chips

+The PTQ45P02 is a surface-mount, P-Channel Power MOSFET. It is frequently used in battery management systems, power supplies, and consumer electronics requiring high current switching in a compact format.

+

+

+## board

+- [[LDO-dat]]

+

+

+

+

+

+# chinabadam.com-dat

+

+

+

+

+

+- [[jieli-dat]] - [[chinabadam.com-dat]] - JL AC1649

+

+

+

+

+

+## ref

+

+

+

+# CBM2199-dat

+

+- [[chipsbank-dat]] - [[CBM2199-dat]]

+

+

+

+https://www.usbdev.ru/files/chipsbank/cbm2199umptool/

+

+https://www.usbdev.ru/files/chipsbank/cbm2099umptool/

+

+- datasheet == [[CBM2090CBM2090L_1107.pdf]]

+

+The CBM2090 is the USB 2.0 Flash Disk controller with the fastest transfer speed on the market.

+

+CBM2090 can reach theoretical flash access speed limit of over 30MByte/s for read and 25MByte/s for write. For CBM1190, it can reach 1.0Mbytes/s write and 1.1Mbytes/s read.

+

+

+## CBM2199E Overview

+

+CBM2199E is a USB 2.0 controller launched by Chipsbank Technologies Co., Ltd. This chip is primarily used for high-capacity USB storage drives. It adopts the BCH ECC error correction algorithm, supporting up to 72-bit/1K. It offers advantages in bad block identification and data error correction capabilities, and features excellent wear-leveling algorithms.

+

+| Feature | Specification |

+| :--- | :--- |

+| **Data Interface** | Wireless 802.11n (2.4/5G) & Wired 1000M |

+| **Data Transfer Time** | Wireless ≤ 7s, Wired ≤ 5s |

+| **Acquisition Matrix & Rate** | 1. 3072 x 3072 pixs: Continuous 3 fps<br>2. 1536 x 1536 pixs: Pulse 6 fps, Continuous 6/15 fps<br>3. 1024 x 1024 pixs: Pulse 12 fps, Continuous 12/15/25 fps<br>4. 768 x 768 pixs: Continuous 30 fps |

+| **Spatial Resolution** | 3.5 lp/mm |

+| **Storage** | 100 images |

+| **MTF** | 82% @ 0.5 lp/mm / 78% @ 0.5 lp/mm |

+| **DQE** | 60% @ 0.5 lp/mm / 55% @ 0.5 lp/mm |

+| **Functions** | Soft Trigger / AED |

+

+## Physical & Power

+

+- **Structural Parameters**: 4.9 kg / Load capacity 135 kg / 460 × 460 × 15.5 (mm)

+- **Battery**: 6000 mAh / 44.4 Wh / 8.4 V

+- **Battery Management**: 15s quick battery swap, charging time ≤ 3H

+

+## Environmental Requirements

+

+- **Operating Environment**:

+ - Temperature: 5°C to 35°C

+ - Humidity: 30% to 80% RH (no condensation)

+- **Storage Environment**:

+ - Temperature: -10°C to 55°C

+ - Humidity: 15% to 90% RH (no condensation)

+

+

+

+

+# chipsbank-dat

+

+- [[chipsbank-dat]] - [[CBM2199-dat]]

+- [[jieli-dat]] - [[chinabadam.com-dat]] - JL AC1649

+

+

+

+

+# LP4073-dat

+

+- [[LP4073-dat]] - [[lowpowersemi-dat]]

+

+1A Single Chip Li-Ion and Li-Polymer Charger

+

+The LP4073 is a complete constant-current/ constant voltage linear charger for single cell lithium-ion battery. No external sense resistor is needed, and no blocking diode is required due to the internal MOSFET architecture. Thermal feedback regulates the charge current to limit the die temperature during high power operation or high ambient temperature. The charge voltage is fixed at 4.2V/4.35V, and the charge current can be programmed externally by ISET pin with a single resistor.

+

+The LP4073 automatically terminates the charge cycle when the charge current drops to 1/10 setting current value after the final float voltage is reached. Other features include charge current monitor, under voltage lockout, automatic recharge, status pins and battery temperature detection

+

+Features

+- Input Voltage up to 28V

+- Input Over Voltage Protection：7V

+- Short-circuit protection

+- Programmable Charge Current up to 1A

+- 1µA Battery Reverse Current

+- Over temperature Sensing Protection

+- Protection of Reverse Connection of Battery

+- Constant-Current/Constant-Voltage Operation with Thermal Regulation

+- TDFN-8 Package

+- RoHS Compliant and 100% Lead (Pb)-Free

+

+

+

+

+# LowPowerSemi-dat

+

+- [[LP4073-dat]] - [[lowpowersemi-dat]]

+

+HT7530-1

+

+

+

+HT75XX-1 - 100mA Low Power LDO

+

+HT7530-1 3.0V

+

+### stack board

+- [[OLED-dat]]

+

+

+

+

+

+### triangle soldering slot plug board

+### PCB slot plug board

+

+== [[weltrend-dat]]

+### card

+### chained board

+## board

+

+

+

+

+

+

+

+## installation

+

+- [[PCB-dat]] - [[PCBA-dat]] - [[PCB-design-dat]] - [[PCB-form-dat]]

+

+

+# Glob-Top-dat

+

+The black, circular, flat "covering" you see on a circuit board is professionally known as **COB (Chip on Board)** or **"Glob Top" encapsulation**.

+

+### 1. What is it?

+It is not a separate component (like a resistor or capacitor); it is a **direct-die mounting method**.

+* Inside that black glob, there is a bare silicon integrated circuit (die) bonded directly onto the printed circuit board (PCB).

+* It is connected to the board via microscopic gold or aluminum wires.

+* The black material is an **epoxy resin**. It acts as a protective shield, protecting the fragile silicon die and the tiny bonding wires from moisture, dust, oxidation, and physical impact.

+

+

+

+### 2. Why is it used?

+You will typically find this in consumer electronics like calculators, toys, digital scales, and remote controls for several reasons:

+* **Cost Efficiency:** It eliminates the need for expensive plastic packaging and leads, drastically reducing production costs.

+* **Miniaturization:** Since there is no bulky outer plastic housing, the component takes up minimal vertical and horizontal space.

+* **IP Protection:** Because the resin is chemically and physically very hard to remove without destroying the delicate wires and silicon, it makes the specific chip logic difficult to reverse-engineer.

+

+### 3. Can it be repaired?

+**Generally, no.** * The epoxy resin is designed to bond permanently to the board.

+* Attempting to remove it usually tears the microscopic bond wires or cracks the silicon die.

+* Unlike components with pins (like DIP or SMD packages), these "Glob Top" chips are treated as non-serviceable parts. If the chip fails, the standard solution is to replace the entire circuit board.

+

+---

+

+This design represents a classic example of modern, high-volume industrial manufacturing where reliability is maintained through chemical sealing rather than mechanical housing.

+

+

+## Disassembling a "Glob Top" (COB)

+

+

+Disassembling a "Glob Top" (COB) component is extremely difficult and almost always results in the permanent destruction of the device. Because the epoxy resin is chemically bonded to the PCB surface and the internal bond wires are finer than human hair, standard repair tools will not work.

+

+### Why Disassembly is Usually Destructive:

+1. **Bond Wire Fragility:** The gold wires connecting the silicon die to the PCB traces are microscopic. Even the slightest mechanical pressure from a tool will snap them.

+2. **Resin Hardness:** The epoxy is formulated to be rigid and heat-resistant. Trying to chip it away manually will almost certainly crack the underlying silicon chip.

+3. **Chemical Resistance:** While certain solvents (like fuming nitric acid or specialized decapsulation chemicals) can dissolve the resin, these are highly toxic, hazardous to handle, and typically unavailable outside of a professional failure analysis laboratory.

+

+### If You Must Attempt It (For Learning/Research Purposes Only):

+If you have a broken board and want to see what is underneath out of curiosity, you can attempt these methods, **knowing the chip will not survive**:

+

+* **Mechanical Grinding/Sanding:** Use fine-grit sandpaper or a precision rotary tool (like a Dremel) at a very low speed to carefully sand away the top layer of the black resin. Stop as soon as you see the shiny metallic surface of the silicon die.

+* **Thermal Shock:** Some cheaper epoxies can be made brittle by extreme temperature changes (e.g., placing the board in a freezer and then applying quick, localized heat with a hot air rework station). This can sometimes cause the resin to crack or flake off, though it is unpredictable.

+* **Heat Gun:** A professional heat gun set to 250°C–300°C can soften some softer resin compounds, allowing you to carefully pick at the edges with a precision needle or dental pick.

+

+

+

+### Warning

+* **Health Hazard:** If you use heat to soften the resin, it may release toxic fumes. Always work in a **well-ventilated area** or under a fume hood.

+* **Safety:** Use eye protection. Small shards of epoxy or brittle silicon can fly off if the resin cracks unexpectedly.

+

+**Are you trying to recover data or fix a specific functionality, or are you just interested in seeing the silicon architecture?**

+

+

+## ref

+

+## board 2

+

+

+

+

+

+

+

+

+

+

+- [[holtek-dat]]

+

+