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Chip-cn-dat/Espressif-dat/ESP32-dat/ESP32-compare-dat.md
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1 | + |
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2 | +# ESP32-compare-dat.md |
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3 | + |
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4 | +- [[ESP32-C3-dat]] - [[ESP32-S3-dat]] - [[ESP32-P4-dat]] |
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5 | + |
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6 | +| Feature | **ESP32-C3** | **ESP32-S3** | |
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7 | +| ------------------------- | ---------------------------- | --------------------------------------- | |
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8 | +| **Processor** | Single-core RISC-V (160 MHz) | Dual-core Xtensa LX7 (240 MHz) | |
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9 | +| **Architecture** | RISC-V | Xtensa | |
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10 | +| **Performance** | Moderate for basic IoT tasks | High-performance for AI/ML tasks | |
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11 | +| **Wi-Fi** | 2.4 GHz (802.11b/g/n) | 2.4 GHz (802.11b/g/n) | |
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12 | +| **Bluetooth** | Bluetooth 5.0 (LE + Mesh) | Bluetooth 5.0 (LE + Mesh) | |
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13 | +| **SRAM** | 400 KB | 512 KB | |
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14 | +| **Flash** | Up to 4 MB embedded | External Flash support up to 16 MB | |
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15 | +| **PSRAM Support** | No | Yes | |
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16 | +| **GPIO Pins** | 22 | 45 | |
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17 | +| **USB Support** | No native USB support | Native USB OTG | |
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18 | +| **Camera Interface** | No | Yes | |
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19 | +| **AI/ML Acceleration** | Limited | Yes (vector instructions support) | |
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20 | +| **LCD Interface** | No | Yes (parallel RGB or SPI) | |
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21 | +| **I2S (Audio Support)** | Yes | Yes | |
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22 | +| **Security** | RSA, AES, SHA, HMAC | RSA, AES, SHA, HMAC, Digital Signature | |
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23 | +| **Temperature Range** | -40°C to 85°C | -40°C to 125°C | |
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24 | +| **Power Efficiency** | Better for low-power needs | Higher power consumption when active | |
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25 | +| **Deep Sleep Power** | ~5 µA | ~10 µA | |
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26 | +| **Wake-Up Sources** | Timer, GPIO, ULP | Timer, GPIO, ULP, USB | |
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27 | +| **Peripheral Interfaces** | SPI, I2C, I2S, UART, ADC | SPI, I2C, I2S, UART, ADC, CAN, Parallel | |
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28 | +| **Clock Frequency** | 160 MHz | 240 MHz | |
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29 | +| **Package Options** | QFN28, QFN32 | QFN48, QFN68 | |
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30 | +| **Applications** | Basic IoT, BLE tasks | AI/ML, image processing, advanced IoT | |
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31 | +| **Price** | Lower | Higher due to advanced features | |
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32 | + |
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33 | +## VS [[ESP32-Wrover-dat]] |
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34 | + |
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35 | +| Feature | **ESP32-C3** | **ESP32-S3** | **ESP32-WROVER** | |
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36 | +| ------------------------- | ---------------------------- | --------------------------------------- | ------------------------------------ | |
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37 | +| **Processor** | Single-core RISC-V (160 MHz) | Dual-core Xtensa LX7 (240 MHz) | Dual-core Xtensa LX6 (240 MHz) | |
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38 | +| **Architecture** | RISC-V | Xtensa | Xtensa | |
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39 | +| **Performance** | Moderate for basic IoT tasks | High-performance for AI/ML tasks | High-performance for general IoT | |
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40 | +| **Wi-Fi** | 2.4 GHz (802.11b/g/n) | 2.4 GHz (802.11b/g/n) | 2.4 GHz (802.11b/g/n) | |
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41 | +| **Bluetooth** | Bluetooth 5.0 (LE + Mesh) | Bluetooth 5.0 (LE + Mesh) | Bluetooth 4.2 (LE + Mesh) | |
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42 | +| **SRAM** | 400 KB | 512 KB | 520 KB | |
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43 | +| **Flash** | Up to 4 MB embedded | External Flash support up to 16 MB | Up to 16 MB | |
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44 | +| **PSRAM Support** | No | Yes | Yes (4 MB external PSRAM) | |
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45 | +| **GPIO Pins** | 22 | 45 | 34 | |
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46 | +| **USB Support** | No native USB support | Native USB OTG | No | |
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47 | +| **Camera Interface** | No | Yes | Yes (with external modules) | |
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48 | +| **AI/ML Acceleration** | Limited | Yes (vector instructions support) | No | |
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49 | +| **LCD Interface** | No | Yes (parallel RGB or SPI) | Yes (SPI-based LCD support) | |
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50 | +| **I2S (Audio Support)** | Yes | Yes | Yes | |
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51 | +| **Security** | RSA, AES, SHA, HMAC | RSA, AES, SHA, HMAC, Digital Signature | RSA, AES, SHA, HMAC | |
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52 | +| **Temperature Range** | -40°C to 85°C | -40°C to 125°C | -40°C to 85°C | |
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53 | +| **Power Efficiency** | Better for low-power needs | Higher power consumption when active | Moderate | |
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54 | +| **Deep Sleep Power** | ~5 µA | ~10 µA | ~6 µA | |
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55 | +| **Wake-Up Sources** | Timer, GPIO, ULP | Timer, GPIO, ULP, USB | Timer, GPIO, ULP | |
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56 | +| **Peripheral Interfaces** | SPI, I2C, I2S, UART, ADC | SPI, I2C, I2S, UART, ADC, CAN, Parallel | SPI, I2C, I2S, UART, ADC | |
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57 | +| **Clock Frequency** | 160 MHz | 240 MHz | 240 MHz | |
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58 | +| **Package Options** | QFN28, QFN32 | QFN48, QFN68 | Module with built-in PSRAM | |
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59 | +| **Applications** | Basic IoT, BLE tasks | AI/ML, image processing, advanced IoT | General IoT, multimedia applications | |
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60 | +| **Price** | Lower | Higher due to advanced features | Moderate | |
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61 | + |
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62 | + |
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63 | +## VS [[ESP32-P4-dat]] |
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64 | + |
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65 | +| Feature | **ESP32-C3** | **ESP32-S3** | **ESP32-WROVER** | **ESP32-P4** | |
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66 | +| ------------------------- | ---------------------------- | --------------------------------------- | ------------------------------------ | ---------------------------------------------- | |
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67 | +| **Processor** | Single-core RISC-V (160 MHz) | Dual-core Xtensa LX7 (240 MHz) | Dual-core Xtensa LX6 (240 MHz) | Dual-core RISC-V (up to 400 MHz) | |
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68 | +| **Architecture** | RISC-V | Xtensa | Xtensa | RISC-V | |
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69 | +| **Performance** | Moderate for basic IoT tasks | High-performance for AI/ML tasks | High-performance for general IoT | High-performance for HMI and AIoT applications | |
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70 | +| **Wi-Fi** | 2.4 GHz (802.11b/g/n) | 2.4 GHz (802.11b/g/n) | 2.4 GHz (802.11b/g/n) | Not integrated | |
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71 | +| **Bluetooth** | Bluetooth 5.0 (LE + Mesh) | Bluetooth 5.0 (LE + Mesh) | Bluetooth 4.2 (LE + Mesh) | Not integrated | |
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72 | +| **SRAM** | 400 KB | 512 KB | 520 KB | 768 KB HP L2MEM, 32 KB LP SRAM | |
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73 | +| **Flash** | Up to 4 MB embedded | External Flash support up to 16 MB | Up to 16 MB | External Flash support | |
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74 | +| **PSRAM Support** | No | Yes | Yes (4 MB external PSRAM) | Yes (up to 32 MB) | |
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75 | +| **GPIO Pins** | 22 | 45 | 34 | 55 | |
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76 | +| **USB Support** | No native USB support | Native USB OTG | No | USB 2.0 | |
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77 | +| **Camera Interface** | No | Yes | Yes (with external modules) | MIPI-CSI | |
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78 | +| **AI/ML Acceleration** | Limited | Yes (vector instructions support) | No | AI instruction extensions | |
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79 | +| **LCD Interface** | No | Yes (parallel RGB or SPI) | Yes (SPI-based LCD support) | MIPI-DSI | |
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80 | +| **I2S (Audio Support)** | Yes | Yes | Yes | Yes | |
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81 | +| **Security** | RSA, AES, SHA, HMAC | RSA, AES, SHA, HMAC, Digital Signature | RSA, AES, SHA, HMAC | Advanced security features | |
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82 | +| **Temperature Range** | -40°C to 85°C | -40°C to 125°C | -40°C to 85°C | -40°C to 85°C | |
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83 | +| **Power Efficiency** | Better for low-power needs | Higher power consumption when active | Moderate | Ultra-low-power modes available | |
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84 | +| **Deep Sleep Power** | ~5 µA | ~10 µA | ~6 µA | Data not specified | |
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85 | +| **Wake-Up Sources** | Timer, GPIO, ULP | Timer, GPIO, ULP, USB | Timer, GPIO, ULP | Timer, GPIO, LP-Core | |
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86 | +| **Peripheral Interfaces** | SPI, I2C, I2S, UART, ADC | SPI, I2C, I2S, UART, ADC, CAN, Parallel | SPI, I2C, I2S, UART, ADC | SPI, I2C, I2S, UART, ADC, MIPI | |
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87 | +| **Clock Frequency** | 160 MHz | 240 MHz | 240 MHz | 400 MHz | |
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88 | +| **Package Options** | QFN28, QFN32 | QFN48, QFN68 | Module with built-in PSRAM | Data not specified | |
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89 | +| **Applications** | Basic IoT, BLE tasks | AI/ML, image processing, advanced IoT | General IoT, multimedia applications | HMI, AIoT, edge computing | |
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90 | +| **Price** | Lower | Higher due to advanced features | Moderate | Data not specified | |
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91 | + |
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92 | + |
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93 | +### New Features of ESP32-P4: |
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94 | + |
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95 | +- High-Performance Dual-Core RISC-V CPU: Operates up to 400 MHz, suitable for compute-intensive tasks. |
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96 | +- AI Instruction Extensions: Enhances AI and machine learning capabilities. |
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97 | +- Advanced Memory Subsystem: Includes 768 KB of HP L2MEM and 32 KB of LP SRAM, supporting large internal memory. |
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98 | +- Integrated High-Speed Peripherals: Supports USB 2.0, MIPI-CSI for camera input, and MIPI-DSI for display output, facilitating rich Human-Machine Interfaces. |
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99 | +- Low-Power Core (LP-Core): Operates up to 40 MHz, enabling ultra-low-power applications by allowing high-performance cores to remain dormant when not needed. |
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100 | +- Enhanced Security Features: Provides robust security mechanisms suitable for applications requiring strong protection. |
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101 | +- Extensive IO Connectivity: Offers 55 GPIOs, accommodating increased IO-connectivity demands. |
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Tech-dat/Interface-dat/interface-dat.md
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1 | 1 | |
2 | 2 | # interface dat |
3 | - |
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4 | -- [[USB-TTL-dat]] |
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5 | 3 | |
6 | 4 | - [[RS485-DAT]] - [[RS232-dat]] - [[RS422-dat]] |
7 | 5 | |
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9 | 7 | |
10 | 8 | - [[POE-dat]] |
11 | 9 | |
10 | +- [[I2C-dat]] - [[I2S-dat]] - [[SPI-dat]] - [[USB-TTL-dat]] - [[serial-dat]] - [[1-wire-dat]] |
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11 | + |
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12 | + |
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12 | 13 | |
13 | 14 | ## Breakout boards |
14 | 15 |