Board-dat/Board-DAT.md
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@@ -276,7 +276,9 @@ MPC cable
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### NBL
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-- [[bluetooth-dat]] - [[bt-audio-dat]]
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+- [[bluetooth-dat]]
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+
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+- [[bt-audio-dat]] - [[NBL1111-dat]] - [[NBL1115-dat]]
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audio bluetooth Speaker - [[NBL1089-DAT]]
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Chip-cn-dat/Beken-dat/beken-dat.md
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@@ -1,6 +1,16 @@
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# beken-dat
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+
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+- [[Walkie-talkie-dat]] - [[wireless-microphone-dat]] - [[ETC-dat]]
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+
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+
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+## Proprietary
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+
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+- BK5812
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+- BK2481/2/3
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+- BK5813
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+
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## modules
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- [[NBL1037-dat]] - [[NBL1038-dat]]
Chip-cn-dat/chip-cn-dat.md
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@@ -7,6 +7,8 @@
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- [[allwinner-dat]] - [[allwinner-D1-dat]] - [[V3S-dat]] - [[F1C200-dat]] - [[F1C100-dat]] - [[F133-dat]]
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+- [[beken-dat]]
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+
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- [[Espressif-dat]] - [[ESP32-dat]] - [[ESP32-S3-dat]] - [[ESP32-C3-dat]] - [[ESP32-P4-dat]]
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- [[ESP8266-dat]] - [[esp8266-modules-dat]] - [[ESP8266-board-dat]]
PCB-dat/PCB-dat.md
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@@ -14,6 +14,9 @@
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- [[EDA-dat]] - [[PCB-design-dat]] - [[kicad-dat]]
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+
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+
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+
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## PCB edit
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- [[desoldering-dat]] - [[PCB-fix-dat]]
Tech-dat/tech-dat.md
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@@ -63,6 +63,9 @@
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### network
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+== Proprietary
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+
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+
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- [[network-dat]] - [[location-dat]]
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- [[network-system-dat]]
app-dat/ETC-dat/ETC-dat.md
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@@ -0,0 +1,5 @@
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+
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+# ETC-dat
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+
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+- [[beken-dat]]
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+
app-dat/Walkie-talkie-dat/Walkie-talkie-dat.md
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@@ -0,0 +1,4 @@
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+
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+# Walkie-talkie-dat
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+
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+- [[beken-dat]]
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\ No newline at end of file
app-dat/wireless-microphone-dat/wireless-microphone-dat.md
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@@ -0,0 +1,4 @@
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+
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+# wireless-microphone-dat
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+
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+- [[beken-dat]]
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\ No newline at end of file
fab-dat/fab-PCBA-dat/fab-Stencil-DAT/fab-stencil-dat.md
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@@ -3,6 +3,7 @@
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- [[fab-PCBA-dat]]
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+- [[high-precise-printing-dat]]
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## common size frameless
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@@ -64,6 +65,9 @@ other un-common size frameless
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- "machine" bias 0.05 mm
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+
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+
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+
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## stencil printer
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### table printer
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@@ -115,6 +119,10 @@ cruved printer
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+
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+
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+
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+
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## ref
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- [[fab-stencil]] - [[fab-stencil-print]]
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\ No newline at end of file
fab-dat/fab-PCBA-dat/high-precise-printing-dat/high-precise-printing-dat.md
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@@ -0,0 +1,33 @@
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+
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+# high-precise-printing-dat
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+
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+## 1. Stencil Thickness
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+- **Recommended**: 0.10 mm (4 mil) stainless steel
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+- Sometimes 0.12 mm (5 mil) can work, but **risk of bridging increases**
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+- Thinner stencil (4 mil) improves paste release for fine pitch
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+
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+## 2. Aperture Design
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+- **Aperture width: ~0.20–0.22 mm** for SSOP16 etc (slightly smaller than 0.25–0.30 mm pad width)
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+- Length: ~1.3–1.5 mm (same as pad length, or 10–20% reduction to reduce paste volume)
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+- **Aperture reduction (shrinkage): ~90% of pad size is typical** (to avoid solder bridging)
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+
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+## 3. Aperture Shape
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+- Rectangular with rounded corners
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+- Optionally “home-plate” shape to pull solder toward pad center
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+
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+## 4. Fabrication Tolerances
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+- Laser-cut stainless steel stencil
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+- Electro-polished finish for smoother walls → better paste release
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+- Registration accuracy: ±12.5 µm typical
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+
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+## 5. Paste Type
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+- Use Type 4 (20–38 µm) or Type 5 (15–25 µm) solder paste
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+- Finer powder improves print definition at 0.635 mm pitch
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+
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+- [[solder-paste-dat]]
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+
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+## 6. Aspect Ratio Rules
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+
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+- Aperture width / stencil thickness ≥ 1.5
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+- Area ratio (aperture area / aperture wall area) ≥ 0.66
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+ → With 0.20 mm × 1.4 mm aperture and 0.10 mm stencil → Area ratio ≈ 0.71 ✅ (good)
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\ No newline at end of file
tools-dat/soldering-tools-dat/solder-paste-dat/solder-paste-dat.md
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@@ -1,6 +1,8 @@
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# solder-paste-dat
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+- [[high-precise-printing-dat]]
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+
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## Low temperature soldering paste
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Low temperature soldering paste is a type of solder paste designed to melt and flow at lower temperatures than standard solder pastes. Here are its main features: