solder-paste-dat
Low temperature soldering paste
Low temperature soldering paste is a type of solder paste designed to melt and flow at lower temperatures than standard solder pastes. Here are its main features:
- Melting Point: Typically melts between 130°C and 180°C, compared to standard lead-free solder pastes which melt around 217°C.
- Composition: Often contains bismuth-based alloys (e.g., Sn42/Bi58) instead of traditional tin-silver-copper (SAC) alloys.
- Applications: Ideal for temperature-sensitive components, rework, or double-sided PCB assembly where high heat could dam-Age parts.
- Reduced Thermal Stress: Minimizes risk of warping or dam-Aging PCBs and components.
- Energy Saving: Lower reflow oven temperatures reduce energy consumption.
- Compatibility: Useful for mixed-technology boards or assemblies with plastic connectors and LEDs.
Solder Paste Types and Applications
| Solder Paste Model | Composition | Powder Type | Application/Notes |
|---|---|---|---|
| Mobile Repair GY618B | Sn62.8-Pb36.8-Ag0.4 | Type 4 | For mobile phone repair |
| A-888 | Sn63-Pb37 | Type 3 | resistors, capacitors, simple IC PCBs |
| A-888 | Sn63-Pb37 | Type 4 | resistors, capacitors, fine-pitch/multi-pin IC PCBs |
| SMT Chip A-888 | Sn63-Pb37 | Type 5 | resistors, capacitors, dense/multi-pin IC PCBs |
| GY-626B | Sn62.9-Pb36.9-Ag0.2 | Type 4 | QFN type PCBs |
| GY-618B-B | Sn62.8-Pb36.8-Ag0.4 | Type 4 | BGA pack-Age PCBs |
| LED Chip GY361 | Sn55-Pb45 | Type 3 | LED lamps, strips, and tapes |
| GY638A | Sn60-Pb40 | Type 3 | Performance superior to GY361 |