4-layer-dat
The typical lamination order for a 4-layer PCB is:
- Top Layer: Signal layer
- Inner Layer 1: Power plane (e.g., VCC or GND)
- Inner Layer 2: Ground plane (e.g., GND or VCC)
- Bottom Layer: Signal layer
lamination order
"4-layer PCB stack-up:
- Top Layer: Signal
- Inner Layer 1: Power (VCC)
- Inner Layer 2: Ground (GND)
- Bottom Layer: Signal
Please follow this lamination order for manufacturing."