 24 pin QFN (4x4 mm)
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+
41
+
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+## ref
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+
44
+- [[GL823]]
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Chip-dat/gensys-logic-dat/gensys-logic-dat.md
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@@ -3,6 +3,11 @@
3 3
4 4
- [[GL823-dat]] - [[GL850-dat]]
5 5
6
+- [[GL850-dat]] - [[gensys-logic-dat]] - [[GL3520-dat]] - [[GL823-dat]]
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+
8
+
9
+
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+
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## ref
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8 13
- [[chip]]
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\ No newline at end of file
Network-dat/Infrared-dat/infrared-app-dat/2026-05-15-14-24-01.png
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Network-dat/Infrared-dat/infrared-app-dat/2026-05-15-14-25-03.png
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Network-dat/Infrared-dat/infrared-app-dat/2026-05-15-14-29-06.png
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Network-dat/Infrared-dat/infrared-app-dat/infrared-app-dat.md
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+
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+
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+# infrared-app-dat
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+
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+- [[infrared-app-dat]] - [[LM386-dat]] - [[infrared-dat]] - [[audio-dat]] - [[app-dat]]
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+
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+## sound transfer carried on infrared
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+
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+
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+![](2026-05-15-14-24-01.png)
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+
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+
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+1). `The transmitting end`: the headset port, the audio signal input through the transistor Q1 S8050, an infrared transmitter to drive the tube, and the audio signal is transmitted in the form of infrared.
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+
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+![](2026-05-15-14-24-35.png)
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+
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+2). `The receiving end`: the infrared receiving tube for receiving the infrared signal transmitter, converted into an audio signal through the LM386 audio amplifier chip, and the audio output signal can be amplified
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+
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+![](2026-05-15-14-25-03.png)
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+
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+
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+Components List
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+
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+Transmitter: Component. Label Footprint Value Number
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+- Ceramic capacitors C1 RAD-0.1 103 2
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+- Electrolyticcapacitor(25V/100UF) C2 RB.1/.3 100UF 1
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+- Electrolytic capacitor(25V/4.7UF) C3 RB.1/.2 4.7UF 1
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+- 5MM red LED D1 LED_5mm 2
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+- 5MM Infrared emission control D2 LED_6mm 1
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+- Pin J14 HDR1X2 0.5(半排)
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+- Headphone seat J2 3F07 1
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+- S8050 Q1 TO-92B 1
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+- Resistance R1 AXIAL-0.3 100 2
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+- Resistance R2 AXIAL-0.3 51K 2
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+
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+![](2026-05-15-14-29-06.png)
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+
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+
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+
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+## ref
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+
Tech-dat/Interface-dat/USB-SDK-dat/USB-3.0-dat/USB-3.0-dat.md
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1 1
2 2
# USB-3.0-dat
3 3
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+
5
+- [[GL850-dat]] - [[gensys-logic-dat]] - [[GL3520-dat]] - [[GL823-dat]] - [[USB-hub-dat]] - [[USB-3.0-dat]]
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+
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+
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+
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- [[superspeed-dat]]
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## Key Functions and Features
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13 18
* **Increased Power Output:** Standard USB 3.0 ports can deliver more power to connected devices (up to 900mA compared to 500mA for USB 2.0), enabling faster charging for compatible devices and better support for power-hungry peripherals without needing an external power adapter.
14 19
* **Backward Compatibility:** USB 3.0 ports are designed to be backward compatible with USB 2.0 and USB 1.1 devices. When a slower device is connected to a USB 3.0 port, it will operate at the slower speed. Similarly, a USB 3.0 device connected to a USB 2.0 port will operate at USB 2.0 speeds.
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* **New Physical Connections:** While maintaining compatibility with USB Type-A connectors (often colored blue to distinguish them), USB 3.0 introduced new connector types like USB 3.0 Micro-B for certain devices.
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+
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+
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+
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+## ref
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+
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+
Tech-dat/Interface-dat/USB-SDK-dat/USB-Hub-dat/USB-Hub-dat.md
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@@ -17,7 +17,7 @@
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## GL850
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20
-- [[GL850-dat]]
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+- [[GL850-dat]] - [[gensys-logic-dat]] - [[GL3520-dat]] - [[GL823-dat]]
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22 22
23 23
## CH334
Tech-dat/audio-dat/audio-dat.md
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@@ -21,7 +21,7 @@
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- [[codec-audio-dat]] - [[codec-dat]] - [[audio-dat]]
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24
-
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+- [[infrared-app-dat]] - [[LM386-dat]] - [[infrared-dat]] - [[audio-dat]] - [[app-dat]]
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26 26
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## chip
Tech-dat/interactive-dat/button-dat/2026-05-15-14-16-28.png
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Tech-dat/interactive-dat/button-dat/button-dat.md
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12 12
![](2026-01-25-15-05-12.png)
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+## button types
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+- 带锁(锁)功能:按下去锁住,再按下松掉。
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+- 无锁(不带锁)功能:按下去自动回弹。
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+
20
+combinations
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+
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+- KD2-21 有灯有锁
23
+- KD2-22 有灯无锁
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+- KD2-23 无灯有锁
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+- KD2-24 无灯无锁
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+
27
+常开常闭,
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+
29
+- 带灯是8只脚
30
+- 无灯是6只脚。
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+
32
+![](2026-05-15-14-16-28.png)
16 33
17 34
18 35
## Buttons Circuits
app-dat/app-dat.md
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@@ -80,6 +80,10 @@
80 80
tech based - [[sensor-Camera-dat]] - [[audio-dat]]
81 81
82 82
83
+## audio
84
+
85
+- [[infrared-app-dat]] - [[LM386-dat]] - [[infrared-dat]] - [[audio-dat]] - [[app-dat]]
86
+
83 87
## industrial
84 88
85 89
- [[Thermal-imaging-camera-dat]]
app-dat/gun-dat/coilgun-dat/2026-05-15-14-10-08.png
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app-dat/gun-dat/coilgun-dat/2026-05-15-14-10-22.png
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app-dat/gun-dat/coilgun-dat/coilgun-dat.md
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@@ -160,6 +160,19 @@ multiple coils
160 160
- 14500V电压表*1 (最少一个,可以每级都配一个)1
161 161
- 15除此之外还可以配备激光头和炮弹若干
162 162
163
+
164
+## toy-level coilgun
165
+
166
+button == 讯灵 KD2 - [[button-dat]]
167
+
168
+- [[dcdc-boost-dat]]
169
+
170
+![](2026-05-15-14-10-08.png)
171
+
172
+![](2026-05-15-14-10-22.png)
173
+
174
+
175
+
163 176
## ref
164 177
165 178
- [[app]] - [[gun]] - [[coilgun]]
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