73dff77f5f83745e26394b1cce43a7de24cb1bbf
Tech-dat/acturator-dat/acturator-dat.md
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| 29 | 29 | |
| 30 | 30 | - [[Humidifier-dat]] |
| 31 | 31 | |
| 32 | + |
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| 33 | + |
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| 34 | +## motor relevant |
|
| 35 | + |
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| 36 | +- [[motor-driver-dat]] - [[motor-misc-dat]] - [[motor-dat]] |
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| 37 | + |
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| 38 | + |
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| 39 | + |
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| 40 | + |
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| 41 | + |
|
| 32 | 42 | ## Boards |
| 33 | 43 | |
| 34 | 44 | - [[SCU1080-dat]] - [[SCU1030-dat]] |
Tech-dat/acturator-dat/motor-dat/motor-misc-dat/2025-12-30-14-36-25.png
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Tech-dat/acturator-dat/motor-dat/motor-misc-dat/motor-misc-dat.md
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| 1 | + |
|
| 2 | +# motor-misc-dat |
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| 3 | + |
|
| 4 | +## Electrical Slip Ring |
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| 5 | + |
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| 6 | + |
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| 7 | + |
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| 8 | + |
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| 9 | + |
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| 10 | +## ref |
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| 11 | + |
|
| 12 | +- [[motor-dat]] |
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materials-dat/metal-dat/metal-dat.md
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| 1 | - |
|
| 2 | 1 | # metal-dat |
| 3 | 2 | |
| 3 | +- [[brass-copper-dat]] |
|
| 4 | 4 | |
| 5 | +- [[Shaft-dat]] |
|
| 5 | 6 | |
| 6 | -- [[brass-copper-dat]] |
|
| 7 | - |
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| 8 | - |
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| 9 | - |
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| 10 | - |
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| 11 | - |
|
| 12 | -## metal soldering |
|
| 13 | - |
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| 14 | -普通电烙铁的世界里: |
|
| 15 | -铜是王,镀层是桥,铝是禁区。 |
|
| 16 | - |
|
| 17 | -五、实操建议(很有用) |
|
| 18 | -🔹 如果你想“让任何金属都好焊” |
|
| 19 | - |
|
| 20 | -👉 先镀锡 / 镀铜 |
|
| 21 | - |
|
| 22 | -方法: |
|
| 23 | - |
|
| 24 | -化学镀 |
|
| 25 | - |
|
| 26 | -电镀 |
|
| 27 | - |
|
| 28 | -喷涂焊锡层 |
|
| 29 | - |
|
| 30 | - |
|
| 31 | -二、为什么“铜系最好焊”? |
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| 32 | -1️⃣ 氧化膜容易被助焊剂破坏 |
|
| 33 | -2️⃣ 锡对铜润湿性极好 |
|
| 34 | -3️⃣ 形成 Cu–Sn 金属间化合物 |
|
| 35 | - |
|
| 36 | -→ 是真正“结合” |
|
| 37 | - |
|
| 38 | - |
|
| 39 | -一、结论速览:哪些金属“能用电烙铁焊”? |
|
| 40 | - |
|
| 41 | -前提:普通电烙铁(≈300–400°C)+ 锡基焊料 |
|
| 42 | - |
|
| 43 | -✅ 非常容易焊(标准焊接) |
|
| 44 | -金属 可行性 说明 |
|
| 45 | -铜(Cu) ⭐⭐⭐⭐⭐ 最理想 |
|
| 46 | -黄铜 ⭐⭐⭐⭐⭐ 含铜高 |
|
| 47 | -紫铜 ⭐⭐⭐⭐⭐ 同上 |
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| 48 | -镀锡铜 ⭐⭐⭐⭐⭐ 一碰就上锡 |
|
| 49 | - |
|
| 7 | +## metal connection |
|
| 50 | 8 | |
| 51 | -## metal dust |
|
| 52 | 9 | |
| 53 | -一、从「源头」减少粉尘(最有效) |
|
| 54 | -✅ 1️⃣ 选对切割方式(优先级很高) |
|
| 55 | -| 切割方式 | 粉尘量 | 说明 | |
|
| 56 | -| ------------- | --------- | --------------- | |
|
| 57 | -| 冷切锯 / 带锯 | ⭐ 最少 | 切屑是颗粒/条状 | |
|
| 58 | -| 手锯(钢锯) | ⭐⭐ 少 | 粉尘不飞 | |
|
| 59 | -| 角磨机切割片 | ❌ 多 | 高速产生细粉 | |
|
| 60 | -| 砂轮切割 | ❌❌ 非常多 | 粉尘 + 火花 | |
|
| 10 | +### Metal Soldering |
|
| 61 | 11 | |
| 12 | +Context: standard soldering iron (~300–400°C) + tin-based solder. |
|
| 62 | 13 | |
| 63 | -## easy for cutting |
|
| 14 | +Summary: Copper-based metals are the easiest to solder with a regular iron. Aluminum is difficult without special methods. If you need to make a hard-to-solder metal solderable, plating (tin or copper) is an effective approach. |
|
| 64 | 15 | |
| 65 | -| Material | Relative Cutting Ease | Tool Wear | Dust / Chips Produced | Heat Generation | Notes | |
|
| 66 | -| --------------- | --------------------- | ---------- | --------------------- | --------------- | -------------------------------------------------- | |
|
| 67 | -| Aluminum Alloy | ⭐⭐⭐⭐⭐ (Very Easy) | Low | Chips (few fine dust) | Low–Medium | Soft, cuts easily; may clog blades if RPM too high | |
|
| 68 | -| Brass (黄铜) | ⭐⭐⭐⭐☆ (Easy) | Low–Medium | Clean chips | Medium | Free-cutting, stable; less grabbing than aluminum | |
|
| 69 | -| Copper (紫铜) | ⭐⭐⭐☆☆ (Medium) | Medium | Long, sticky chips | Medium–High | Very ductile; tends to smear and stick to tools | |
|
| 70 | -| Stainless Steel | ⭐⭐☆☆☆ (Hard) | High | Fine chips + dust | High | Tough, work-hardens; needs low speed and coolant | |
|
| 16 | +Quick reference — which metals can be soldered with a regular iron: |
|
| 17 | +- Very easy (standard soldering): Copper and high-copper alloys (brass, red copper, tin-plated copper). |
|
| 71 | 18 | |
| 19 | +Why copper alloys are best for soldering: |
|
| 20 | +1. Oxide film is easy to break down with flux. |
|
| 21 | +2. Tin wets copper extremely well. |
|
| 22 | +3. Copper and tin form Cu–Sn intermetallics → a true metallurgical bond. |
|
| 72 | 23 | |
| 24 | +Practical suggestion: To make almost any metal solderable |
|
| 25 | +- First plate with tin or copper (methods): |
|
| 26 | + - Chemical plating |
|
| 27 | + - Electroplating |
|
| 28 | + - Solder spray / tin coating |
|
| 73 | 29 | |
| 30 | +Useful tips |
|
| 31 | +- Use appropriate flux for the base metal. |
|
| 32 | +- Ensure mechanical cleaning (brushing/sanding) before soldering when possible. |
|
| 33 | +- For aluminum, use special fluxes and/or aluminum-specific solders or plate the joint first. |
|
| 74 | 34 | |
| 35 | +--- |
|
| 75 | 36 | |
| 76 | -## metal glue |
|
| 37 | +## Metal Dust — Control at the Source |
|
| 77 | 38 | |
| 78 | -- [[glue-dat]] |
|
| 39 | +Best strategy: reduce dust generation at the cutting stage. |
|
| 79 | 40 | |
| 80 | -四、粘得牢的关键步骤(比胶水本身还重要) |
|
| 81 | -1️⃣ 打磨(必须) |
|
| 41 | +Recommended cutting methods (from least to most dust): |
|
| 42 | +| Cutting method | Dust amount | Notes | |
|
| 43 | +| --------------------- | ----------- | ----- | |
|
| 44 | +| Cold saw / band saw | ⭐ lowest | Produces chips/strips rather than fine dust | |
|
| 45 | +| Hand saw (hacksaw) | ⭐⭐ low | Low airborne dust; slower | |
|
| 46 | +| Angle grinder cutting | ❌ high | High speed creates fine powder | |
|
| 47 | +| Cutting wheel / abrasive | ❌❌ very high | Produces fine dust and sparks; worst for airborne particles | |
|
| 82 | 48 | |
| 83 | -铝合金:用 400~600 号砂纸 |
|
| 49 | +Practical controls |
|
| 50 | +- Prefer sawing with coolant or low-speed blade when possible. |
|
| 51 | +- Use local exhaust ventilation and masks for abrasive cutting. |
|
| 52 | +- Wet cutting or vacuum extraction reduces airborne dust. |
|
| 84 | 53 | |
| 85 | -不锈钢:同样打磨 |
|
| 54 | +--- |
|
| 86 | 55 | |
| 87 | -目的:破坏氧化层 + 增加粗糙度 |
|
| 56 | +## Cutting: Ease, Tool Wear, and Chips |
|
| 88 | 57 | |
| 89 | -2️⃣ 脱脂(必须) |
|
| 58 | +| Material | Relative Cutting Ease | Tool Wear | Dust / Chips Produced | Heat Generation | Notes | |
|
| 59 | +| ---------------- | --------------------- | --------- | ------------------------ | --------------- | ----- | |
|
| 60 | +| Aluminum alloy | ⭐⭐⭐⭐⭐ (Very easy) | Low | Chips (few fine dust) | Low–Medium | Soft; can clog blades at high RPM | |
|
| 61 | +| Brass (黄铜) | ⭐⭐⭐⭐☆ (Easy) | Low–Medium| Clean chips | Medium | Free-cutting; stable | |
|
| 62 | +| Copper (紫铜) | ⭐⭐⭐☆☆ (Medium) | Medium | Long, sticky chips | Medium–High | Ductile; tends to smear | |
|
| 63 | +| Stainless steel | ⭐⭐☆☆☆ (Hard) | High | Fine chips + dust | High | Work-hardens; use low speed and coolant | |
|
| 90 | 64 | |
| 91 | -酒精 / 丙酮 |
|
| 65 | +Notes |
|
| 66 | +- Match blade type and speed to material. |
|
| 67 | +- Use coolant for steels and stainless to reduce heat and tool wear. |
|
| 68 | +- Control chip evacuation to prevent blade clogging. |
|
| 92 | 69 | |
| 93 | -彻底擦干 |
|
| 70 | +--- |
|
| 94 | 71 | |
| 95 | -3️⃣ 控制胶层厚度 |
|
| 72 | +## Metal Adhesives (Glue) |
|
| 96 | 73 | |
| 97 | -最佳厚度:0.1 ~ 0.3 mm |
|
| 74 | +Key steps to get a strong bond—more important than the adhesive brand: |
|
| 98 | 75 | |
| 99 | -太薄强度下降 |
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| 76 | +1. Surface preparation — sanding (required) |
|
| 77 | + - Aluminum alloys: use 400–600 grit sandpaper. |
|
| 78 | + - Stainless steel: also sand to remove oxide and increase surface roughness. |
|
| 79 | + - Purpose: remove oxide layer and increase mechanical keying. |
|
| 100 | 80 | |
| 101 | -太厚会脆 |
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| 81 | +2. Degrease (required) |
|
| 82 | + - Use isopropyl alcohol or acetone. |
|
| 83 | + - Wipe thoroughly and let dry. |
|
| 102 | 84 | |
| 103 | -4️⃣ 固化时夹紧 |
|
| 85 | +3. Control adhesive layer thickness |
|
| 86 | + - Recommended thickness: 0.1–0.3 mm |
|
| 87 | + - Too thin → lower strength; too thick → more brittle |
|
| 104 | 88 | |
| 105 | -不要挤干胶 |
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| 89 | +4. Clamp during curing |
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| 90 | + - Clamp for alignment and pressure, but do not squeeze all adhesive out. |
|
| 91 | + - Ensure even contact and correct gap thickness. |
|
| 106 | 92 | |
| 107 | -只是定位、对齐 |
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| 93 | +General adhesive notes |
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| 94 | +- Choose an adhesive suitable for the material and environment (temperature, load, chemical exposure). |
|
| 95 | +- For metals, epoxy and structural acrylics are common choices. |
|
| 108 | 96 | |
| 97 | +--- |
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| 109 | 98 | |
| 99 | +## References |
|
| 100 | +- [[AI]] |
|
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power-dat/constant-current-dat/2025-12-30-02-29-26.png
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power-dat/constant-current-dat/2025-12-30-02-36-12.png
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power-dat/constant-current-dat/constant-current-dat.md
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| 1 | + |
|
| 2 | +# constant-current-dat |
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| 3 | + |
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| 4 | + |
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| 5 | + |
|
| 6 | +## apps |
|
| 7 | + |
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| 8 | +- [[LED-driver-dat]] |
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| 9 | + |
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| 10 | +- [[fan-dat]] |
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| 11 | + |
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| 12 | + |
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| 13 | + |
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| 14 | + |
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| 15 | + |
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| 16 | + |
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| 17 | + |
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| 18 | +## current limit control |
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| 19 | + |
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| 20 | + |
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| 21 | + |
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| 22 | + |
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| 23 | +Current Limiting Circuit with TL431 |
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| 24 | + |
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| 25 | +Now, let's understand how the current limiting functionality works. In the schematic, you can see we have a 78L05 Voltage Regulator, which is an ultra-low-power regulator that is used to convert the input voltage to a constant 5V for the TL431 IC. The TL431 is a reference that is set to a constant current regulator mode with the help of a 71.5K resistor and a potentiometer. This reference is compared to the sense voltage from the output side of the resistor to limit the current. The circuit shown below is the TL431 circuit that is providing a constant current source to the op-amps. |
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| 26 | + |
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| 27 | + |
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| 28 | + |
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| 29 | +## ref |
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| 30 | + |
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| 31 | + |
power-dat/power-dat.md
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| 31 | 31 | |
| 32 | 32 | - [[supervisory-dat]] - [[power-switch-dat]] - [[voltage-reference-dat]] |
| 33 | 33 | |
| 34 | +- [[constant-current-dat]] |
|
| 34 | 35 | |
| 35 | 36 | ## power design workflow |
| 36 | 37 |