Feature | ESP32-C3 | ESP32-S3 |
---|---|---|
Processor | Single-core RISC-V (160 MHz) | Dual-core Xtensa LX7 (240 MHz) |
Architecture | RISC-V | Xtensa |
Performance | Moderate for basic IoT tasks | High-performance for AI/ML tasks |
Wi-Fi | 2.4 GHz (802.11b/g/n) | 2.4 GHz (802.11b/g/n) |
Bluetooth | Bluetooth 5.0 (LE + Mesh) | Bluetooth 5.0 (LE + Mesh) |
SRAM | 400 KB | 512 KB |
Flash | Up to 4 MB embedded | External Flash support up to 16 MB |
PSRAM Support | No | Yes |
GPIO Pins | 22 | 45 |
USB Support | No native USB support | Native USB OTG |
Camera Interface | No | Yes |
AI/ML Acceleration | Limited | Yes (vector instructions support) |
LCD Interface | No | Yes (parallel RGB or SPI) |
I2S (Audio Support) | Yes | Yes |
Security | RSA, AES, SHA, HMAC | RSA, AES, SHA, HMAC, Digital Signature |
Temperature Range | -40°C to 85°C | -40°C to 125°C |
Power Efficiency | Better for low-power needs | Higher power consumption when active |
Deep Sleep Power | ~5 µA | ~10 µA |
Wake-Up Sources | Timer, GPIO, ULP | Timer, GPIO, ULP, USB |
Peripheral Interfaces | SPI, I2C, I2S, UART, ADC | SPI, I2C, I2S, UART, ADC, CAN, Parallel |
Clock Frequency | 160 MHz | 240 MHz |
Package Options | QFN28, QFN32 | QFN48, QFN68 |
Applications | Basic IoT, BLE tasks | AI/ML, image processing, advanced IoT |
Price | Lower | Higher due to advanced features |
VS ESP32-Wrover-dat
Feature | ESP32-C3 | ESP32-S3 | ESP32-WROVER |
---|---|---|---|
Processor | Single-core RISC-V (160 MHz) | Dual-core Xtensa LX7 (240 MHz) | Dual-core Xtensa LX6 (240 MHz) |
Architecture | RISC-V | Xtensa | Xtensa |
Performance | Moderate for basic IoT tasks | High-performance for AI/ML tasks | High-performance for general IoT |
Wi-Fi | 2.4 GHz (802.11b/g/n) | 2.4 GHz (802.11b/g/n) | 2.4 GHz (802.11b/g/n) |
Bluetooth | Bluetooth 5.0 (LE + Mesh) | Bluetooth 5.0 (LE + Mesh) | Bluetooth 4.2 (LE + Mesh) |
SRAM | 400 KB | 512 KB | 520 KB |
Flash | Up to 4 MB embedded | External Flash support up to 16 MB | Up to 16 MB |
PSRAM Support | No | Yes | Yes (4 MB external PSRAM) |
GPIO Pins | 22 | 45 | 34 |
USB Support | No native USB support | Native USB OTG | No |
Camera Interface | No | Yes | Yes (with external modules) |
AI/ML Acceleration | Limited | Yes (vector instructions support) | No |
LCD Interface | No | Yes (parallel RGB or SPI) | Yes (SPI-based LCD support) |
I2S (Audio Support) | Yes | Yes | Yes |
Security | RSA, AES, SHA, HMAC | RSA, AES, SHA, HMAC, Digital Signature | RSA, AES, SHA, HMAC |
Temperature Range | -40°C to 85°C | -40°C to 125°C | -40°C to 85°C |
Power Efficiency | Better for low-power needs | Higher power consumption when active | Moderate |
Deep Sleep Power | ~5 µA | ~10 µA | ~6 µA |
Wake-Up Sources | Timer, GPIO, ULP | Timer, GPIO, ULP, USB | Timer, GPIO, ULP |
Peripheral Interfaces | SPI, I2C, I2S, UART, ADC | SPI, I2C, I2S, UART, ADC, CAN, Parallel | SPI, I2C, I2S, UART, ADC |
Clock Frequency | 160 MHz | 240 MHz | 240 MHz |
Package Options | QFN28, QFN32 | QFN48, QFN68 | Module with built-in PSRAM |
Applications | Basic IoT, BLE tasks | AI/ML, image processing, advanced IoT | General IoT, multimedia applications |
Price | Lower | Higher due to advanced features | Moderate |
VS ESP32-P4-dat
Feature | ESP32-C3 | ESP32-S3 | ESP32-WROVER | ESP32-P4 |
---|---|---|---|---|
Processor | Single-core RISC-V (160 MHz) | Dual-core Xtensa LX7 (240 MHz) | Dual-core Xtensa LX6 (240 MHz) | Dual-core RISC-V (up to 400 MHz) |
Architecture | RISC-V | Xtensa | Xtensa | RISC-V |
Performance | Moderate for basic IoT tasks | High-performance for AI/ML tasks | High-performance for general IoT | High-performance for HMI and AIoT applications |
Wi-Fi | 2.4 GHz (802.11b/g/n) | 2.4 GHz (802.11b/g/n) | 2.4 GHz (802.11b/g/n) | Not integrated |
Bluetooth | Bluetooth 5.0 (LE + Mesh) | Bluetooth 5.0 (LE + Mesh) | Bluetooth 4.2 (LE + Mesh) | Not integrated |
SRAM | 400 KB | 512 KB | 520 KB | 768 KB HP L2MEM, 32 KB LP SRAM |
Flash | Up to 4 MB embedded | External Flash support up to 16 MB | Up to 16 MB | External Flash support |
PSRAM Support | No | Yes | Yes (4 MB external PSRAM) | Yes (up to 32 MB) |
GPIO Pins | 22 | 45 | 34 | 55 |
USB Support | No native USB support | Native USB OTG | No | USB 2.0 |
Camera Interface | No | Yes | Yes (with external modules) | MIPI-CSI |
AI/ML Acceleration | Limited | Yes (vector instructions support) | No | AI instruction extensions |
LCD Interface | No | Yes (parallel RGB or SPI) | Yes (SPI-based LCD support) | MIPI-DSI |
I2S (Audio Support) | Yes | Yes | Yes | Yes |
Security | RSA, AES, SHA, HMAC | RSA, AES, SHA, HMAC, Digital Signature | RSA, AES, SHA, HMAC | Advanced security features |
Temperature Range | -40°C to 85°C | -40°C to 125°C | -40°C to 85°C | -40°C to 85°C |
Power Efficiency | Better for low-power needs | Higher power consumption when active | Moderate | Ultra-low-power modes available |
Deep Sleep Power | ~5 µA | ~10 µA | ~6 µA | Data not specified |
Wake-Up Sources | Timer, GPIO, ULP | Timer, GPIO, ULP, USB | Timer, GPIO, ULP | Timer, GPIO, LP-Core |
Peripheral Interfaces | SPI, I2C, I2S, UART, ADC | SPI, I2C, I2S, UART, ADC, CAN, Parallel | SPI, I2C, I2S, UART, ADC | SPI, I2C, I2S, UART, ADC, MIPI |
Clock Frequency | 160 MHz | 240 MHz | 240 MHz | 400 MHz |
Package Options | QFN28, QFN32 | QFN48, QFN68 | Module with built-in PSRAM | Data not specified |
Applications | Basic IoT, BLE tasks | AI/ML, image processing, advanced IoT | General IoT, multimedia applications | HMI, AIoT, edge computing |
Price | Lower | Higher due to advanced features | Moderate | Data not specified |
New Features of ESP32-P4:
- High-Performance Dual-Core RISC-V CPU: Operates up to 400 MHz, suitable for compute-intensive tasks.
- AI Instruction Extensions: Enhances AI and machine learning capabilities.
- Advanced Memory Subsystem: Includes 768 KB of HP L2MEM and 32 KB of LP SRAM, supporting large internal memory.
- Integrated High-Speed Peripherals: Supports USB 2.0, MIPI-CSI for camera input, and MIPI-DSI for display output, facilitating rich Human-Machine Interfaces.
- Low-Power Core (LP-Core): Operates up to 40 MHz, enabling ultra-low-power applications by allowing high-performance cores to remain dormant when not needed.
- Enhanced Security Features: Provides robust security mechanisms suitable for applications requiring strong protection.
- Extensive IO Connectivity: Offers 55 GPIOs, accommodating increased IO-connectivity demands.