Board-dat/ARM/ARM1003-dat/ARM1003-dat.md
... ...
@@ -22,7 +22,7 @@ power distributation please see this page [[Power-distribution-dat]]
22 22
23 23
- [[ethernet-dat]] - [[BLE-dat]] - [[USB-dat]]
24 24
25
-- [[WCH-dat]] - [[CH579-dat]]
25
+- [[WCH-dat]] - [[CH579-dat]] - [[WCH-MCU-dat]] - [[WCH-PROG-dat]]
26 26
27 27
- official SDK - https://www.wch.cn/products/ch579.html
28 28
- https://github.com/Edragon/WCH_CH579.git
Board-dat/Board-DAT.md
... ...
@@ -128,7 +128,7 @@ see more ESP32 apps at NWI section
128 128
129 129
### IMS
130 130
131
-- [[IMS1009-dat]]
131
+- [[IMS1009-dat]] - [[IMS1030-dat]]
132 132
133 133
134 134
### ILC
Board-dat/IMS/IMS1030-dat/IMS1030-dat.md
... ...
@@ -39,4 +39,4 @@ https://www.youtube.com/shorts/wiDk-X6urJ4
39 39
- [[case-header-dat]]
40 40
41 41
42
-- [[IMS1030]]
... ...
\ No newline at end of file
0
+- [[IMS1030]] - [[IMS1030-fab]]
... ...
\ No newline at end of file
Chip-cn-dat/WCH-dat/WCH-MCU-dat/WCH-MCU-dat.md
... ...
@@ -13,6 +13,11 @@
13 13
开发工具：http://www.mounriver.com/
14 14
芯片资料：https://www.wch.cn/products/CH32V103.html
15 15
16
+- [[CH579-dat]]
17
+
18
+- [[WCH-PROG-dat]] - [[WCH-SDK-dat]]
19
+
20
+
16 21
## ref
17 22
18 23
- [[WCH-dat]]
... ...
\ No newline at end of file
Home.md
... ...
@@ -27,9 +27,9 @@
27 27
28 28
- [[SDK-DAT]] - [[RPI-SDK-dat]] - [[ESP-SDK-dat]] - [[camera-sdk-dat]] - [[display-sdk-dat]] - [[arduino-ide-dat]] - [[MDK-ARM-dat]]
29 29
30
-- [[PCB-dat]] - [[PCBA-dat]] - [[EDA-dat]] - [[PCB-design-dat]]
31
-
30
+- [[PCB-dat]] - [[EDA-dat]] - [[PCB-design-dat]]
32 31
32
+- [[fab-PCBA-dat]] - [[fab-stencil-dat]] - [[PCB-adhesive-dat]] - [[export-coordinate-dat]] - [[mark-point-dat]] - [[SMT-Red-Adhesive-dat]] - [[solder-paste-dat]]
33 33
34 34
35 35
PCB-dat/desoldering-dat/desoldering-dat.md
... ...
@@ -0,0 +1,41 @@
1
+
2
+# desoldering-dat
3
+
4
+- [[PSO1043-dat]] == desoldering pump
5
+
6
+- [[PSO1038-dat]] == desoldering wire (wick)
7
+
8
+- [[hot-air-station-dat]]
9
+
10
+- [[Hot-Tweezer-dat]]: These are like regular tweezers but with heated tips. They can simultaneously heat and grip small two-leaded SMD components like resistors, capacitors, and SOT packages for easy removal.
11
+
12
+
13
+
14
+
15
+| Feature | Desoldering Wire (Wick) | Desoldering Pump |
16
+| ----------------- | ------------------------------ | --------------------------------------- |
17
+| **Function** | Absorbs melted solder | Sucks up melted solder |
18
+| **Best For** | Small, precise work | Removing large amounts of solder |
19
+| **Ease of Use** | Requires steady hand & flux | Requires quick reaction & suction |
20
+| **Effectiveness** | **Good for fine traces & SMD** | **Good for through-hole components** |
21
+| **Messiness** | Leaves minimal residue | Can scatter solder if not used properly |
22
+| **Durability** | One-time use per section | Reusable multiple times |
23
+| **Cost** | Cheap, but needs refilling | More expensive, but reusable |
24
+| **Skill Level** | Easier for beginners | Requires practice to master |
25
+| **Item** | [[PSO1043-dat]] | [[PSO1038-dat]] |
26
+
27
+
28
+
29
+
30
+## mess desoldering
31
+
32
+- [[preheat-bed-dat]]
33
+
34
+
35
+
36
+
37
+
38
+## ref
39
+
40
+
41
+- [[soldering-dat]] - [[tech-dat]]
... ...
\ No newline at end of file
PCB-dat/soldering-dat/soldering-dat.md
... ...
@@ -0,0 +1,53 @@
1
+# soldering-dat
2
+
3
+- [[PSO1043-dat]] - [[PSO1038-dat]]
4
+
5
+- [[PCB-cleaner-dat]]
6
+
7
+- [[solder-paste-dat]]
8
+
9
+- [[soldering-tools-dat]]
10
+
11
+
12
+
13
+
14
+## soldering skills
15
+
16
+
17
+
18
+
19
+
20
+### soldering chip with pads underneath, such as QFN, BGA, LGA, etc.
21
+
22
+- [[allwinner-dat]]
23
+
24
+T113 soldering note: 务必先焊接除T113以外的元器件，烧录51单片机固件，按下面的说明，测量3.3V、1.5V、0.9V全部正常再焊T113，否则若EA3036的FB虚焊将会直接烧坏T113。
25
+
26
+T113 soldering note (English): Be sure to solder all components except T113 first, program the 51 MCU firmware, and follow the instructions below to measure 3.3V, 1.5V, and 0.9V to ensure they are all normal before soldering T113. Otherwise, if the FB pin of EA3036 is poorly soldered, T113 may be directly damaged.
27
+
28
+
29
+
30
+### FPC soldering
31
+
32
+- [[FPC-dat]]
33
+
34
+### alternative temperature-sensitive items soldering
35
+
36
+
37
+> No special solder paste is needed; the key point is not to heat the FPC connector directly—apply heat from the back side of the PCB.
38
+>
39
+> **Explanation:**
40
+> When soldering temperature-sensitive components like FPC (Flexible Printed Circuit) connectors, you generally do not need to use any special type of solder paste. The most important thing is to avoid applying hot air or direct heat to the FPC connector itself, as it can be easily damaged by high temperatures.
41
+> Instead, use a hot air gun or soldering tool to heat the solder joints from the back side of the PCB. This approach helps protect the delicate connector and ensures a reliable solder joint.
42
+
43
+
44
+
45
+## ref
46
+
47
+- [[desoldering-dat]]
48
+
49
+- [[welding-dat]] - [[spot-welding-dat]] - [[PTC-dat]]
50
+
51
+- [[ICT-testing]]
52
+
53
+- [[soldering]]
... ...
\ No newline at end of file
PCB-dat/spot-welding-dat/2025-06-13-13-43-52.png
... ...
Binary files /dev/null and b/PCB-dat/spot-welding-dat/2025-06-13-13-43-52.png differ
PCB-dat/spot-welding-dat/spot-welding-dat.md
... ...
@@ -0,0 +1,13 @@
1
+
2
+# spot-welding-dat
3
+
4
+![](2025-06-13-13-43-52.png)
5
+
6
+specifically for [[battery-dat]]
7
+
8
+
9
+## ref
10
+
11
+- [[battery-dat]]
12
+
13
+- [[spot-welding]] - [[soldering]]
... ...
\ No newline at end of file
SDK-dat/WCH-SDK-dat/WCH_PROG/WCH-PROG-dat.md
... ...
@@ -1,4 +1,7 @@
1 1
2
+# WCH-PROG-dat
3
+
4
+
2 5
3 6
# WCHISPTool
4 7
... ...
@@ -18,6 +21,9 @@
18 21
19 22
![](2024-05-07-16-20-48.png)
20 23
24
+
25
+
26
+
21 27
## CH559
22 28
23 29
![](36-39-15-31-01-2023.png)
Tech-dat/interactive-dat/LED-dat/2025-09-01-20-27-22.png
... ...
Binary files /dev/null and b/Tech-dat/interactive-dat/LED-dat/2025-09-01-20-27-22.png differ
Tech-dat/interactive-dat/LED-dat/2025-09-01-20-28-25.png
... ...
Binary files /dev/null and b/Tech-dat/interactive-dat/LED-dat/2025-09-01-20-28-25.png differ
Tech-dat/interactive-dat/LED-dat/LED-dat.md
... ...
@@ -79,8 +79,13 @@ GPIO4:
79 79
- Widely adopted in **flashlights**, **bike lamps**, **spotlights**, and **DIY lighting projects**
80 80
81 81
82
+## commerial LED panels
82 83
84
+![](2025-09-01-20-27-22.png)
83 85
86
+![](2025-09-01-20-28-25.png)
87
+
88
+- [[ACDC-dat]]
84 89
85 90
86 91
## ref
Tech-dat/interactive-dat/LED-dat/led-driver-dat/2025-09-01-20-32-40.png
... ...
Binary files /dev/null and b/Tech-dat/interactive-dat/LED-dat/led-driver-dat/2025-09-01-20-32-40.png differ
Tech-dat/interactive-dat/LED-dat/led-driver-dat/2025-09-01-20-33-21.png
... ...
Binary files /dev/null and b/Tech-dat/interactive-dat/LED-dat/led-driver-dat/2025-09-01-20-33-21.png differ
Tech-dat/interactive-dat/LED-dat/led-driver-dat/led-driver-dat.md
... ...
@@ -86,6 +86,16 @@ R5为芯片的反馈电阻，用于调节输出的电流，计算公式可参考
86 86
如上图，下方说明了LED为2并5串，额定电流为40ma，我们为了保险，选择了20ma，亮度会有所损失。
87 87
88 88
89
+## 12V button-MCU-transistor driver
90
+
91
+button buttons on the back side, low-side control white and warm white LED strips
92
+
93
+![](2025-09-01-20-32-40.png)
94
+
95
+driver AOA3 ?
96
+
97
+![](2025-09-01-20-33-21.png)
98
+
89 99
### ref
90 100
91 101
- https://tigoe.github.io/LightProjects/led-strips.html
fab-PCBA-dat/PCBA-dat/PCBA-dat.md
... ...
@@ -1,18 +0,0 @@
1
-
2
-# PCBA-dat
3
-
4
-- [[soldering-dat]] - [[desoldering-dat]]
5
-
6
-- [[spot-welding-dat]]
7
-
8
-- [[solder-paste-dat]]
9
-
10
-- [[PCB-dat]]
11
-
12
-
13
-
14
-## ref
15
-
16
-- [[fab-dat]]
17
-
18
-- [[fab]]
... ...
\ No newline at end of file
fab-PCBA-dat/PCBA-dat/desoldering-dat/desoldering-dat.md
... ...
@@ -1,41 +0,0 @@
1
-
2
-# desoldering-dat
3
-
4
-- [[PSO1043-dat]] == desoldering pump
5
-
6
-- [[PSO1038-dat]] == desoldering wire (wick)
7
-
8
-- [[hot-air-station-dat]]
9
-
10
-- [[Hot-Tweezer-dat]]: These are like regular tweezers but with heated tips. They can simultaneously heat and grip small two-leaded SMD components like resistors, capacitors, and SOT packages for easy removal.
11
-
12
-
13
-
14
-
15
-| Feature | Desoldering Wire (Wick) | Desoldering Pump |
16
-| ----------------- | ------------------------------ | --------------------------------------- |
17
-| **Function** | Absorbs melted solder | Sucks up melted solder |
18
-| **Best For** | Small, precise work | Removing large amounts of solder |
19
-| **Ease of Use** | Requires steady hand & flux | Requires quick reaction & suction |
20
-| **Effectiveness** | **Good for fine traces & SMD** | **Good for through-hole components** |
21
-| **Messiness** | Leaves minimal residue | Can scatter solder if not used properly |
22
-| **Durability** | One-time use per section | Reusable multiple times |
23
-| **Cost** | Cheap, but needs refilling | More expensive, but reusable |
24
-| **Skill Level** | Easier for beginners | Requires practice to master |
25
-| **Item** | [[PSO1043-dat]] | [[PSO1038-dat]] |
26
-
27
-
28
-
29
-
30
-## mess desoldering
31
-
32
-- [[preheat-bed-dat]]
33
-
34
-
35
-
36
-
37
-
38
-## ref
39
-
40
-
41
-- [[soldering-dat]] - [[tech-dat]]
... ...
\ No newline at end of file
fab-PCBA-dat/PCBA-dat/solder-paste-dat/2024-02-17-16-19-00.png
... ...
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fab-PCBA-dat/PCBA-dat/solder-paste-dat/2024-02-17-16-20-20.png
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fab-PCBA-dat/PCBA-dat/solder-paste-dat/2024-02-17-16-20-38.png
... ...
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fab-PCBA-dat/PCBA-dat/solder-paste-dat/2024-02-17-16-20-49.png
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fab-PCBA-dat/PCBA-dat/solder-paste-dat/2025-08-08-12-11-20.png
... ...
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fab-PCBA-dat/PCBA-dat/solder-paste-dat/solder-paste-dat.md
... ...
@@ -1,70 +0,0 @@
1
-
2
-# solder-paste-dat
3
-
4
-## Low temperature soldering paste
5
-
6
-Low temperature soldering paste is a type of solder paste designed to melt and flow at lower temperatures than standard solder pastes. Here are its main features:
7
-
8
-- Melting Point: Typically melts between 130°C and 180°C, compared to standard lead-free solder pastes which melt around 217°C.
9
-- Composition: Often contains bismuth-based alloys (e.g., Sn42/Bi58) instead of traditional tin-silver-copper (SAC) alloys.
10
-- Applications: Ideal for temperature-sensitive components, rework, or double-sided PCB assembly where high heat could dam-Age parts.
11
-- Reduced Thermal Stress: Minimizes risk of warping or dam-Aging PCBs and components.
12
-- Energy Saving: Lower reflow oven temperatures reduce energy consumption.
13
-- Compatibility: Useful for mixed-technology boards or assemblies with plastic connectors and LEDs.
14
-
15
-
16
-
17
-
18
-### Solder Paste Types and Applications
19
-
20
-
21
-| Solder Paste Model | Composition | Powder Type | Application/Notes |
22
-| -------------------- | ------------------- | ----------- | --------------------------------------------------- |
23
-| Mobile Repair GY618B | Sn62.8-Pb36.8-Ag0.4 | Type 4 | For mobile phone repair |
24
-| A-888 | Sn63-Pb37 | Type 3 | resistors, capacitors, simple IC PCBs |
25
-| A-888 | Sn63-Pb37 | Type 4 | resistors, capacitors, fine-pitch/multi-pin IC PCBs |
26
-| SMT Chip A-888 | Sn63-Pb37 | Type 5 | resistors, capacitors, dense/multi-pin IC PCBs |
27
-| GY-626B | Sn62.9-Pb36.9-Ag0.2 | Type 4 | QFN type PCBs |
28
-| GY-618B-B | Sn62.8-Pb36.8-Ag0.4 | Type 4 | BGA pack-Age PCBs |
29
-| LED Chip GY361 | Sn55-Pb45 | Type 3 | LED lamps, strips, and tapes |
30
-| GY638A | Sn60-Pb40 | Type 3 | Performance superior to GY361 |
31
-
32
-
33
-
34
-## target
35
-
36
-- [[FPC-dat]]
37
-
38
-
39
-
40
-## Common type Solder Paste
41
-
42
-| melting point | tin content | Note |
43
-| ------------- | ----------- | -------------------------------------------------------------------- |
44
-| 138 C | 42% | ultra-low temperature, bismuth-based, for special low-temp soldering |
45
-| 150 C | 42% | low temperature, bismuth-based, for temperature-sensitive components |
46
-| 183 C | 63% | best for most common PCB, small spacing, high parts density |
47
-| 217 C | 99.3% | lead-free, SAC305 alloy, standard for RoHS compliant PCBs |
48
-
49
-
50
-
51
-
52
-![](2024-02-17-16-19-00.png)
53
-
54
-![](2024-02-17-16-20-20.png)
55
-
56
-![](2024-02-17-16-20-38.png)
57
-
58
-![](2024-02-17-16-20-49.png)
59
-
60
-## solder paste printer
61
-
62
-![](2025-08-08-12-11-20.png)
63
-
64
-
65
-
66
-## ref
67
-
68
-- [[solder-paste]]
69
-
70
-- [[soldering-dat]]
... ...
\ No newline at end of file
fab-PCBA-dat/PCBA-dat/soldering-dat/soldering-dat.md
... ...
@@ -1,53 +0,0 @@
1
-# soldering-dat
2
-
3
-- [[PSO1043-dat]] - [[PSO1038-dat]]
4
-
5
-- [[PCB-cleaner-dat]]
6
-
7
-- [[solder-paste-dat]]
8
-
9
-- [[soldering-tools-dat]]
10
-
11
-
12
-
13
-
14
-## soldering skills
15
-
16
-
17
-
18
-
19
-
20
-### soldering chip with pads underneath, such as QFN, BGA, LGA, etc.
21
-
22
-- [[allwinner-dat]]
23
-
24
-T113 soldering note: 务必先焊接除T113以外的元器件，烧录51单片机固件，按下面的说明，测量3.3V、1.5V、0.9V全部正常再焊T113，否则若EA3036的FB虚焊将会直接烧坏T113。
25
-
26
-T113 soldering note (English): Be sure to solder all components except T113 first, program the 51 MCU firmware, and follow the instructions below to measure 3.3V, 1.5V, and 0.9V to ensure they are all normal before soldering T113. Otherwise, if the FB pin of EA3036 is poorly soldered, T113 may be directly damaged.
27
-
28
-
29
-
30
-### FPC soldering
31
-
32
-- [[FPC-dat]]
33
-
34
-### alternative temperature-sensitive items soldering
35
-
36
-
37
-> No special solder paste is needed; the key point is not to heat the FPC connector directly—apply heat from the back side of the PCB.
38
->
39
-> **Explanation:**
40
-> When soldering temperature-sensitive components like FPC (Flexible Printed Circuit) connectors, you generally do not need to use any special type of solder paste. The most important thing is to avoid applying hot air or direct heat to the FPC connector itself, as it can be easily damaged by high temperatures.
41
-> Instead, use a hot air gun or soldering tool to heat the solder joints from the back side of the PCB. This approach helps protect the delicate connector and ensures a reliable solder joint.
42
-
43
-
44
-
45
-## ref
46
-
47
-- [[desoldering-dat]]
48
-
49
-- [[welding-dat]] - [[spot-welding-dat]] - [[PTC-dat]]
50
-
51
-- [[ICT-testing]]
52
-
53
-- [[soldering]]
... ...
\ No newline at end of file
fab-PCBA-dat/PCBA-dat/spot-welding-dat/2025-06-13-13-43-52.png
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fab-PCBA-dat/PCBA-dat/spot-welding-dat/spot-welding-dat.md
... ...
@@ -1,13 +0,0 @@
1
-
2
-# spot-welding-dat
3
-
4
-![](2025-06-13-13-43-52.png)
5
-
6
-specifically for [[battery-dat]]
7
-
8
-
9
-## ref
10
-
11
-- [[battery-dat]]
12
-
13
-- [[spot-welding]] - [[soldering]]
... ...
\ No newline at end of file
fab-PCBA-dat/fab-PCBA-dat.md
... ...
@@ -1,6 +1,19 @@
1 1
2 2
# PCBA-dat
3 3
4
+
5
+- [[soldering-dat]] - [[desoldering-dat]]
6
+
7
+- [[spot-welding-dat]]
8
+
9
+- [[solder-paste-dat]]
10
+
11
+- [[PCB-dat]]
12
+
13
+
14
+
15
+
16
+
4 17
- [[PNP-machine-dat]] - [[reflow-machine-dat]]
5 18
6 19
- [[PCB-cleaner-dat]]
... ...
@@ -36,3 +49,9 @@
36 49
- or layered plastic case [[layered-case-dat]]
37 50
- more simple soltuion - [[PMP1037-dat]]
38 51
52
+## ref
53
+
54
+- [[fab-dat]]
55
+
56
+- [[fab]]
57
+
fab-PCBA-dat/fab-Stencil-DAT/fab-stencil-dat.md
... ...
@@ -64,23 +64,28 @@ other un-common size frameless
64 64
65 65
## stencil printer
66 66
67
-table printer
67
+### table printer
68 68
69 69
![](2025-09-01-17-56-12.png)
70 70
71
-screwed printer
71
+### screwed printer
72 72
73 73
![](2025-09-01-17-57-01.png)
74 74
75 75
76 76
77 77
78
-3D printed holder
78
+### 3D printed holder
79 79
80 80
![](2025-08-19-17-53-38.png)
81 81
82 82
83 83
84
+
85
+
86
+
87
+
88
+
84 89
## other ideas
85 90
86 91
cruved printer
fab-PCBA-dat/solder-paste-dat/2024-02-17-16-19-00.png
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fab-PCBA-dat/solder-paste-dat/2024-02-17-16-20-49.png
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fab-PCBA-dat/solder-paste-dat/solder-paste-dat.md
... ...
@@ -0,0 +1,70 @@
1
+
2
+# solder-paste-dat
3
+
4
+## Low temperature soldering paste
5
+
6
+Low temperature soldering paste is a type of solder paste designed to melt and flow at lower temperatures than standard solder pastes. Here are its main features:
7
+
8
+- Melting Point: Typically melts between 130°C and 180°C, compared to standard lead-free solder pastes which melt around 217°C.
9
+- Composition: Often contains bismuth-based alloys (e.g., Sn42/Bi58) instead of traditional tin-silver-copper (SAC) alloys.
10
+- Applications: Ideal for temperature-sensitive components, rework, or double-sided PCB assembly where high heat could dam-Age parts.
11
+- Reduced Thermal Stress: Minimizes risk of warping or dam-Aging PCBs and components.
12
+- Energy Saving: Lower reflow oven temperatures reduce energy consumption.
13
+- Compatibility: Useful for mixed-technology boards or assemblies with plastic connectors and LEDs.
14
+
15
+
16
+
17
+
18
+### Solder Paste Types and Applications
19
+
20
+
21
+| Solder Paste Model | Composition | Powder Type | Application/Notes |
22
+| -------------------- | ------------------- | ----------- | --------------------------------------------------- |
23
+| Mobile Repair GY618B | Sn62.8-Pb36.8-Ag0.4 | Type 4 | For mobile phone repair |
24
+| A-888 | Sn63-Pb37 | Type 3 | resistors, capacitors, simple IC PCBs |
25
+| A-888 | Sn63-Pb37 | Type 4 | resistors, capacitors, fine-pitch/multi-pin IC PCBs |
26
+| SMT Chip A-888 | Sn63-Pb37 | Type 5 | resistors, capacitors, dense/multi-pin IC PCBs |
27
+| GY-626B | Sn62.9-Pb36.9-Ag0.2 | Type 4 | QFN type PCBs |
28
+| GY-618B-B | Sn62.8-Pb36.8-Ag0.4 | Type 4 | BGA pack-Age PCBs |
29
+| LED Chip GY361 | Sn55-Pb45 | Type 3 | LED lamps, strips, and tapes |
30
+| GY638A | Sn60-Pb40 | Type 3 | Performance superior to GY361 |
31
+
32
+
33
+
34
+## target
35
+
36
+- [[FPC-dat]]
37
+
38
+
39
+
40
+## Common type Solder Paste
41
+
42
+| melting point | tin content | Note |
43
+| ------------- | ----------- | -------------------------------------------------------------------- |
44
+| 138 C | 42% | ultra-low temperature, bismuth-based, for special low-temp soldering |
45
+| 150 C | 42% | low temperature, bismuth-based, for temperature-sensitive components |
46
+| 183 C | 63% | best for most common PCB, small spacing, high parts density |
47
+| 217 C | 99.3% | lead-free, SAC305 alloy, standard for RoHS compliant PCBs |
48
+
49
+
50
+
51
+
52
+![](2024-02-17-16-19-00.png)
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+
54
+![](2024-02-17-16-20-20.png)
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+
56
+![](2024-02-17-16-20-38.png)
57
+
58
+![](2024-02-17-16-20-49.png)
59
+
60
+## solder paste printer
61
+
62
+![](2025-08-08-12-11-20.png)
63
+
64
+
65
+
66
+## ref
67
+
68
+- [[solder-paste]]
69
+
70
+- [[soldering-dat]]
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4 4
![](2023-08-31-18-49-57.png)
5 5
6 6
7
-- [[ACDC-RC_BUCK]]
... ...
\ No newline at end of file
0
+- [[ACDC-RC_BUCK]]
1
+
2
+
3
+## APP 1
4
+
5
+![](2025-09-01-20-31-10.png)
6
+
7
+![](2025-09-01-20-31-20.png)
8
+
9
+![](2025-09-01-20-31-32.png)
10
+
11
+![](2025-09-01-20-31-47.png)
12
+
13
+
14
+## ref
15
+
16
+- [[ACDC-dat]]
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\ No newline at end of file
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@@ -1,6 +1,9 @@
1 1
2 2
# ac-mains-dat
3 3
4
+
5
+## tech
6
+
4 7
- [[sensor-voltage-dat]] - [[sensor-current-dat]] - [[current-transformer-dat]]
5 8
6 9
- [[acdc-adapter-dat]] - [[acdc-dat]]
... ...
@@ -15,6 +18,10 @@
15 18
16 19
- [[ground-wire-dat]]
17 20
21
+- [[ACDC-RC_buck-dat]]
22
+
23
+
24
+
18 25
## Note
19 26
20 27
- The live wire of domestic circuits is usually red and is at high voltage.